Nontraditional Methods of Sensing Stress, Strain, and Damage in Materials and Structures

Nontraditional Methods of Sensing Stress, Strain, and Damage in Materials and Structures
Author: Peter C. McKeighan
Publisher: ASTM International
Total Pages: 217
Release: 2001
Genre: Detectors
ISBN: 0803128827

A further 13 papers from a November 1999 symposium in Kansas City, Missouri cover fracture mechanics and structural integrity, damage evolution and measurement, and techniques to measure strain and displacement. The topics include sensing crack nucleation and growth in hard alpha defects embedded in

Springer Handbook of Experimental Solid Mechanics

Springer Handbook of Experimental Solid Mechanics
Author: William N. Sharpe, Jr.
Publisher: Springer Science & Business Media
Total Pages: 1100
Release: 2008-12-04
Genre: Mathematics
ISBN: 0387268839

The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line computers for rapid data processing and the combined use of experimental and numerical techniques have greatly expanded the capabilities of experimental mechanics. New exciting topics are included on biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics. Presenting complete instructions to various areas of experimental solid mechanics, guidance to detailed expositions in important references, and a description of state-of-the-art applications in important technical areas, this thoroughly revised and updated edition is an excellent reference to a widespread academic, industrial, and professional engineering audience.

Measurement of Stress Distributions on Silicon IC Chips Using Piezoresistive Sensors

Measurement of Stress Distributions on Silicon IC Chips Using Piezoresistive Sensors
Author: Jeffrey C. Suhling
Publisher:
Total Pages: 26
Release: 2001
Genre: Detectors
ISBN:

Structural reliability of integrated circuit chips in electronic packages continues to be a major concern due to ever-increasing die size, circuit densities, power dissipation, and operating temperatures. A powerful method for experimental evaluation of silicon die stress distributions is the use of test chips incorporating integral piezoresistive sensors. In this paper, a review is made of the state-of-the-art in the area of silicon piezoresistive stress sensor test chips. Developments in sensor theory, calibration methods, and packaging applications are presented.

Green Electronics Manufacturing

Green Electronics Manufacturing
Author: John X. Wang
Publisher: CRC Press
Total Pages: 350
Release: 2012-07-25
Genre: Technology & Engineering
ISBN: 1439826692

Going "green" is becoming a major component of the mission for electronics manufacturers worldwide. While this goal seems simplistic, it poses daunting dilemmas. Yet, to compete effectively in the global economy, manufacturers must take the initiative to drive this crucial movement. Green Electronics Manufacturing: Creating Environmental Sensible P

Sensors, Mechanical Sensors

Sensors, Mechanical Sensors
Author: Wolfgang Göpel
Publisher: John Wiley & Sons
Total Pages: 692
Release: 2008-11-20
Genre: Technology & Engineering
ISBN: 3527620729

'Sensors' is the first self-contained series to deal with the wholearea of sensors. It describes general aspects, technical andphysical fundamentals, construction, function, applications anddevelopments of the various types of sensors. This volume contains the physical and technical fundamentals ofmechanical sensors, and contains and assesses the various types ofsensors for particular applications. Of interest to engineers,physicists, chemists and others involved in sensor technology.

Proceedings

Proceedings
Author:
Publisher:
Total Pages: 1796
Release: 2000
Genre: Electronic apparatus and appliances
ISBN:

Transducers ’01 Eurosensors XV

Transducers ’01 Eurosensors XV
Author: Ernst Obermeier
Publisher: Springer
Total Pages: 1763
Release: 2016-05-12
Genre: Technology & Engineering
ISBN: 3642594972

The Conference is the premier international meeting for the presentation of original work addressing all aspects of the theory, design, fabrication, assembly, packaging, testing and application of solid-state sensors, actuators, MEMS, and microsystems.

Paper

Paper
Author:
Publisher:
Total Pages: 398
Release: 1992
Genre: Mechanical engineering
ISBN: