Performance And Energy Trade Offs For 3d Ic Noc Interconnects And Architectures
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| Author | : Abbas Sheibanyrad |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 280 |
| Release | : 2010-11-08 |
| Genre | : Technology & Engineering |
| ISBN | : 1441976183 |
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
| Author | : Lennart Bamberg |
| Publisher | : Springer Nature |
| Total Pages | : 403 |
| Release | : 2022-06-27 |
| Genre | : Technology & Engineering |
| ISBN | : 3030982297 |
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
| Author | : Mohamed M. Sabry Aly |
| Publisher | : Springer Nature |
| Total Pages | : 446 |
| Release | : 2022-07-11 |
| Genre | : Technology & Engineering |
| ISBN | : 9811674876 |
The book covers a range of topics dealing with emerging computing technologies which are being developed in response to challenges faced due to scaling CMOS technologies. It provides a sneak peek into the capabilities unleashed by these technologies across the complete system stack, with contributions by experts discussing device technology, circuit, architecture and design automation flows. Presenting a gradual progression of the individual sub-domains and the open research and adoption challenges, this book will be of interest to industry and academic researchers, technocrats and policymakers. Chapters "Innovative Memory Architectures Using Functionality Enhanced Devices" and "Intelligent Edge Biomedical Sensors in the Internet of Things (IoT) Era" are available open access under a Creative Commons Attribution 4.0 International License via link.springer.com.
| Author | : Leonard Barolli |
| Publisher | : Springer Nature |
| Total Pages | : 1535 |
| Release | : 2020-03-27 |
| Genre | : Technology & Engineering |
| ISBN | : 3030440419 |
This proceedings book covers the theory, design and applications of computer networks, distributed computing and information systems. Today’s networks are evolving rapidly, and there are several developing areas and applications. These include heterogeneous networking supported by recent technological advances in power wireless communications, along with silicon integration of various functionalities such as sensing, communications, intelligence and actuations, which is emerging as a critically important disruptive computer class based on a new platform, networking structure and interface that enables novel, low-cost and high-volume applications. However, implemeting these applications has sometimes been difficult due to interconnection problems. As such, different networks need to collaborate, and wired and next-generation wireless systems need to be integrated in order to develop high-performance computing solutions to address the problems arising from these networks’ complexities. This ebook presents the latest research findings, as well as theoretical and practical perspectives on the innovative methods and development techniques related to the emerging areas of information networking and applications
| Author | : Konstantinos Tatas |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 271 |
| Release | : 2013-10-08 |
| Genre | : Technology & Engineering |
| ISBN | : 1461442745 |
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
| Author | : Vasilis F. Pavlidis |
| Publisher | : Newnes |
| Total Pages | : 770 |
| Release | : 2017-07-04 |
| Genre | : Technology & Engineering |
| ISBN | : 0124104843 |
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
| Author | : David Wolpert |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 192 |
| Release | : 2011-08-31 |
| Genre | : Technology & Engineering |
| ISBN | : 1461407486 |
This book discusses new techniques for detecting, controlling, and exploiting the impacts of temperature variations on nanoscale circuits and systems. A new sensor system is described that can determine the temperature dependence as well as the operating temperature to improve system reliability. A new method is presented to control a circuit’s temperature dependence by individually tuning pull-up and pull-down networks to their temperature-insensitive operating points. This method extends the range of supply voltages that can be made temperature-insensitive, achieving insensitivity at nominal voltage for the first time.
| Author | : Ajith Abraham |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 771 |
| Release | : 2011-07-08 |
| Genre | : Computers |
| ISBN | : 3642227082 |
This volume is the first part of a four-volume set (CCIS 190, CCIS 191, CCIS 192, CCIS 193), which constitutes the refereed proceedings of the First International Conference on Computing and Communications, ACC 2011, held in Kochi, India, in July 2011. The 68 revised full papers presented in this volume were carefully reviewed and selected from a large number of submissions. The papers are organized in topical sections on ad hoc networks; advanced micro architecture techniques; autonomic and context-aware computing; bioinformatics and bio-computing; cloud, cluster, grid and P2P computing; cognitive radio and cognitive networks; cyber forensics; database and information systems.
| Author | : Mohammad Abdullah Al Faruque |
| Publisher | : Springer |
| Total Pages | : 292 |
| Release | : 2019-05-09 |
| Genre | : Technology & Engineering |
| ISBN | : 3030130509 |
This book presents the state-of-the-art and breakthrough innovations in design automation for cyber-physical systems.The authors discuss various aspects of cyber-physical systems design, including modeling, co-design, optimization, tools, formal methods, validation, verification, and case studies. Coverage includes a survey of the various existing cyber-physical systems functional design methodologies and related tools will provide the reader unique insights into the conceptual design of cyber-physical systems.
| Author | : Sudeep Pasricha |
| Publisher | : Springer Nature |
| Total Pages | : 481 |
| Release | : 2023-10-09 |
| Genre | : Technology & Engineering |
| ISBN | : 3031399323 |
This book presents recent advances towards the goal of enabling efficient implementation of machine learning models on resource-constrained systems, covering different application domains. The focus is on presenting interesting and new use cases of applying machine learning to innovative application domains, exploring the efficient hardware design of efficient machine learning accelerators, memory optimization techniques, illustrating model compression and neural architecture search techniques for energy-efficient and fast execution on resource-constrained hardware platforms, and understanding hardware-software codesign techniques for achieving even greater energy, reliability, and performance benefits. Discusses efficient implementation of machine learning in embedded, CPS, IoT, and edge computing; Offers comprehensive coverage of hardware design, software design, and hardware/software co-design and co-optimization; Describes real applications to demonstrate how embedded, CPS, IoT, and edge applications benefit from machine learning.
