Polymeric Materials For Electronics Packaging And Interconnection
Download Polymeric Materials For Electronics Packaging And Interconnection full books in PDF, epub, and Kindle. Read online free Polymeric Materials For Electronics Packaging And Interconnection ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Polymeric Materials for Electronics Packaging and Interconnection
Author | : John H. Lupinski |
Publisher | : |
Total Pages | : 520 |
Release | : 1989 |
Genre | : Science |
ISBN | : |
From a symposium of the ACS 196th meeting, Los Angeles, CA, Sept. 1988. Thirty-nine chapters cover a broad spectrum of topics in four general areas: physical chemistry of materials, properties and applications of encapsulants and gels, and printed circuit board substrates and materials. Also includes a review of the marketing trends which drive packaging technology. Annotation copyrighted by Book News, Inc., Portland, OR
Polymers for Electronic & Photonic Application
Author | : C. P. Wong |
Publisher | : Elsevier |
Total Pages | : 676 |
Release | : 2013-10-22 |
Genre | : Technology & Engineering |
ISBN | : 1483289397 |
The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field.* Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field
Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications
Author | : John R. Susko |
Publisher | : |
Total Pages | : 228 |
Release | : 1988 |
Genre | : Electrochemistry |
ISBN | : |
Materials for High-Density Electronic Packaging and Interconnection
Author | : National Research Council |
Publisher | : National Academies Press |
Total Pages | : 154 |
Release | : 1990-02-01 |
Genre | : Technology & Engineering |
ISBN | : 030904233X |
Polymers in Electronics
Author | : Zulkifli Ahmad |
Publisher | : Elsevier |
Total Pages | : 450 |
Release | : 2023-07-28 |
Genre | : Technology & Engineering |
ISBN | : 0323983901 |
Polymers in Electronics: Optoelectronic Properties, Design, Fabrication, and Applications brings together the fundamentals and latest advances in polymeric materials for electronic device applications, supporting researchers, scientists and advanced students, and approaching the topic from a range of disciplines. The book begins by introducing polymeric materials, their dielectric, optical, and thermal properties, and the essential principles and techniques for polymers as applied to electronics. This is followed by detailed coverage of the key steps in the preparation of polymeric materials for opto-electronic devices, including fabrication methods, materials design, rheology, encapsulation, and conductive polymer mechanisms. The final part of the book focuses on the latest developments in advanced devices, covering the areas of photovoltaics, transistors, light-emitting diodes, and stretchable electronics. In addition, it explains mechanisms, design, fabrication techniques, and end applications. This is a highly valuable resource for researchers, advanced students, engineers and R&D professionals from a range of disciplines. Offers introductory coverage of polymeric materials for electronics, including principles, design, properties, fabrication and applications Focuses on key issues such as materials selection, structure-property relationships and challenges in application Explores advanced applications of polymers in photovoltaics, transistors, sensors, light-emitting diodes and stretchable electronics
Plastics for Electronics
Author | : M. Goosey |
Publisher | : Springer Science & Business Media |
Total Pages | : 386 |
Release | : 2012-12-06 |
Genre | : Science |
ISBN | : 9400949421 |
Much of the progress towards ever greater miniaturisation made by the electronics industry, from the early days of valves to the development of the transistor and later the integrated circuit, has only been made possible because of the availability of various polymeric materials. Indeed, many new plastics have been developed specifically for electri cal and electronic device applications and as a consequence the plastics and electronics industries have continued to grow side-by-side. Electronic components are one of the few groups of products in which the real cost performance function has declined significantly over the years, and part of the reason can be directly attributed to the availability and performance of new polymeric materials. The evolu tion of the personal computer is a specific example, where improve ments in polymer-based photoresists and plastic encapsulation techni ques have allowed the mass production of high-density memories and microprocessors at a cost which yields machines more powerful than mainframe computers of 30 years ago for little more than the price of a toy. Today, plastic materials are widely used throughout all areas of electrical and electronic device production in diverse applications ranging from alpha particle barriers on memory devices to insulator mouldings for the largest bushings and transformers. Plastics, or more correctly polymers, find use as packaging materials for individual microcircuits, protective coatings, wire and cable insulators, printed circuit board components, die attach adhesives, equipment casings and a host of other applications.
Electronics Packaging Forum
Author | : James E. Morris |
Publisher | : Springer Science & Business Media |
Total Pages | : 459 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 9400904398 |
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
Materials for Electronic Packaging
Author | : Deborah D.L. Chung |
Publisher | : Elsevier |
Total Pages | : 383 |
Release | : 1995-03-31 |
Genre | : Technology & Engineering |
ISBN | : 0080511171 |
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. - Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors - Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science - Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Electronic Packaging and Interconnection Handbook
Author | : Charles A. Harper |
Publisher | : McGraw-Hill Professional Publishing |
Total Pages | : 1112 |
Release | : 2000 |
Genre | : Technology & Engineering |
ISBN | : |
Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.