The Engineering Of Microelectronic Thin And Thick Films
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Author | : Tapan Gupta |
Publisher | : Wiley-Interscience |
Total Pages | : 432 |
Release | : 2003-04-17 |
Genre | : Technology & Engineering |
ISBN | : |
This is the first handbook on the fabrication and design of hybrid microelectronic circuits. * Deals with all aspects of the technology, design, layout and processing of materials. * Fills the need for a comprehensive survey of a widely-used technology.
Author | : Mikhail Baklanov |
Publisher | : John Wiley & Sons |
Total Pages | : 508 |
Release | : 2007-04-04 |
Genre | : Technology & Engineering |
ISBN | : 0470065419 |
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Author | : Charles Eric Jowett |
Publisher | : |
Total Pages | : 192 |
Release | : 1976 |
Genre | : Technology & Engineering |
ISBN | : |
Author | : Lawrence Kazmerski |
Publisher | : Elsevier |
Total Pages | : 321 |
Release | : 2012-12-02 |
Genre | : Technology & Engineering |
ISBN | : 0323156045 |
Polycrystalline and Amorphous Thin Films and Devices is a compilation of papers that discusses the electronic, optical, and physical properties of thin material layers and films. This compilation reviews the different applications of thin films of various materials used as protective and optical coatings, thermal transfer layers, and selective membranes from submicron- area VLSI memory units to large-area energy conservation devices. Some papers discuss the basic properties, such as growth, structure, electrical, and optical mechanisms that are encountered in amorphous and polycrystalline thin semiconductor films. For example, experiments on electronic structure of dislocations have led to a model for the intrinsic properties of grain boundaries in polycrystalline semiconductor thin films that can have an impact on the designs of high-efficiency, thin-film solar cells. Other papers review the problems encountered in these thin layers in active semiconductor devices and passive technologies. Techniques in film growth and control variables of source, substrate temperature, and substrate properties will determine the successful performance of the devices installed with these thin film layers. This compilation can prove valuable for chemists, materials engineers, industrial technologists, and researchers in thin-film technology.
Author | : Leon I. Maissel |
Publisher | : CRC Press |
Total Pages | : 314 |
Release | : 1973 |
Genre | : Science |
ISBN | : 9780677028408 |
Author | : Milton Ohring |
Publisher | : Academic Press |
Total Pages | : 744 |
Release | : 1992 |
Genre | : Science |
ISBN | : 9780125249904 |
Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.
Author | : Kasturi Chopra |
Publisher | : Springer Science & Business Media |
Total Pages | : 305 |
Release | : 2012-12-06 |
Genre | : Science |
ISBN | : 1461336821 |
Two-dimensional materials created ab initio by the process of condensation of atoms, molecules, or ions, called thin films, have unique properties significantly different from the corresponding bulk materials as a result of their physical dimensions, geometry, nonequilibrium microstructure, and metallurgy. Further, these characteristic features of thin films can be drasti cally modified and tailored to obtain the desired and required physical characteristics. These features form the basis of development of a host of extraordinary active and passive thin film device applications in the last two decades. On the one extreme, these applications are in the submicron dimensions in such areas as very large scale integration (VLSI), Josephson junction quantum interference devices, magnetic bubbles, and integrated optics. On the other extreme, large-area thin films are being used as selective coatings for solar thermal conversion, solar cells for photovoltaic conver sion, and protection and passivating layers. Indeed, one would be hard pressed to find many sophisticated modern optical and electronic devices which do not use thin films in one way or the other. With the impetus provided by industrial applications, the science and technology of thin films have undergone revolutionary development and even today continue to be recognized globally as frontier areas of RID work. Major technical developments in any field of science and technology are invariably accompanied by an explosion of published literature in the form of scientific publications, reviews, and books.
Author | : King-Ning Tu |
Publisher | : Cambridge University Press |
Total Pages | : 413 |
Release | : 2010-11-25 |
Genre | : Technology & Engineering |
ISBN | : 1139492705 |
Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.
Author | : Library of Congress. Office for Subject Cataloging Policy |
Publisher | : |
Total Pages | : 1644 |
Release | : 1990 |
Genre | : Subject headings, Library of Congress |
ISBN | : |
Author | : Library of Congress |
Publisher | : |
Total Pages | : 1038 |
Release | : 1977 |
Genre | : Catalogs, Subject |
ISBN | : |