The Data Base: Copper
Author | : United States. Office of Energy Conservation and Environment. Office of Industrial Programs |
Publisher | : |
Total Pages | : 132 |
Release | : 1975 |
Genre | : Aluminum industry and trade |
ISBN | : |
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Author | : United States. Office of Energy Conservation and Environment. Office of Industrial Programs |
Publisher | : |
Total Pages | : 132 |
Release | : 1975 |
Genre | : Aluminum industry and trade |
ISBN | : |
Author | : United States. Office of Energy Conservation and Environment. Office of Industrial Programs |
Publisher | : |
Total Pages | : 0 |
Release | : 1975 |
Genre | : Aluminum industry and trade |
ISBN | : |
Author | : Geological Survey (U.S.). Office of the Data Base Administrator |
Publisher | : |
Total Pages | : 184 |
Release | : 1980 |
Genre | : Earth sciences |
ISBN | : |
Author | : United States. General Accounting Office |
Publisher | : |
Total Pages | : 46 |
Release | : 1978 |
Genre | : CRIB (Information retrieval system) |
ISBN | : |
Author | : Myer Kutz |
Publisher | : John Wiley & Sons |
Total Pages | : 1524 |
Release | : 2002-07-22 |
Genre | : Technology & Engineering |
ISBN | : 9780471359241 |
Erstmals in einem Band werden Werkstoffe hier (in zwei getrennten Systemen) sowohl nach ihrer technischen Anwendung als auch nach ihren Eigenschaften geordnet. - Benutzer können deshalb zunächst nach der Gruppe von Materialen suchen, die für eine spezielle Anwendung geeignet sind, und anschließend Details über jedes einzelne Material finden - Suchkriterien sind Eigenschaften wie Wärmeleitfähigkeit, optisches Reflexionsvermögen, Elastizität usw. und Anwendungsgebiete wie Bauwesen, Biomedizin, Fahrzeugbau, Luftfahrttechnik, Elektrotechnik usw. - berücksichtigt werden sowohl herkömmliche Werkstoffe (Eisen- und Nichteisenmetalle, Kunststoffe, Klebstoffe) als auch Kompositwerkstoffe und synthetische Materialen wie Laminate, Fasern und Keramiken
Author | : R. K. Nanstad |
Publisher | : ASTM International |
Total Pages | : 1135 |
Release | : 1999 |
Genre | : Materials |
ISBN | : 080312614X |
Author | : K. Subramanian |
Publisher | : John Wiley & Sons |
Total Pages | : 510 |
Release | : 2012-03-06 |
Genre | : Technology & Engineering |
ISBN | : 1119966809 |
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.