ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Author: ASM International
Publisher: ASM International
Total Pages: 540
Release: 2019-12-01
Genre: Technology & Engineering
ISBN: 1627082735

The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

Metrology and Diagnostic Techniques for Nanoelectronics

Metrology and Diagnostic Techniques for Nanoelectronics
Author: Zhiyong Ma
Publisher: CRC Press
Total Pages: 889
Release: 2017-03-27
Genre: Science
ISBN: 135173394X

Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.

Nanoelectromechanical Systems

Nanoelectromechanical Systems
Author: Laurent Duraffourg
Publisher: John Wiley & Sons
Total Pages: 212
Release: 2015-06-02
Genre: Technology & Engineering
ISBN: 1119177995

This book will present the theoretical and technological elements of nanosystems. Among the different topics discussed, the authors include the electromechanical properties of NEMS, the scaling effects that give these their interesting properties for different applications and the current manufacturing processes. The authors aim to provide useful tools for future readers and will provide an accurate picture of current and future research in the field.

Advanced Interconnects for ULSI Technology

Advanced Interconnects for ULSI Technology
Author: Mikhail Baklanov
Publisher: John Wiley & Sons
Total Pages: 616
Release: 2012-02-17
Genre: Technology & Engineering
ISBN: 1119966868

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Photomodulated Optical Reflectance

Photomodulated Optical Reflectance
Author: Janusz Bogdanowicz
Publisher: Springer Science & Business Media
Total Pages: 217
Release: 2012-06-26
Genre: Technology & Engineering
ISBN: 3642301088

One of the critical issues in semiconductor technology is the precise electrical characterization of ultra-shallow junctions. Among the plethora of measurement techniques, the optical reflectance approach developed in this work is the sole concept that does not require physical contact, making it suitable for non-invasive in-line metrology. This work develops extensively all the fundamental physical models of the photomodulated optical reflectance technique and introduces novel approaches that extend its applicability from dose monitoring towards detailed carrier profile reconstruction. It represents a significant breakthrough in junction metrology with potential for industrial implementation.

Silicon Non-Volatile Memories

Silicon Non-Volatile Memories
Author: Barbara de Salvo
Publisher: John Wiley & Sons
Total Pages: 222
Release: 2013-05-10
Genre: Technology & Engineering
ISBN: 1118617800

Semiconductor flash memory is an indispensable component of modern electronic systems which has gained a strategic position in recent decades due to the progressive shift from computing to consumer (and particularly mobile) products as revenue drivers for Integrated Circuits (IC) companies. This book provides a comprehensive overview of the different technological approaches currently being studied to fulfill future memory requirements. Two main research paths are identified and discussed. Different "evolutionary paths" based on the use of new materials (such as silicon nanocrystals for storage nodes and high-k insulators for active dielectrics) and of new transistor structures (such as multi-gate devices) are investigated in order to extend classical floating gate technology to the 32 nm node. "Disruptive paths" based on new storage mechanisms or new technologies (such as phase-change devices, polymer or molecular cross-bar memories) are also covered in order to address 22 nm and smaller IC generations. Finally, the main factors at the origin of these phenomena are identified and analyzed, providing pointers on future research activities and developments in this area.

ISTFA 2013

ISTFA 2013
Author: A. S. M. International
Publisher: ASM International
Total Pages: 634
Release: 2013-01-01
Genre: Technology & Engineering
ISBN: 1627080228

This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.

Advanced Driver Assistance Systems and Autonomous Vehicles

Advanced Driver Assistance Systems and Autonomous Vehicles
Author: Yan Li
Publisher: Springer Nature
Total Pages: 628
Release: 2022-10-28
Genre: Technology & Engineering
ISBN: 9811950539

This book provides a comprehensive reference for both academia and industry on the fundamentals, technology details, and applications of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, an emerging and rapidly growing area. The book written by experts covers the most recent research results and industry progress in the following areas: ADAS system design and test methodologies, advanced materials, modern automotive technologies, artificial intelligence, reliability concerns, and failure analysis in ADAS. Numerous images, tables, and didactic schematics are included throughout. This essential book equips readers with an in-depth understanding of all aspects of ADAS, providing insights into key areas for future research and development. • Provides comprehensive coverage of the state-of-the-art in ADAS • Covers advanced materials, deep learning, quality and reliability concerns, and fault isolation and failure analysis • Discusses ADAS system design and test methodologies, novel automotive technologies • Features contributions from both academic and industry authors, for a complete view of this important technology

Analytical Techniques for Semiconductor Materials and Process Characterization 6 (ALTECH 2009)

Analytical Techniques for Semiconductor Materials and Process Characterization 6 (ALTECH 2009)
Author: Bernd O. Kolbesen
Publisher: The Electrochemical Society
Total Pages: 479
Release: 2009-09
Genre: Semiconductors
ISBN: 1566777402

The proceedings of ALTECH 2009 address recent developments and applications of analytical techniques for semiconductor materials, processes and devices. The papers comprise techniques of elemental and structural analysis for bulk and surface impurities and defects, thin films as well as dopants in ultra-shallow junctions.

Developments in Surface Contamination and Cleaning, Volume 12

Developments in Surface Contamination and Cleaning, Volume 12
Author: Rajiv Kohli
Publisher: Elsevier
Total Pages: 278
Release: 2019-06-08
Genre: Technology & Engineering
ISBN: 0128162953

Developments in Surface Contamination and Cleaning: Methods for Assessment and Verification of Cleanliness of Surfaces and Characterization of Surface Contaminants, Volume Twelve, the latest release in the Developments in Surface Contamination and Cleaning series, provides best practices on determining surface cleanliness. Chapters include an introduction to the nature and size of particles, a discussion of cleanliness levels, detailed coverage of measurement methods, characterization methods and analytical methods for evaluating surfaces, and an overview of analysis methods for various contaminants. As a whole, the series creates a unique and comprehensive knowledge base for those in research and development in a variety of industries. Manufacturing, quality control and procurement specification professionals in the aerospace, automotive, biomedical, defense, energy, manufacturing, microelectronics, optics and xerography industries will find this book to be very helpful. In addition, researchers in an academic setting will also find these volumes excellent source books. - Includes an extensive listing, with a description of available methods for the assessment of surface cleanliness - Provides a single source of information on methods for verification of surface cleanliness - Serves as a guide to the selection, assessment and verification of methods for specific applications