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| Author | : A. N. Das |
| Publisher | : |
| Total Pages | : 588 |
| Release | : 2001 |
| Genre | : High-temperature superconductors |
| ISBN | : |
| Author | : Gabriele Giuliani |
| Publisher | : Cambridge University Press |
| Total Pages | : 779 |
| Release | : 2008-06-19 |
| Genre | : Science |
| ISBN | : 1139471589 |
Modern electronic devices and novel materials often derive their extraordinary properties from the intriguing, complex behavior of large numbers of electrons forming what is known as an electron liquid. This book provides an in-depth introduction to the physics of the interacting electron liquid in a broad variety of systems, including metals, semiconductors, artificial nano-structures, atoms and molecules. One, two and three dimensional systems are treated separately and in parallel. Different phases of the electron liquid, from the Landau Fermi liquid to the Wigner crystal, from the Luttinger liquid to the quantum Hall liquid are extensively discussed. Both static and time-dependent density functional theory are presented in detail. Although the emphasis is on the development of the basic physical ideas and on a critical discussion of the most useful approximations, the formal derivation of the results is highly detailed and based on the simplest, most direct methods.
| Author | : Banasri Basu |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 394 |
| Release | : 2010-06-01 |
| Genre | : Business & Economics |
| ISBN | : 8847015014 |
The combined efforts of the Physicists and the Economists in recent years in analyzing and modelling various dynamic phenomena in monetary and social systems have led to encouraging developments, generally classified under the title of Econophysics. These developments share a common ambition with the already established field of Quantitative Economics. This volume intends to offer the reader a glimpse of these two parallel initiatives by collecting review papers written by well-known experts in the respective research frontiers in one cover. This massive book presents a unique combination of research papers contributed almost equally by Physicists and Economists. Additional contributions from Computer Scientists and Mathematicians are also included in this volume. The book consists of two parts: the first part concentrates on Econophysics problems and the second part stresses on various quantitative issues in Economics. Both parts specialize on frontier problems in Games and Social Choices.
| Author | : E. M. Anastassakis |
| Publisher | : |
| Total Pages | : 952 |
| Release | : 1990 |
| Genre | : Semiconductors |
| ISBN | : |
Gathering top experts in the field, the 20th ICPS proceedings reviews the progress in all aspects of semiconductor physics. The proceedings will include state-of-the-art lectures with special emphasis on exciting new developments. It should serve as excellent material for researchers in this and related fields.
| Author | : Jutta Escher |
| Publisher | : Springer Nature |
| Total Pages | : 312 |
| Release | : 2021-02-08 |
| Genre | : Science |
| ISBN | : 3030580822 |
The Compound-Nuclear Reaction and Related Topics (CNR*) international workshop series was initiated in 2007 with a meeting near Yosemite National Park. It has since been held in Bordeaux (2009), Prague (2011), Sao Paulo (2013), Tokyo (2015), and Berkeley, California (2018). The workshop series brings together experts in nuclear theory, experiment, data evaluations, and applications, and fosters interactions among these groups. Topics of interest include: nuclear reaction mechanisms, optical model, direct reactions and the compound nucleus, pre-equilibrium reactions, fusion and fission, cross section measurements (direct and indirect methods), Hauser-Feshbach theory (limits and extensions), compound-nuclear decays, particle and gamma emission, level densities, strength functions, nuclear structure for compound-nuclear reactions, nuclear energy, nuclear astrophysics, and other topics. This peer-reviewed proceedings volume presents papers and poster summaries from the 6th International Workshop on Compound-Nuclear Reactions and Related Topics CNR*18, held on September 24-28, 2018, at Lawrence Berkeley National Lab, Berkeley, CA.
| Author | : Dr. Arunkumar Raychaudhuri |
| Publisher | : |
| Total Pages | : 488 |
| Release | : 2014-04-01 |
| Genre | : |
| ISBN | : 9789380663319 |
| Author | : Paul Fuoss |
| Publisher | : Materials Research Society |
| Total Pages | : 0 |
| Release | : 1993-09-21 |
| Genre | : Technology & Engineering |
| ISBN | : 9781558992085 |
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
| Author | : Charles G. Interrante |
| Publisher | : Mrs Proceedings |
| Total Pages | : 1006 |
| Release | : 1993-03-26 |
| Genre | : Technology & Engineering |
| ISBN | : |
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book was first published in 1993.
| Author | : L. E. McCandlish |
| Publisher | : Mrs Proceedings |
| Total Pages | : 288 |
| Release | : 1989-06-13 |
| Genre | : Science |
| ISBN | : |
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
| Author | : Steven K. Groothuis |
| Publisher | : |
| Total Pages | : 344 |
| Release | : 1997-10-20 |
| Genre | : Technology & Engineering |
| ISBN | : |
While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.
