Soldering In Electronics Assembly 2nd Edition
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| Author | : MIKE JUDD |
| Publisher | : Elsevier |
| Total Pages | : 385 |
| Release | : 1999-03-26 |
| Genre | : Technology & Engineering |
| ISBN | : 008051734X |
Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment
| Author | : Ning-Cheng Lee |
| Publisher | : Newnes |
| Total Pages | : 282 |
| Release | : 2002-01-11 |
| Genre | : Technology & Engineering |
| ISBN | : 0750672188 |
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
| Author | : Mike Judd |
| Publisher | : Elsevier |
| Total Pages | : 301 |
| Release | : 2013-09-24 |
| Genre | : Technology & Engineering |
| ISBN | : 1483102173 |
Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assemblies.
| Author | : Ian Sinclair |
| Publisher | : Newnes |
| Total Pages | : 370 |
| Release | : 2011-04-13 |
| Genre | : Technology & Engineering |
| ISBN | : 0080971113 |
Electronics Simplified, Third Edition, discusses the aims and methods of electronics, with emphasis on digital electronics and software options. It covers the latest developments in electronics, including Blu-ray, digital TV and radio, HD and 3D TV, robotic systems, radar, cellular phones, GPS, and microcomputers. Organized into 17 chapters, the book introduces the reader to every aspect of electronics from fundamentals to applications, with minimal mathematics required. It provides an overview of electricity, waves, and pulses and how a steady voltage is generated, along with power, alternating voltage, and AC and DC transmission. The information on microcomputers has been greatly expanded, while information on analog fundamentals has been retained. It also discusses passive components such as transformers, resistors and capacitors, inductors, transformers, resonance, and diodes; active components and integrated circuits, particularly what a transistor is and what it does; how traditional radio works; elements of television, including color television; digital television and radio broadcasting; and digital signals and digital recording. Finally, the principles of CD recording are explained, along with the basics of microprocessors, calculators, computers, and computer peripherals. This book is essential reading for hobbyists, technicians, professionals, and students. It is suitable for anyone taking a qualification course in electronics, or for those who want to know more about the digital revolution. - Explains electronics from fundamentals to applications – No other book has such breadth of coverage - Approachable, clear writing style, with minimal math – No previous knowledge of electronics required! - Now fully revised and updated to include coverage of the latest developments in electronics: Blu-ray, HD, 3-D TV, digital TV and radio, miniature computers, robotic systems and more
| Author | : Rajan Ambat |
| Publisher | : Woodhead Publishing |
| Total Pages | : 399 |
| Release | : 2021-11-30 |
| Genre | : Technology & Engineering |
| ISBN | : 0323908543 |
Humidity and Electronics: Corrosion Reliability Issues and Preventive Measures provides comprehensive information on humidity related corrosion reliability issues surrounding electronics and how to tackle potential issues from a pro-active-design-prevention perspective. The book contains a mix of academic and industrial relevance, making it suitable for a detailed understanding on humidity issues on electronics, both for materials and corrosion experts and electronics and electrical experts. It will be useful for researchers, academics, and industrial personals involved in materials, corrosion, and electronics reliability aspects. - Provides basic and applied knowledge surrounding corrosion in electronics - Combines electronics/electrical and electrochemical aspects related to failure modes and mechanisms - Presents knowledge on influencing factors and how they can be used as preventive measures at the material, component, device and system level
| Author | : RUDOLF STRAUSS |
| Publisher | : Elsevier |
| Total Pages | : 389 |
| Release | : 1998-02-24 |
| Genre | : Technology & Engineering |
| ISBN | : 0080480977 |
Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. - Written by founding father of SMT technology - Standard specifications have been fully updated - New chapter covering Ball Grid Array (BGA) technology
| Author | : Howard H. Manko |
| Publisher | : McGraw-Hill Companies |
| Total Pages | : 376 |
| Release | : 1979 |
| Genre | : Technology & Engineering |
| ISBN | : |
Get the latest developments in solder technology You can't work in electronics without solder -- and you shouldn't work with solder without Solders and Soldering, Fourth Edition. Profusely illustrated, this book by the world's top solder educator has been the leader in its field for two decades. You'll learn 29 different methods for soldering and heating (for both automatic and manual procedures), and learn about the strengths and weaknesses of each method for varying applications. This up-to-date edition deals at length with modern cleaning materials and processes, emphasizing EPA and OSHA guidelines and regulations, and provides you with state-of-the-art techniques for soldering with miniaturized circuit boards.
| Author | : Mordechay Schlesinger |
| Publisher | : John Wiley & Sons |
| Total Pages | : 755 |
| Release | : 2014-12-22 |
| Genre | : Science |
| ISBN | : 0470167785 |
The definitive resource for electroplating, now completely up to date With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes: Easily accessible, self-contained contributions by over thirty experts Five completely new chapters and hundreds of additional pages A cutting-edge look at applications in nanoelectronics Coverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM) An important discussion of the physical properties of metal thin films Chapters devoted to methods, tools, control, and environmental issues And much more A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries.
| Author | : Geoffrey Boothroyd |
| Publisher | : CRC Press |
| Total Pages | : 738 |
| Release | : 2002 |
| Genre | : Business & Economics |
| ISBN | : |
Containing more than 300 equations and the extensive data, necessary to estimate manufacturing and assembly cost during product design, benchmarking, and should cost analysis, this textbook gives students modern and effective tools for analysing injection moulding, sheet metalworking, die casting, powder metal processing costs, sand and investment casting, and hot forging. It includes discussions of the influence of the application of design for manufacture and assembly, material selection and economic ranking of processes, the effect of reduced assembly difficulties on product quality, the links between computer-aided design solid models and design analysis tools, and more.
| Author | : Y.C. Lee |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 270 |
| Release | : 2012-12-06 |
| Genre | : Science |
| ISBN | : 1461558034 |
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
