Sispad 2017
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Author | : Yao-Feng Chang |
Publisher | : BoD – Books on Demand |
Total Pages | : 180 |
Release | : 2021-11-17 |
Genre | : Technology & Engineering |
ISBN | : 1839689560 |
This book provides a platform for interdisciplinary research into unconventional computing with emerging physical substrates. With a focus on memristor devices, the chapter authors discuss a wide range of topics, including memristor theory, mathematical modelling, circuit theory, memristor-mate, memristor security, artificial intelligence, and much more.
Author | : Martijn van Beurden |
Publisher | : Springer Nature |
Total Pages | : 305 |
Release | : 2022-03-11 |
Genre | : Mathematics |
ISBN | : 303084238X |
The conference has an interdisciplinary focus and aims to bring together scientists – mathematicians, electrical engineers, computer scientists, and physicists, from universities and industry – to have in-depth discussions of the latest scientific results in Computational Science and Engineering relevant to Electrical Engineering and to stimulate and inspire active participation of young researchers.
Author | : J. Murota |
Publisher | : The Electrochemical Society |
Total Pages | : 325 |
Release | : |
Genre | : |
ISBN | : 1607688212 |
Author | : Felipe Rocha da Rosa |
Publisher | : Springer Nature |
Total Pages | : 142 |
Release | : 2020-11-02 |
Genre | : Technology & Engineering |
ISBN | : 3030557049 |
This book describes the benefits and drawbacks inherent in the use of virtual platforms (VPs) to perform fast and early soft error assessment of multicore systems. The authors show that VPs provide engineers with appropriate means to investigate new and more efficient fault injection and mitigation techniques. Coverage also includes the use of machine learning techniques (e.g., linear regression) to speed-up the soft error evaluation process by pinpointing parameters (e.g., architectural) with the most substantial impact on the software stack dependability. This book provides valuable information and insight through more than 3 million individual scenarios and 2 million simulation-hours. Further, this book explores machine learning techniques usage to navigate large fault injection datasets.
Author | : Sabina Spiga |
Publisher | : Woodhead Publishing |
Total Pages | : 569 |
Release | : 2020-06-12 |
Genre | : Technology & Engineering |
ISBN | : 0081027877 |
Memristive Devices for Brain-Inspired Computing: From Materials, Devices, and Circuits to Applications—Computational Memory, Deep Learning, and Spiking Neural Networks reviews the latest in material and devices engineering for optimizing memristive devices beyond storage applications and toward brain-inspired computing. The book provides readers with an understanding of four key concepts, including materials and device aspects with a view of current materials systems and their remaining barriers, algorithmic aspects comprising basic concepts of neuroscience as well as various computing concepts, the circuits and architectures implementing those algorithms based on memristive technologies, and target applications, including brain-inspired computing, computational memory, and deep learning. This comprehensive book is suitable for an interdisciplinary audience, including materials scientists, physicists, electrical engineers, and computer scientists. - Provides readers an overview of four key concepts in this emerging research topic including materials and device aspects, algorithmic aspects, circuits and architectures and target applications - Covers a broad range of applications, including brain-inspired computing, computational memory, deep learning and spiking neural networks - Includes perspectives from a wide range of disciplines, including materials science, electrical engineering and computing, providing a unique interdisciplinary look at the field
Author | : Yoshio Nishi |
Publisher | : Woodhead Publishing |
Total Pages | : 664 |
Release | : 2019-06-15 |
Genre | : Technology & Engineering |
ISBN | : 0081025858 |
Advances in Nonvolatile Memory and Storage Technology, Second Edition, addresses recent developments in the non-volatile memory spectrum, from fundamental understanding, to technological aspects. The book provides up-to-date information on the current memory technologies as related by leading experts in both academia and industry. To reflect the rapidly changing field, many new chapters have been included to feature the latest in RRAM technology, STT-RAM, memristors and more. The new edition describes the emerging technologies including oxide-based ferroelectric memories, MRAM technologies, and 3D memory. Finally, to further widen the discussion on the applications space, neuromorphic computing aspects have been included. This book is a key resource for postgraduate students and academic researchers in physics, materials science and electrical engineering. In addition, it will be a valuable tool for research and development managers concerned with electronics, semiconductors, nanotechnology, solid-state memories, magnetic materials, organic materials and portable electronic devices. - Discusses emerging devices and research trends, such as neuromorphic computing and oxide-based ferroelectric memories - Provides an overview on developing nonvolatile memory and storage technologies and explores their strengths and weaknesses - Examines improvements to flash technology, charge trapping and resistive random access memory
Author | : Sorin Cristoloveanu |
Publisher | : Elsevier |
Total Pages | : 386 |
Release | : 2021-08-04 |
Genre | : Technology & Engineering |
ISBN | : 0128231653 |
Fully Depleted Silicon-On-Insulator provides an in-depth presentation of the fundamental and pragmatic concepts of this increasingly important technology. There are two main technologies in the marketplace of advanced CMOS circuits: FinFETs and fully depleted silicon-on-insulators (FD-SOI). The latter is unchallenged in the field of low-power, high-frequency, and Internet-of-Things (IOT) circuits. The topic is very timely at research and development levels. Compared to existing books on SOI materials and devices, this book covers exhaustively the FD-SOI domain. Fully Depleted Silicon-On-Insulator is based on the expertise of one of the most eminent individuals in the community, Dr. Sorin Cristoloveanu, an IEEE Andrew Grove 2017 award recipient "For contributions to silicon-on-insulator technology and thin body devices." In the book, he shares key insights on the technological aspects, operation mechanisms, characterization techniques, and most promising emerging applications. Early praise for Fully Depleted Silicon-On-Insulator "It is an excellent written guide for everyone who would like to study SOI deeply, specially focusing on FD-SOI." --Dr. Katsu Izumi, Formerly at NTT Laboratories and then at Osaka Prefecture University, Japan "FDSOI technology is poised to catch an increasingly large portion of the semiconductor market. This book fits perfectly in this new paradigm [...] It covers many SOI topics which have never been described in a book before." --Professor Jean-Pierre Colinge, Formerly at TSMC and then at CEA-LETI, Grenoble, France "This book, written by one of the true experts and pioneers in the silicon-on-insulator field, is extremely timely because of the growing footprint of FD-SOI in modern silicon technology, especially in IoT applications. Written in a delightfully informal style yet comprehensive in its coverage, the book describes both the device physics underpinning FD-SOI technology and the cutting-edge, perhaps even futuristic devices enabled by it." --Professor Alexander Zaslavsky, Brown University, USA "A superbly written book on SOI technology by a master in the field." --Professor Yuan Taur, University of California, San Diego, USA "The author is a world-top researcher of SOI device/process technology. This book is his masterpiece and important for the FD-SOI archive. The reader will learn much from the book." --Professor Hiroshi Iwai, National Yang Ming Chiao Tung University, Taiwan From the author "It is during our global war against the terrifying coalition of corona and insidious computer viruses that this book has been put together. Continuous enlightenment from FD-SOI helped me cross this black and gray period. I shared a lot of myself in this book. The rule of the game was to keep the text light despite the heavy technical content. There are even tentative FD-SOI hieroglyphs on the front cover, composed of curves discussed in the book." - Written by a top expert in the silicon-on-insulator community and IEEE Andrew Grove 2017 award recipient - Comprehensively addresses the technology aspects, operation mechanisms and electrical characterization techniques for FD-SOI devices - Discusses FD-SOI's most promising device structures for memory, sensing and emerging applications
Author | : J. A. Martino |
Publisher | : The Electrochemical Society |
Total Pages | : 230 |
Release | : 2018-05-04 |
Genre | : Science |
ISBN | : 1607688360 |
Author | : Paul S. Ho |
Publisher | : Cambridge University Press |
Total Pages | : 433 |
Release | : 2022-05-12 |
Genre | : Science |
ISBN | : 1107032385 |
Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Author | : Chinmay K. Maiti |
Publisher | : CRC Press |
Total Pages | : 314 |
Release | : 2022-11-17 |
Genre | : Technology & Engineering |
ISBN | : 1000638111 |
This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.