Power Aware Testing And Test Strategies For Low Power Devices
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| Author | : Patrick Girard |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 376 |
| Release | : 2010-03-11 |
| Genre | : Technology & Engineering |
| ISBN | : 1441909281 |
Managing the power consumption of circuits and systems is now considered one of the most important challenges for the semiconductor industry. Elaborate power management strategies, such as dynamic voltage scaling, clock gating or power gating techniques, are used today to control the power dissipation during functional operation. The usage of these strategies has various implications on manufacturing test, and power-aware test is therefore increasingly becoming a major consideration during design-for-test and test preparation for low power devices. This book explores existing solutions for power-aware test and design-for-test of conventional circuits and systems, and surveys test strategies and EDA solutions for testing low power devices.
| Author | : Han-Ming Wu |
| Publisher | : The Electrochemical Society |
| Total Pages | : 1203 |
| Release | : 2010-03 |
| Genre | : Science |
| ISBN | : 1566778069 |
Our mission is to provide a forum for world experts to discuss technologies, address the growing needs associated with silicon technology, and exchange their discoveries and solutions for current issues of high interest. We encourage collaboration, open discussion, and critical reviews at this conference. Furthermore, we hope that this conference will also provide collaborative opportunities for those who are interested in the semiconductor industry in Asia, particularly in China.
| Author | : Rohit Sharma |
| Publisher | : CRC Press |
| Total Pages | : 302 |
| Release | : 2018-09-03 |
| Genre | : Technology & Engineering |
| ISBN | : 1466589426 |
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
| Author | : Zuber Patel |
| Publisher | : Springer Nature |
| Total Pages | : 299 |
| Release | : 2020-08-28 |
| Genre | : Technology & Engineering |
| ISBN | : 9811562296 |
This book presents select peer-reviewed proceedings of the International Conference on Advances in VLSI and Embedded Systems (AVES 2019) held at SVNIT, Surat, Gujarat, India. The book covers cutting-edge original research in VLSI design, devices and emerging technologies, embedded systems, and CAD for VLSI. With an aim to address the demand for complex and high-functionality systems as well as portable consumer electronics, the contents focus on basic concepts of circuit and systems design, fabrication, testing, and standardization. This book can be useful for students, researchers as well as industry professionals interested in emerging trends in VLSI and embedded systems.
| Author | : Luciano Lavagno |
| Publisher | : CRC Press |
| Total Pages | : 644 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1482254638 |
The first of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC System Design, Verification, and Testing thoroughly examines system-level design, microarchitectural design, logic verification, and testing. Chapters contributed by leading experts authoritatively discuss processor modeling and design tools, using performance metrics to select microprocessor cores for integrated circuit (IC) designs, design and verification languages, digital simulation, hardware acceleration and emulation, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on high-level synthesis, system-on-chip (SoC) block-based design, and back-annotating system-level models Offering improved depth and modernity, Electronic Design Automation for IC System Design, Verification, and Testing provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
| Author | : Krzysztof Iniewski |
| Publisher | : John Wiley & Sons |
| Total Pages | : 632 |
| Release | : 2012-04-17 |
| Genre | : Technology & Engineering |
| ISBN | : 1118181476 |
The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies. The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be : design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors.
| Author | : Raimund Ubar |
| Publisher | : IGI Global |
| Total Pages | : 580 |
| Release | : 2011-01-01 |
| Genre | : Computers |
| ISBN | : 1609602145 |
"This book covers aspects of system design and efficient modelling, and also introduces various fault models and fault mechanisms associated with digital circuits integrated into System on Chip (SoC), Multi-Processor System-on Chip (MPSoC) or Network on Chip (NoC)"--
| Author | : Geetam Singh Tomar |
| Publisher | : Springer Nature |
| Total Pages | : 1635 |
| Release | : 2020-01-07 |
| Genre | : Technology & Engineering |
| ISBN | : 9811506337 |
This book gathers high-quality research papers presented at the First International Conference, ICSC 2019, organised by THDC Institute of Hydropower Engineering and Technology, Tehri, India, from 20 to 21 April 2019. The book is divided into two major sections – Intelligent Computing and Smart Communication. Some of the areas covered are Parallel and Distributed Systems, Web Services, Databases and Data Mining Applications, Feature Selection and Feature Extraction, High-Performance Data Mining Algorithms, Knowledge Discovery, Communication Protocols and Architectures, High-speed Communication, High-Voltage Insulation Technologies, Fault Detection and Protection, Power System Analysis, Embedded Systems, Architectures, Electronics in Renewable Energy, CAD for VLSI, Green Electronics, Signal and Image Processing, Pattern Recognition and Analysis, Multi-Resolution Analysis and Wavelets, 3D and Stereo Imaging, and Neural Networks.
| Author | : Patrick Girard |
| Publisher | : Springer Nature |
| Total Pages | : 320 |
| Release | : 2023-03-13 |
| Genre | : Technology & Engineering |
| ISBN | : 3031196392 |
This book provides a state-of-the-art guide to Machine Learning (ML)-based techniques that have been shown to be highly efficient for diagnosis of failures in electronic circuits and systems. The methods discussed can be used for volume diagnosis after manufacturing or for diagnosis of customer returns. Readers will be enabled to deal with huge amount of insightful test data that cannot be exploited otherwise in an efficient, timely manner. After some background on fault diagnosis and machine learning, the authors explain and apply optimized techniques from the ML domain to solve the fault diagnosis problem in the realm of electronic system design and manufacturing. These techniques can be used for failure isolation in logic or analog circuits, board-level fault diagnosis, or even wafer-level failure cluster identification. Evaluation metrics as well as industrial case studies are used to emphasize the usefulness and benefits of using ML-based diagnosis techniques.
| Author | : Brandon Noia |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 260 |
| Release | : 2013-11-19 |
| Genre | : Technology & Engineering |
| ISBN | : 3319023780 |
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
