Thermal Management Handbook For Electronic Assemblies
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| Author | : Jerry E. Sergent |
| Publisher | : McGraw Hill Professional |
| Total Pages | : 370 |
| Release | : 1998 |
| Genre | : Science |
| ISBN | : 9780070266995 |
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
| Author | : Advanced Thermal Solutions |
| Publisher | : Advanced Thermal Solutions |
| Total Pages | : 204 |
| Release | : 2009 |
| Genre | : Science |
| ISBN | : 098462791X |
The complete editorial contents of Qpedia Thermal eMagazine, Volume 3, Issues 1 - 12 features in-depth, technical articles covering the most critical areas of electronics cooling.
| Author | : Ralph Remsburg |
| Publisher | : CRC Press |
| Total Pages | : 440 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1351835912 |
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
| Author | : Advanced Thermal Solutions |
| Publisher | : Advanced Thermal Solutions |
| Total Pages | : 206 |
| Release | : 2008 |
| Genre | : Science |
| ISBN | : 0984627901 |
The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
| Author | : Charles A. Harper |
| Publisher | : McGraw Hill Professional |
| Total Pages | : 808 |
| Release | : 1997 |
| Genre | : Technology & Engineering |
| ISBN | : 9780070266988 |
The Definitive Technical Resource on Passive Components! Here's the fully updated and revised edition of the most comprehensive standard reference on electronic components--and the first such revision in over 15 years! It gives electronics engineers, designers, and technicians quick, reliable one-volume access to critical characteristic data, performance curves, and design guidelines. The full range of component technologies is covered, including resistors, capacitors, transformers, relays and switches, batteries, fuse and protective components, filters and transient voltage protection devices, wiring and cabling, connectors, and enabling devices. More than a mere rehashing of manufacturer specs, this unique handbook provides working electronics professionals and mechanical engineers with the practical data they need to more effectively select optimal components for their intended functional performance in virtually any electronics system. Along with its companion volume, the Active Electronic Component Handbook, this resource belongs on every designer's bookshelf.
| Author | : |
| Publisher | : ASM International |
| Total Pages | : 1234 |
| Release | : 1989-11-01 |
| Genre | : Technology & Engineering |
| ISBN | : 9780871702852 |
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
| Author | : Xiaobing Luo |
| Publisher | : John Wiley & Sons |
| Total Pages | : 373 |
| Release | : 2024-05-29 |
| Genre | : Technology & Engineering |
| ISBN | : 1119179297 |
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
| Author | : Paul D. Franzon |
| Publisher | : John Wiley & Sons |
| Total Pages | : 655 |
| Release | : 2019-01-25 |
| Genre | : Technology & Engineering |
| ISBN | : 3527697063 |
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
| Author | : Fethi Aloui |
| Publisher | : Elsevier |
| Total Pages | : 862 |
| Release | : 2023-08-24 |
| Genre | : Science |
| ISBN | : 0443190186 |
Handbook of Thermal Management Systems: e-Mobility and Other Energy Applications is a comprehensive reference on the thermal management of key renewable energy sources and other electronic components. With an emphasis on practical applications, the book addresses thermal management systems of batteries, fuel cells, solar panels, electric motors, as well as a range of other electronic devices that are crucial for the development of sustainable transport systems. Chapters provide a basic understanding of the thermodynamics behind the development of a thermal management system, update on Batteries, Fuel Cells, Solar Panels, and Other Electronics, provide a detailed description of components, and discuss fundamentals. Dedicated chapters then systematically examine the heating, cooling, and phase changes of each system, supported by numerical analyses, simulations and experimental data. These chapters include discussion of the latest technologies and methods and practical guidance on their application in real-world system-level projects, as well as case studies from engineering systems that are currently in operation. Finally, next-generation technologies and methods are discussed and considered. - Presents a comprehensive overview of thermal management systems for modern electronic technologies related to energy production, storage and sustainable transportation - Addresses the main bottlenecks in the technology development for future green and sustainable transportation systems - Focuses on the practical aspects and implementation of thermal management systems through industrial case studies, real-world examples, and solutions to key problems
| Author | : Adrian Bejan |
| Publisher | : John Wiley & Sons |
| Total Pages | : 1496 |
| Release | : 2003-06-30 |
| Genre | : Technology & Engineering |
| ISBN | : 0471390151 |
Chapters contributed by thirty world-renown experts. * Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values.
