Routing Issues In Nanometer Scale Integrated Circuits
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Manufacturability Aware Routing in Nanometer VLSI
Author | : David Z. Pan |
Publisher | : Now Publishers Inc |
Total Pages | : 110 |
Release | : 2010-05-04 |
Genre | : Computers |
ISBN | : 1601983506 |
This paper surveys key research challenges and recent results of manufacturability aware routing in nanometer VLSI designs. The manufacturing challenges have their root causes from various integrated circuit (IC) manufacturing processes and steps, e.g., deep sub-wavelength lithography, random defects, via voids, chemical-mechanical polishing, and antenna-effects. They may result in both functional and parametric yield losses. The manufacturability aware routing can be performed at different routing stages including global routing, track routing, and detail routing, guided by both manufacturing process models and manufacturing-friendly rules. The manufacturability/yield optimization can be performed through both correct-by-construction (i.e., optimization during routing) as well as construct-by-correction (i.e., post-routing optimization). This paper will provide a holistic view of key design for manufacturability issues in nanometer VLSI routing.
Full-Chip Nanometer Routing Techniques
Author | : Tsung-Yi Ho |
Publisher | : Springer Science & Business Media |
Total Pages | : 112 |
Release | : 2007-08-30 |
Genre | : Technology & Engineering |
ISBN | : 1402061951 |
This book presents a novel multilevel full-chip router, namely mSIGMA for SIGnal-integrity and MAnufacturability optimization. These routing technologies will ensure faster time-to-market and time-to-profitability. The book includes a detailed description on the modern VLSI routing problems, and multilevel optimization on routing design to solve the chip complexity problem.
Nano-scale CMOS Analog Circuits
Author | : Soumya Pandit |
Publisher | : CRC Press |
Total Pages | : 397 |
Release | : 2018-09-03 |
Genre | : Technology & Engineering |
ISBN | : 1466564288 |
Reliability concerns and the limitations of process technology can sometimes restrict the innovation process involved in designing nano-scale analog circuits. The success of nano-scale analog circuit design requires repeat experimentation, correct analysis of the device physics, process technology, and adequate use of the knowledge database. Starting with the basics, Nano-Scale CMOS Analog Circuits: Models and CAD Techniques for High-Level Design introduces the essential fundamental concepts for designing analog circuits with optimal performances. This book explains the links between the physics and technology of scaled MOS transistors and the design and simulation of nano-scale analog circuits. It also explores the development of structured computer-aided design (CAD) techniques for architecture-level and circuit-level design of analog circuits. The book outlines the general trends of technology scaling with respect to device geometry, process parameters, and supply voltage. It describes models and optimization techniques, as well as the compact modeling of scaled MOS transistors for VLSI circuit simulation. • Includes two learning-based methods: the artificial neural network (ANN) and the least-squares support vector machine (LS-SVM) method • Provides case studies demonstrating the practical use of these two methods • Explores circuit sizing and specification translation tasks • Introduces the particle swarm optimization technique and provides examples of sizing analog circuits • Discusses the advanced effects of scaled MOS transistors like narrow width effects, and vertical and lateral channel engineering Nano-Scale CMOS Analog Circuits: Models and CAD Techniques for High-Level Design describes the models and CAD techniques, explores the physics of MOS transistors, and considers the design challenges involving statistical variations of process technology parameters and reliability constraints related to circuit design.
ICDSMLA 2019
Author | : Amit Kumar |
Publisher | : Springer Nature |
Total Pages | : 2010 |
Release | : 2020-05-19 |
Genre | : Technology & Engineering |
ISBN | : 9811514208 |
This book gathers selected high-impact articles from the 1st International Conference on Data Science, Machine Learning & Applications 2019. It highlights the latest developments in the areas of Artificial Intelligence, Machine Learning, Soft Computing, Human–Computer Interaction and various data science & machine learning applications. It brings together scientists and researchers from different universities and industries around the world to showcase a broad range of perspectives, practices and technical expertise.
Advances in Swarm Intelligence
Author | : Ying Tan |
Publisher | : Springer |
Total Pages | : 646 |
Release | : 2012-06-13 |
Genre | : Computers |
ISBN | : 3642309763 |
This book and its companion volume, LNCS vols. 7331 and 7332, constitute the proceedings of the Third International Conference on Swarm Intelligence, ICSI 2012, held in Shenzhen, China in June 2012. The 145 revised full papers presented were carefully reviewed and selected from 247 submissions. The papers are organized in 27 cohesive sections covering all major topics of swarm intelligence research and developments.
Computational Materials, Chemistry, and Biochemistry: From Bold Initiatives to the Last Mile
Author | : Sadasivan Shankar |
Publisher | : Springer Nature |
Total Pages | : 1344 |
Release | : 2021-01-25 |
Genre | : Technology & Engineering |
ISBN | : 3030187780 |
This book provides a broad and nuanced overview of the achievements and legacy of Professor William (“Bill”) Goddard in the field of computational materials and molecular science. Leading researchers from around the globe discuss Goddard’s work and its lasting impacts, which can be seen in today’s cutting-edge chemistry, materials science, and biology techniques. Each section of the book closes with an outline of the prospects for future developments. In the course of a career spanning more than 50 years, Goddard’s seminal work has led to dramatic advances in a diverse range of science and engineering fields. Presenting scientific essays and reflections by students, postdoctoral associates, collaborators and colleagues, the book describes the contributions of one of the world’s greatest materials and molecular scientists in the context of theory, experimentation, and applications, and examines his legacy in each area, from conceptualization (the first mile) to developments and extensions aimed at applications, and lastly to de novo design (the last mile). Goddard’s passion for science, his insights, and his ability to actively engage with his collaborators in bold initiatives is a model for us all. As he enters his second half-century of scientific research and education, this book inspires future generations of students and researchers to employ and extend these powerful techniques and insights to tackle today’s critical problems in biology, chemistry, and materials. Examples highlighted in the book include new materials for photocatalysts to convert water and CO2 into fuels, novel catalysts for the highly selective and active catalysis of alkanes to valuable organics, simulating the chemistry in film growth to develop two-dimensional functional films, and predicting ligand–protein binding and activation to enable the design of targeted drugs with minimal side effects.
Configurable Intelligent Optimization Algorithm
Author | : Fei Tao |
Publisher | : Springer |
Total Pages | : 364 |
Release | : 2014-08-18 |
Genre | : Computers |
ISBN | : 3319088408 |
Presenting the concept and design and implementation of configurable intelligent optimization algorithms in manufacturing systems, this book provides a new configuration method to optimize manufacturing processes. It provides a comprehensive elaboration of basic intelligent optimization algorithms, and demonstrates how their improvement, hybridization and parallelization can be applied to manufacturing. Furthermore, various applications of these intelligent optimization algorithms are exemplified in detail, chapter by chapter. The intelligent optimization algorithm is not just a single algorithm; instead it is a general advanced optimization mechanism which is highly scalable with robustness and randomness. Therefore, this book demonstrates the flexibility of these algorithms, as well as their robustness and reusability in order to solve mass complicated problems in manufacturing. Since the genetic algorithm was presented decades ago, a large number of intelligent optimization algorithms and their improvements have been developed. However, little work has been done to extend their applications and verify their competence in solving complicated problems in manufacturing. This book will provide an invaluable resource to students, researchers, consultants and industry professionals interested in engineering optimization. It will also be particularly useful to three groups of readers: algorithm beginners, optimization engineers and senior algorithm designers. It offers a detailed description of intelligent optimization algorithms to algorithm beginners; recommends new configurable design methods for optimization engineers, and provides future trends and challenges of the new configuration mechanism to senior algorithm designers.
Three-Dimensional Integrated Circuit Design
Author | : Vasilis F. Pavlidis |
Publisher | : Newnes |
Total Pages | : 770 |
Release | : 2017-07-04 |
Genre | : Technology & Engineering |
ISBN | : 0124104843 |
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization