MEMS Product Engineering

MEMS Product Engineering
Author: Dirk Ortloff
Publisher: Springer Science & Business Media
Total Pages: 216
Release: 2013-10-11
Genre: Technology & Engineering
ISBN: 3709107067

This book provides the methodological background to directing cooperative product engineering projects in a micro and nanotechnology setting. The methodology is based on well-established methods like PRINCE2 and StageGate, which are supplemented by best practices that can be individually tailored to the actual nature and size of the project at hand. This book is intended for everyone who takes an active role in either practical product engineering or in teaching it. This includes project and product management staff and program management offices in companies working on innovation projects, those active in innovation, as well as professors and students in engineering and management.

MEMS Product Development

MEMS Product Development
Author: Alissa M. Fitzgerald
Publisher: Springer Nature
Total Pages: 282
Release: 2021-03-16
Genre: Technology & Engineering
ISBN: 3030617092

Drawing on their experiences in successfully executing hundreds of MEMS development projects, the authors present the first practical guide to navigating the technical and business challenges of MEMS product development, from the initial concept stage all the way to commercialization. The strategies and tactics presented, when practiced diligently, can shorten development timelines, help avoid common pitfalls, and improve the odds of success, especially when resources are limited. MEMS Product Development illuminates what it really takes to develop a novel MEMS product so that innovators, designers, entrepreneurs, product managers, investors, and executives may properly prepare their companies to succeed.

MEMS Product Development

MEMS Product Development
Author: Alissa M. Fitzgerald
Publisher: Springer
Total Pages: 284
Release: 2021-02-17
Genre: Technology & Engineering
ISBN: 9783030617080

Drawing on their experiences in successfully executing hundreds of MEMS development projects, the authors present the first practical guide to navigating the technical and business challenges of MEMS product development, from the initial concept stage all the way to commercialization. The strategies and tactics presented, when practiced diligently, can shorten development timelines, help avoid common pitfalls, and improve the odds of success, especially when resources are limited. MEMS Product Development illuminates what it really takes to develop a novel MEMS product so that innovators, designers, entrepreneurs, product managers, investors, and executives may properly prepare their companies to succeed.

MEMS Reliability

MEMS Reliability
Author: Allyson L. Hartzell
Publisher: Springer Science & Business Media
Total Pages: 300
Release: 2010-11-02
Genre: Technology & Engineering
ISBN: 144196018X

The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.

An Introduction to Microelectromechanical Systems Engineering

An Introduction to Microelectromechanical Systems Engineering
Author: Nadim Maluf
Publisher: Artech House
Total Pages: 312
Release: 2004
Genre: Technology & Engineering
ISBN: 9781580535915

Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company's management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.

Analysis and Design Principles of MEMS Devices

Analysis and Design Principles of MEMS Devices
Author: Minhang Bao
Publisher: Elsevier
Total Pages: 327
Release: 2005-04-12
Genre: Technology & Engineering
ISBN: 008045562X

Sensors and actuators are now part of our everyday life and appear in many appliances, such as cars, vending machines and washing machines. MEMS (Micro Electro Mechanical Systems) are micro systems consisting of micro mechanical sensors, actuators and micro electronic circuits. A variety of MEMS devices have been developed and many mass produced, but the information on these is widely dispersed in the literature. This book presents the analysis and design principles of MEMS devices. The information is comprehensive, focusing on microdynamics, such as the mechanics of beam and diaphragm structures, air damping and its effect on the motion of mechanical structures. Using practical examples, the author examines problems associated with analysis and design, and solutions are included at the back of the book. The ideal advanced level textbook for graduates, Analysis and Design Principles of MEMS Devices is a suitable source of reference for researchers and engineers in the field. * Presents the analysis and design principles of MEMS devices more systematically than ever before. * Includes the theories essential for the analysis and design of MEMS includes the dynamics of micro mechanical structures * A problem section is included at the end of each chapter with answers provided at the end of the book.

Microengineering, MEMS, and Interfacing

Microengineering, MEMS, and Interfacing
Author: Danny Banks
Publisher: CRC Press
Total Pages: 353
Release: 2006-03-23
Genre: Technology & Engineering
ISBN: 1420015419

MEMS devices are finding increasingly widespread use in a variety of settings, from chemical and biological analysis to sensors and actuators in automotive applications. Along with this massive growth, the field is still experiencing growing pains as fabrication processes are refined and new applications are attempted. Anyone serious about entering

Mems Packaging

Mems Packaging
Author: Yung-cheng Lee
Publisher: World Scientific
Total Pages: 363
Release: 2018-01-03
Genre: Technology & Engineering
ISBN: 9813229373

MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.

MEMS and Microsystems

MEMS and Microsystems
Author: Tai-Ran Hsu
Publisher: McGraw-Hill Science, Engineering & Mathematics
Total Pages: 456
Release: 2002
Genre: Computers
ISBN:

Microsystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere.

MEMS/MOEM Packaging

MEMS/MOEM Packaging
Author: Ken Gilleo
Publisher: McGraw Hill Professional
Total Pages: 239
Release: 2005-08-01
Genre: Technology & Engineering
ISBN: 0071589090

While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.