Thermal Stress Resistance of Materials

Thermal Stress Resistance of Materials
Author: Anatoly Lanin
Publisher: Springer Science & Business Media
Total Pages: 246
Release: 2008-02-23
Genre: Technology & Engineering
ISBN: 3540714006

This brilliant treatise is based on extensive experimental and technological data derived from high-temperature materials development processes. The distinguished authors analyse results from the development of nuclear reactors and aerospace rocket engines. They apply this data to the problem of bearing capacity and the fracture of thermally loaded bodies. They establish new regularities of fracture at various modes of local and combined thermal loading.

Theory of Thermal Stresses

Theory of Thermal Stresses
Author: Bruno A. Boley
Publisher: Courier Corporation
Total Pages: 610
Release: 2012-05-23
Genre: Technology & Engineering
ISBN: 0486143864

Highly regarded text presents detailed discussion of fundamental aspects of theory, background, problems with detailed solutions. Basics of thermoelasticity, heat transfer theory, thermal stress analysis, more. 1985 edition.

Applications and Techniques for Experimental Stress Analysis

Applications and Techniques for Experimental Stress Analysis
Author: Karuppasamy, Karthik Selva Kumar
Publisher: IGI Global
Total Pages: 269
Release: 2019-12-27
Genre: Technology & Engineering
ISBN: 1799816915

The design of mechanical components for various engineering applications requires the understanding of stress distribution in the materials. The need of determining the nature of stress distribution on the components can be achieved with experimental techniques. Applications and Techniques for Experimental Stress Analysis is a timely research publication that examines how experimental stress analysis supports the development and validation of analytical and numerical models, the progress of phenomenological concepts, the measurement and control of system parameters under working conditions, and identification of sources of failure or malfunction. Highlighting a range of topics such as deformation, strain measurement, and element analysis, this book is essential for mechanical engineers, civil engineers, designers, aerospace engineers, researchers, industry professionals, academicians, and students.

Encyclopedia of Thermal Stresses

Encyclopedia of Thermal Stresses
Author: Richard B. Hetnarski
Publisher: Springer
Total Pages: 0
Release: 2013-12-04
Genre: Science
ISBN: 9789400727380

The Encyclopedia of Thermal Stresses is an important interdisciplinary reference work. In addition to topics on thermal stresses, it contains entries on related topics, such as the theory of elasticity, heat conduction, thermodynamics, appropriate topics on applied mathematics, and topics on numerical methods. The Encyclopedia is aimed at undergraduate and graduate students, researchers and engineers. It brings together well established knowledge and recently received results. All entries were prepared by leading experts from all over the world, and are presented in an easily accessible format. The work is lavishly illustrated, examples and applications are given where appropriate, ideas for further development abound, and the work will challenge many students and researchers to pursue new results of their own. This work can also serve as a one-stop resource for all who need succinct, concise, reliable and up to date information in short encyclopedic entries, while the extensive references will be of interest to those who need further information. For the coming decade, this is likely to remain the most extensive and authoritative work on Thermal Stresses.

Thermal Shock and Thermal Fatigue Behavior of Advanced Ceramics

Thermal Shock and Thermal Fatigue Behavior of Advanced Ceramics
Author: Gerold A. Schneider
Publisher: Springer Science & Business Media
Total Pages: 575
Release: 2013-03-09
Genre: Technology & Engineering
ISBN: 9401582009

Recent developments in advanced ceramics are critically evaluated in respect to their thermal shock and thermal fatigue behavior from an interdisciplinary viewpoint by leading experts. The book covers the aspects of material development, mechanical and fracture mechanical models and experimental testing methods. Special emphasis is given to the influence of a rising crack resistance on the thermal shock behavior, novel irradiation testing methods for a quantitative characterization of the thermal shock and fatigue loading as well as detailed fracture mechanical models for single and multiple crack propagation. This book summarizes developments of the last decade concerning the thermal shock and thermal fatigue behavior of advanced ceramics. The scientific articles of the book were carefully arranged in order to achieve a textbook-like form which will be of great value to researchers and students. (ABSTRACT) This book summarizes developments of the last decade concerning the thermal shock and thermal fatigue behavior of advanced ceramics. The book covers the aspects of material development, mechanical and fracture mechanical models and testing methods. The scientific articles were carefully arranged in order to achieve a textbook-like form which will be of great value to researchers and students.

Thermal Stress and Strain in Microelectronics Packaging

Thermal Stress and Strain in Microelectronics Packaging
Author: John Lau
Publisher: Springer Science & Business Media
Total Pages: 904
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1468477676

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

Materials for Tribology

Materials for Tribology
Author: William Glaeser
Publisher: Elsevier
Total Pages: 275
Release: 1992-05-07
Genre: Technology & Engineering
ISBN: 008087584X

This handbook provides an extensive reference source on the materials used in tribological applications. Materials used in tribological applications are, for the most part, common materials used for general engineering applications. Many conventional engineering materials have been adapted to tribological uses and examples of these are given throughout the text. Literature that so far has been scattered and difficult to retrieve is now presented for the first time in this comprehensive treatise. The author has used his expertise in selecting materials for a wide variety of friction and wear applications to develop this data base on materials for tribology. In addition information has been selected from the literature on the behaviour of these materials in bearings, seals, gears, brakes, clutches, wire rope, valves, cams and wear surfaces and is included in the descriptive text. The materials have been grouped in families, relating to their composition. A short table is provided at the beginning of each chapter, listing the ranges of selected properties for the materials under discussion. In addition there are short summaries of the tribological applications this class of materials is used for. On the first page of each chapter one can find a guide for the selection of materials. Sufficient references to the literature are given to enable the reader to follow up in more detail the various topics discussed.

Ceramics

Ceramics
Author: Dietrich Munz
Publisher: Springer Science & Business Media
Total Pages: 302
Release: 2013-03-07
Genre: Technology & Engineering
ISBN: 3642584071

The book gives a description of the failure phenomena of ceramic materials under mechanical loading, the methods to determine their properties, and the principles for material selection. The book presents fracture mechanical and statistical principles and their application to describe the scatter of strength and lifetime, while special chapters are devoted to creep behaviour, multiaxial failure criteria and thermal shock behaviour. XXXXXXX Neuer Text Describing how ceramic materials fracture and fail under mechanical loading, this book provides methods for determining the properties of ceramics, and gives criteria for selecting ceramic materials for particular applications. It also examines the fracture-mechanical and statistical principles and their use in understanding the strength and durability of ceramics. Special chapters are devoted to creep behavior, criteria for multiaxial failure, and behavior under thermal shock. Readers will gain insight into the design of reliable ceramic components.

Fracture Mechanics of Ceramics

Fracture Mechanics of Ceramics
Author: R.C. Bradt
Publisher: Springer Science & Business Media
Total Pages: 518
Release: 2013-03-09
Genre: Technology & Engineering
ISBN: 1475740190

This Volume 13 of the Fracture Mechanics of Ceramics series constitutes the th Proceedings of the 7 International Symposium on the fracture mechanics of ceramics held at the Presidium of the Russian Academy of Sciences, Moscow, Russia on July 20 to 22, 1999. The series started from the Proceedings of the 1 st Symposium at the Pennsylvania State University that has been held on 1973 (Vols. 1 and 2), followed by 1977 and 1981 Years meetings (Vols. 3 to 6) which were held at the Pennsylvania State University, too. Volumes 7 and 8 are from the 1985 Symposium which was held at the Virginia Polytechnic Institute and State University, Volumes 9 and 10 are from the 1991 Symposium at Japan Fine Ceramic Centre, Nagoya, and Volumes 11 and 12 are from the 1995 Symposium at Kernforschungszentrum, Karlsruhe. The theme of the Symposium was focused on the mechanical behaviour of advanced ceramics in terms of the cracks, particularly the crack-microstructure interaction, delayed failure, environmental effects in fracture. Special attention was paid on the novel methods in fracture mechanics testing, pre-standardisation and standartisation. The authors from 19 countries represented the current state of that field. The International Scientific Committee gratefully acknowledge the sponsoring provided by The Russian Academy of Sciences and, personally, Academician Yu.S.Osipov, President of RAS; The Ministry of Science and Technologies of the Russian Federation, Prof. G.Terestchenko; Russian Foundation for Basic Research, Academician I.Moiseev; Scientific Technical Center "Bacor", Dr. B.Krasnij; Gzhel Ltd., Prof.

Thermal Expansion 7

Thermal Expansion 7
Author: David C. Larsen
Publisher: Springer Science & Business Media
Total Pages: 211
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 146848267X