The reputation of phenol formaldehyde (PF) resins as strong, durable, and reliable wood adhesives has led to their use in plywood manufacture. The demands for increased panel production volumes and cost efficiency has revealed some curing and application limitations in certain PF formulations. Preliminary experiments have established that filler free adhesives for bonding higher moisture content veneers can be formed with mixtures of insoluble phenolic dispersions with soluble phenolic resin. This project used this technology to formulate a PF system combining high and low molecular weight components which are suitable for bonding veneer of between 8-10 percent moisture content; develop procedures for preparing and applying large scale quantities of these adhesives; and conduct a limited number of mill trials with these formulations.