Reliability Failure Analysis Of Integrated Circuits Ics And Devices
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Author | : Friedrich Beck |
Publisher | : John Wiley & Sons |
Total Pages | : 198 |
Release | : 1998-02-04 |
Genre | : Technology & Engineering |
ISBN | : 9780471974017 |
Funktionstests an integrierten Schaltungen sind für deren Zuverlässigkeit von herausragender Bedeutung. Erstmals werden in diesem Werk die speziellen Präparationstechniken für die Fehleranalyse beschrieben. Ausgehend von den theoretischen Grundlagen erläutert der Autor in praxisnahem Stil die verschiedenen Techniken, die das Zurückverfolgen von Ausfällen ermöglichen.
Author | : Milton Ohring |
Publisher | : Academic Press |
Total Pages | : 759 |
Release | : 2014-10-14 |
Genre | : Technology & Engineering |
ISBN | : 0080575528 |
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author | : Tejinder Gandhi |
Publisher | : ASM International |
Total Pages | : 719 |
Release | : 2019-11-01 |
Genre | : Technology & Engineering |
ISBN | : 1627082468 |
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Author | : |
Publisher | : |
Total Pages | : 644 |
Release | : 1967 |
Genre | : Reliability (Engineering) |
ISBN | : |
Author | : EDFAS Desk Reference Committee |
Publisher | : ASM International |
Total Pages | : 673 |
Release | : 2011 |
Genre | : Technology & Engineering |
ISBN | : 1615037268 |
Includes bibliographical references and index.
Author | : Jonathan Swingler |
Publisher | : Woodhead Publishing |
Total Pages | : 350 |
Release | : 2020-11-15 |
Genre | : Technology & Engineering |
ISBN | : 9780081029633 |
The book charts how reliability engineering has moved from the use of sometimes arbitrary standards to an empirical scientific approach of understanding operating conditions, failure mechanisms, the need for testing for a more realistic characterisation and, new for the second edition, includes the monitoring of performance/robustness in the field. Reliability Characterisation of Electrical and Electronic Systems brings together a number of experts and key players in the discipline to concisely present the fundamentals and background to reliability theory, elaborate on the current thinking and developments behind reliability characterisation, and give a detailed account of emerging issues across a wide range of applications. The second edition has a new section titled Reliability Condition Monitoring and Prognostics for Specific Application which provides a guide to critical issues in key industrial sectors such as automotive and aerospace. There are also new chapters on areas of growing importance such as reliability methods in high-temperature electronics and reliability and testing of electric aircraft power systems. Reviews emerging areas of importance such as reliability methods in high-temperature electronics and reliability testing of electric vehicles Looks at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability Facilitates a greater understanding of operating conditions, failure mechanisms and the need for testing
Author | : Lawrence C. Wagner |
Publisher | : Springer Science & Business Media |
Total Pages | : 256 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 1461549191 |
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Author | : ASM International |
Publisher | : ASM International |
Total Pages | : 372 |
Release | : 2007-01-01 |
Genre | : Technology & Engineering |
ISBN | : 1615030905 |
Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
Author | : |
Publisher | : ASM International |
Total Pages | : 162 |
Release | : 2001-01-01 |
Genre | : Technology & Engineering |
ISBN | : 0871707454 |
Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee.
Author | : |
Publisher | : ASM International |
Total Pages | : 813 |
Release | : 2004-01-01 |
Genre | : Technology & Engineering |
ISBN | : 0871708043 |
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron