Mechanical Resonator For Hermeticity Evaluation Of Rf Mems Wafer Level Packages
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| Author | : Sebastian Fischer |
| Publisher | : GRIN Verlag |
| Total Pages | : 130 |
| Release | : 2004-01-23 |
| Genre | : Technology & Engineering |
| ISBN | : 3638247570 |
Master's Thesis from the year 2002 in the subject Electrotechnology, grade: 1.0 (A), University of Applied Sciences Berlin (FB1), language: English, abstract: Common test standards for evaluating the hermeticity of microsystem packages are unsuitable for small MEMS-devices. It is the task of this Master thesis to create a universal test device to measure and to compare the hermeticities of different wafer-level packaging concepts, especially for RF MEMS devices. Resonator structures were found to be most suitable to measure low pressures and low pressure changes over time, due to the high sensitivity of their Q-value to the pressure in the cavity. The resonators are electrostatically actuated by using a novel coupling concept of the excitation voltage. The detection of the resonator movement is done by laser-interferometry. Sensors fulfilling the specific demands were designed, simulated and fabricated in the cleanroom. The fabrication process is based on SOI (Silicon On Insulator) wafers. Finally, the sensors were evaluated and characterized. A suitable resonator with a length of 500 μm reaches a Q-factor of 8070, at an ambient pressure of 0,02 mbar, and a resonance frequency of 36329 Hz. The sensitivity of the Q-value to pressure change is 4000 %/mbar at 0,02 mbar. This work was carried out within the Summit RF MEMS project, a collaborative project involving Ericsson, the Royal Institute of Technology-S3, Acreo and Saab Ericsson Space.
| Author | : Sebastian Fischer |
| Publisher | : GRIN Verlag |
| Total Pages | : 133 |
| Release | : 2007-08-06 |
| Genre | : Science |
| ISBN | : 363870095X |
Master's Thesis from the year 2002 in the subject Electrotechnology, grade: 1.0 (A), University of Applied Sciences Berlin (FB1), 49 entries in the bibliography, language: English, abstract: Common test standards for evaluating the hermeticity of microsystem packages are unsuitable for small MEMS-devices. It is the task of this Master thesis to create a universal test device to measure and to compare the hermeticities of different wafer-level packaging concepts, especially for RF MEMS devices. Resonator structures were found to be most suitable to measure low pressures and low pressure changes over time, due to the high sensitivity of their Q-value to the pressure in the cavity. The resonators are electrostatically actuated by using a novel coupling concept of the excitation voltage. The detection of the resonator movement is done by laser-interferometry. Sensors fulfilling the specific demands were designed, simulated and fabricated in the cleanroom. The fabrication process is based on SOI (Silicon On Insulator) wafers. Finally, the sensors were evaluated and characterized. A suitable resonator with a length of 500 m reaches a Q-factor of 8070, at an ambient pressure of 0,02 mbar, and a resonance frequency of 36329 Hz. The sensitivity of the Q-value to pressure change is 4000 %/mbar at 0,02 mbar. This work was carried out within the Summit RF MEMS project, a collaborative project involving Ericsson, the Royal Institute of Technology-S3, Acreo and Saab Ericsson Space.
| Author | : Stepan Lucyszyn |
| Publisher | : Cambridge University Press |
| Total Pages | : 441 |
| Release | : 2010-08-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1139491660 |
An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation
| Author | : Markku Tilli |
| Publisher | : Elsevier |
| Total Pages | : 1028 |
| Release | : 2020-04-17 |
| Genre | : Technology & Engineering |
| ISBN | : 012817787X |
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. - Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits - Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures - Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements - Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
| Author | : Nguyen Van Toan |
| Publisher | : CRC Press |
| Total Pages | : 177 |
| Release | : 2019-07-10 |
| Genre | : Technology & Engineering |
| ISBN | : 0429556527 |
Microfabricated resonators play an essential role in a variety of applications, including mass sensing, timing reference applications, and filtering applications. Many transduction mechanisms including piezoelectric, piezoresistive, and capacitive mechanisms, have been studied to induce and detect the motion of resonators. This book is meant to introduce and suggest several technological approaches together with design considerations for performance enhancement of capacitive silicon resonators, and will be useful for those working in field of micro and nanotechnology. Features Introduces and suggests several technological approaches together with design considerations for performance enhancement of capacitive silicon resonators Provides information on the various fabrication technologies and design considerations that can be employed to improve the performance capacitive silicon resonator which is one of the promising options to replace the quartz crystal resonator. Discusses several technological approaches including hermetic packaging based on the LTCC substrate, deep reactive ion etching, neutral beam etching technology, and metal-assisted chemical etching, as well as design considerations for mechanically coupled, selective vibration of high-order mode, movable electrode structures, and piezoresistive heat engines were investigated to achieve small motional resistance, low insertion loss, and high quality factor. Focusses on a capacitive sensing method based on the measurement of the change in capacitance between a sensing electrode and the resonant body. Reviews recent progress in performance enhancement methods for capacitive silicon resonator, which are mainly based on the works of the authors.
| Author | : Yung-cheng Lee |
| Publisher | : World Scientific |
| Total Pages | : 363 |
| Release | : 2018-01-03 |
| Genre | : Technology & Engineering |
| ISBN | : 9813229373 |
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
| Author | : John H. Lau |
| Publisher | : Springer |
| Total Pages | : 381 |
| Release | : 2019-04-03 |
| Genre | : Technology & Engineering |
| ISBN | : 9811372241 |
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
| Author | : Allyson L. Hartzell |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 300 |
| Release | : 2010-11-02 |
| Genre | : Technology & Engineering |
| ISBN | : 144196018X |
The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.
| Author | : Osamu Tabata |
| Publisher | : John Wiley & Sons |
| Total Pages | : 328 |
| Release | : 2008-02-04 |
| Genre | : Technology & Engineering |
| ISBN | : 9783527314942 |
This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
| Author | : Reza Ghodssi |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 1211 |
| Release | : 2011-03-18 |
| Genre | : Technology & Engineering |
| ISBN | : 0387473181 |
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
