This annotated bibliography of selected reports, journal articles, and manufacturers' literature on electronic packaging provides a literature basis for electronic packaging engineers to design moer reliable, maintainable, and adaptable electronic equipment for aerospace application. Subject indexing is provided by properties and environmental effects on packaging materials, discrete parts to module packaging, module packing to assembly, housing and mounting, packaging products, and interconnection techniques. Author and corporate author indexes are included. (Author, modified) INCLUDED. (Author, modified-PL).