Plasma Enhanced Chemical Vapor Deposition
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Author | : Paul Williams |
Publisher | : Springer Science & Business Media |
Total Pages | : 634 |
Release | : 1997-05-31 |
Genre | : Technology & Engineering |
ISBN | : 9780792345671 |
Plasma Processing of Semiconductors contains 28 contributions from 18 experts and covers plasma etching, plasma deposition, plasma-surface interactions, numerical modelling, plasma diagnostics, less conventional processing applications of plasmas, and industrial applications. Audience: Coverage ranges from introductory to state of the art, thus the book is suitable for graduate-level students seeking an introduction to the field as well as established workers wishing to broaden or update their knowledge.
Author | : A.W. Weimer |
Publisher | : Springer Science & Business Media |
Total Pages | : 675 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 9400900716 |
Carbide, Nitride and Boride Materials Synthesis and Processing is a major reference text addressing methods for the synthesis of non-oxides. Each chapter has been written by an expert practising in the subject area, affiliated with industry, academia or government research, thus providing a broad perspective of information for the reader. The subject matter ranges from materials properties and applications to methods of synthesis including pre- and post-synthesis processing. Although most of the text is concerned with the synthesis of powders, chapters are included for other materials such as whiskers, platelets, fibres and coatings. Carbide, Nitride and Boride Materials Synthesis and Processing is a comprehensive overview of the subject and is suitable for practitioners in the industry as well as those looking for an introduction to the field. It will be of interest to chemical, mechanical and ceramic engineers, materials scientists and chemists in both university and industrial environments working on or with refractory carbides, nitrides and borides.
Author | : Junhong Chen |
Publisher | : Springer |
Total Pages | : 121 |
Release | : 2015-03-23 |
Genre | : Technology & Engineering |
ISBN | : 3319153021 |
This book introduces the basic concepts, synthesis techniques, and applications of vertically-oriented graphene. The authors detail emerging applications of vertically-oriented graphene such as field emitters, atmospheric nanoscale corona discharges, gas sensors and biosensors, supercapacitors, lithium-ion batteries, fuel cells (catalyst supports) and electrochemical transducers. They offer a perspective on current challenges to enabling commercial applications of vertically-oriented graphene.
Author | : Peter M. Martin |
Publisher | : William Andrew |
Total Pages | : 932 |
Release | : 2009-12-01 |
Genre | : Technology & Engineering |
ISBN | : 0815520328 |
This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications.
Author | : Hugh O. Pierson |
Publisher | : William Andrew |
Total Pages | : 507 |
Release | : 1999-09-01 |
Genre | : Technology & Engineering |
ISBN | : 0815517432 |
Turn to this new second edition for an understanding of the latest advances in the chemical vapor deposition (CVD) process. CVD technology has recently grown at a rapid rate, and the number and scope of its applications and their impact on the market have increased considerably. The market is now estimated to be at least double that of a mere seven years ago when the first edition of this book was published. The second edition is an update with a considerably expanded and revised scope. Plasma CVD and metallo-organic CVD are two major factors in this rapid growth. Readers will find the latest data on both processes in this volume. Likewise, the book explains the growing importance of CVD in production of semiconductor and related applications.
Author | : Anthony C. Jones |
Publisher | : Royal Society of Chemistry |
Total Pages | : 600 |
Release | : 2009 |
Genre | : Science |
ISBN | : 0854044655 |
"The book is one of the most comprehensive overviews ever written on the key aspects of chemical vapour deposition processes and it is more comprehensive, technically detailed and up-to-date than other books on CVD. The contributing authors are all practising CVD technologists and are leading international experts in the field of CVD. It presents a logical and progressive overview of the various aspects of CVD processes. Basic concepts, such as the various types of CVD processes, the design of CVD reactors, reaction modelling and CVD precursor chemistry are covered in the first few"--Jacket
Author | : Mitsuharu Konuma |
Publisher | : Springer Science & Business Media |
Total Pages | : 234 |
Release | : 2012-12-06 |
Genre | : Science |
ISBN | : 3642845118 |
Properties of thin films depend strongly upon the deposition technique and conditions chosen. In order to achieve the desired film, optimum deposition conditions have to be found by carrying out experiments in a trial-and error fashion with varying parameters. The data obtained on one growth apparatus are often not transferable to another. This is especially true for film deposition processes using a cold plasma because of our poor under standing of the mechanisms. Relatively precise studies have been carried out on the role that physical effects play in film formation such as sputter deposition. However, there are many open questions regarding processes that involve chemical reactions, for example, reactive sputter deposition or plasma enhanced chemical vapor deposition. Much further research is re quired in order to understand the fundamental deposition processes. A sys tematic collection of basic data, some of which may be readily available in other branches of science, for example, reaction cross sections for gases with energetic electrons, is also required. The need for pfasma deposition techniques is felt strongly in industrial applications because these techniques are superior to traditional thin-film deposition techniques in many ways. In fact, plasma deposition techniques have developed rapidly in the semiconductor and electronics industries. Fields of possible application are still expanding. A reliable plasma reactor with an adequate in situ system for monitoring the deposition conditions and film properties must be developed to improve reproducibility and pro ductivity at the industrial level.
Author | : Karen K. Gleason |
Publisher | : John Wiley & Sons |
Total Pages | : 484 |
Release | : 2015-04-01 |
Genre | : Technology & Engineering |
ISBN | : 352769028X |
The method of CVD (chemical vapor deposition) is a versatile technique to fabricate high-quality thin films and structured surfaces in the nanometer regime from the vapor phase. Already widely used for the deposition of inorganic materials in the semiconductor industry, CVD has become the method of choice in many applications to process polymers as well. This highly scalable technique allows for synthesizing high-purity, defect-free films and for systematically tuning their chemical, mechanical and physical properties. In addition, vapor phase processing is critical for the deposition of insoluble materials including fluoropolymers, electrically conductive polymers, and highly crosslinked organic networks. Furthermore, CVD enables the coating of substrates which would otherwise dissolve or swell upon exposure to solvents. The scope of the book encompasses CVD polymerization processes which directly translate the chemical mechanisms of traditional polymer synthesis and organic synthesis in homogeneous liquids into heterogeneous processes for the modification of solid surfaces. The book is structured into four parts, complemented by an introductory overview of the diverse process strategies for CVD of polymeric materials. The first part on the fundamentals of CVD polymers is followed by a detailed coverage of the materials chemistry of CVD polymers, including the main synthesis mechanisms and the resultant classes of materials. The third part focuses on the applications of these materials such as membrane modification and device fabrication. The final part discusses the potential for scale-up and commercialization of CVD polymers.
Author | : Daniel Dobkin |
Publisher | : Springer Science & Business Media |
Total Pages | : 298 |
Release | : 2003-04-30 |
Genre | : Technology & Engineering |
ISBN | : 9781402012488 |
Principles of Chemical Vapor Deposition provides a simple introduction to heat and mass transfer, surface and gas phase chemistry, and plasma discharge characteristics. In addition, the book includes discussions of practical films and reactors to help in the development of better processes and equipment. This book will assist workers new to chemical vapor deposition (CVD) to understand CVD reactors and processes and to comprehend and exploit the literature in the field. The book reviews several disparate fields with which many researchers may have only a passing acquaintance, such as heat and mass transfer, discharge physics, and surface chemistry, focusing on key issues relevant to CVD. The book also examines examples of realistic industrial reactors and processes with simplified analysis to demonstrate how to apply the principles to practical situations. The book does not attempt to exhaustively survey the literature or to intimidate the reader with irrelevant mathematical apparatus. This book is as simple as possible while still retaining the essential physics and chemistry. The book is generously illustrated to assist the reader in forming the mental images which are the basis of understanding.
Author | : |
Publisher | : |
Total Pages | : |
Release | : 2000 |
Genre | : |
ISBN | : |
A method is disclosed of forming a vanadium oxide film on a substrate utilizing plasma enhanced chemical vapor deposition. The method includes positioning a substrate within a plasma reaction chamber and then forming a precursor gas comprised of a vanadium-containing chloride gas in an inert carrier gas. This precursor gas is then mixed with selected amounts of hydrogen and oxygen and directed into the reaction chamber. The amounts of precursor gas, oxygen and hydrogen are selected to optimize the final properties of the vanadium oxide film An rf plasma is generated within the reaction chamber to chemically react the precursor gas with the hydrogen and the oxygen to cause deposition of a vanadium oxide film on the substrate while the chamber deposition pressure is maintained at about one torr or less. Finally, the byproduct gases are removed from the plasma reaction chamber.