Semiconductor Wafer Bonding : Science, Technology, and Applications V
| Author | : Charles E. Hunt |
| Publisher | : The Electrochemical Society |
| Total Pages | : 498 |
| Release | : 2001 |
| Genre | : Technology & Engineering |
| ISBN | : 9781566772587 |
Semiconductor Wafer Bonding Science Technology And Applications
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Semiconductor Wafer Bonding VIII : Science, Technology, and Applications
| Author | : |
| Publisher | : The Electrochemical Society |
| Total Pages | : 476 |
| Release | : 2005 |
| Genre | : Microelectromechanical systems |
| ISBN | : 9781566774604 |
Semiconductor Wafer Bonding VII : Science, Technology, and Applications
| Author | : |
| Publisher | : The Electrochemical Society |
| Total Pages | : 408 |
| Release | : 2003 |
| Genre | : Technology & Engineering |
| ISBN | : 9781566774024 |
Wafer Bonding
| Author | : Marin Alexe |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 524 |
| Release | : 2004-05-14 |
| Genre | : Science |
| ISBN | : 9783540210498 |
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Semiconductor Wafer Bonding: Science, Technology, and Applications 15
| Author | : C. S. Tan |
| Publisher | : The Electrochemical Society |
| Total Pages | : 258 |
| Release | : 2018-09-21 |
| Genre | : Science |
| ISBN | : 1607688514 |
Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele
| Author | : C. Colinge |
| Publisher | : The Electrochemical Society |
| Total Pages | : 656 |
| Release | : 2010-10 |
| Genre | : Science |
| ISBN | : 1566778239 |
Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Semiconductor Wafer Bonding 10: Science, Technology, and Applications
| Author | : |
| Publisher | : The Electrochemical Society |
| Total Pages | : 588 |
| Release | : 2008-10 |
| Genre | : Microelectromechanical systems |
| ISBN | : 1566776546 |
This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Semiconductor Wafer Bonding 9: Science, Technology, and Applications
| Author | : Helmut Baumgart |
| Publisher | : The Electrochemical Society |
| Total Pages | : 398 |
| Release | : 2006 |
| Genre | : Microelectromechanical systems |
| ISBN | : 156677506X |
This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Wafer Bonding
| Author | : Marin Alexe |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 510 |
| Release | : 2013-03-09 |
| Genre | : Science |
| ISBN | : 3662108275 |
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Semiconductor Wafer Bonding
| Author | : H. Baumgart |
| Publisher | : The Electrochemical Society |
| Total Pages | : 310 |
| Release | : 2002 |
| Genre | : Technology & Engineering |
| ISBN | : 9781566773607 |
