Grounding, Bonding, and Shielding for Electronic Equipments and Facilities

Grounding, Bonding, and Shielding for Electronic Equipments and Facilities
Author: Department of Department of Defense
Publisher:
Total Pages: 396
Release: 2018-03-07
Genre:
ISBN: 9781986310178

MIL-HDBK-419A 29 DECEMBER 1987 Volume 2 of 2 Applications Unfortunately, few Military Handbooks address the need for defense against electromagnetic pulse (EMP) and cybersecurity. While EMP has been thought of as a remote possibility (who in his right mind is going to launch a nuclear weapon of any kind against the U.S.?) Advances in non-nuclear EMP, miniaturization of electronics and autonomous drones suddenly brings EMP into the role of the possible. No longer would an adversary need to risk retaliation when a drone from an unknown source attacks a vital facility. The information in this book is part of the solution to the question "How do we defend against EMP?" List of Applicable EMP and Cybersecurity Publications: MIL-STD-188-125-1 High-altitude electromagnetic pulse (HEMP) Protection For Ground-Based C4I Facilities Performing Critical, Time-Urgent Missions MIL-STD-188-124A Grounding, Bonding and Shielding for Common Long Haul/Tactical Communication Systems MIL-HDBK -1195 Radio Frequency Shielded Enclosures TOP 01-2-620 High-Altitude Electromagnetic Pulse (HEMP) Testing MIL-HDBK-1012/1 Electronic Facilities Engineering MIL-HDBK-1013/1A Design Guidelines for Physical Security of Facilities

Build Your Own Electronics Workshop

Build Your Own Electronics Workshop
Author: Thomas Petruzzellis
Publisher: McGraw Hill Professional
Total Pages: 448
Release: 2004-12-22
Genre: Technology & Engineering
ISBN: 0071709134

Whether electronics is a hobby or an avocation, this resource covers everything you need to know to create a personal electronic workbench. The author includes essential yet difficult to find information such as whether to buy or build test equipment, how to solder, how to make circuit boards, how to troubleshoot, how to test components and systems, and how to build your own test equipment. Building on a budget Sources for equipment

Waste Electrical and Electronic Equipment (WEEE) Handbook

Waste Electrical and Electronic Equipment (WEEE) Handbook
Author: Vannessa Goodship
Publisher: Woodhead Publishing
Total Pages: 740
Release: 2019-07-13
Genre: Technology & Engineering
ISBN: 0081021593

Waste Electrical and Electronic Equipment (WEEE) Handbook, Second Edition, is a one-stop reference on current electronic waste legislation initiatives, their impact, and the latest technological considerations for reducing electronic waste (e-waste) and increasing the efficiency of materials recovery. It also provides a wide-range of global and corporate examples and perspectives on the challenges that face specific regions and companies, along with the solutions they are implementing in managing e-waste, offering further insights on how discarded products can be treated. Sections introduce the reader to legislation and initiatives to manage WEEE and discuss technologies for the refurbishment, treatment and recycling of waste electronics. Further sections focus on electronic products that present particular challenges for recyclers, explore sustainable design of electronics and supply chains, discuss national and regional WEEE management schemes, and more. - Addresses the latest challenges and opportunities for electronic waste (e-waste) management, including e-waste collection models, circular economy implications, rare earth metal recovery, and much more - Draws lessons for waste electrical and electronic equipment (WEEE) policy and practice from around the world - Discusses legislation and initiatives to manage WEEE, including global e-waste initiatives, EU legislation relating to electronic waste, and eco-efficiency evaluation of WEEE take-back systems

Thermal Design of Electronic Equipment

Thermal Design of Electronic Equipment
Author: Ralph Remsburg
Publisher: CRC Press
Total Pages: 440
Release: 2017-12-19
Genre: Technology & Engineering
ISBN: 1351835912

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.