Implications of Emerging Micro- and Nanotechnologies

Implications of Emerging Micro- and Nanotechnologies
Author: National Research Council
Publisher: National Academies Press
Total Pages: 267
Release: 2003-02-06
Genre: Technology & Engineering
ISBN: 030908623X

Expansion of micro-technology applications and rapid advances in nano-science have generated considerable interest by the Air Force in how these developments will affect the nature of warfare and how it could exploit these trends. The report notes four principal themes emerging from the current technological trends: increased information capability, miniaturization, new materials, and increased functionality. Recommendations about Air Force roles in micro- and nanotechnology research are presented including those areas in which the Air Force should take the lead. The report also provides a number of technical and policy findings and recommendations that are critical for effective development of the Air Force's micro- and nano-science and technology program

Advanced Structural Materials

Advanced Structural Materials
Author: Winston O. Soboyejo
Publisher: CRC Press
Total Pages: 526
Release: 2006-12-21
Genre: Technology & Engineering
ISBN: 1420017462

A snapshot of the central ideas used to control fracture properties of engineered structural metallic materials, Advanced Structural Materials: Properties, Design Optimization, and Applications illustrates the critical role that advanced structural metallic materials play in aerospace, biomedical, automotive, sporting goods, and other indust

Mechanical Properties of Structural Films

Mechanical Properties of Structural Films
Author: Christopher L. Muhlstein
Publisher: ASTM International
Total Pages: 333
Release: 2001
Genre: Gold films
ISBN: 0803128894

Recent advances in the mechanical properties of structural films are described in these papers from a November 2000 symposium held in Orlando, Florida. Papers are organized in sections on fracture and fatigue of structural films, elastic behavior and residual stress in thin films, tensile testing of

Materials Science of Microelectromechanical Systems (MEMS) Devices IV: Volume 687

Materials Science of Microelectromechanical Systems (MEMS) Devices IV: Volume 687
Author: Arturo A. AyĆ³n
Publisher:
Total Pages: 344
Release: 2002-05-23
Genre: Technology & Engineering
ISBN:

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2002, focuses on the materials science of MEMS structures and the films involved to create those structures.

Molecular Electronics: Volume 582

Molecular Electronics: Volume 582
Author: Sokrates T. Pantelides
Publisher:
Total Pages: 144
Release: 2001-01-19
Genre: Technology & Engineering
ISBN:

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Si Front End Processing - Physics and Technology II of Dopant-Defect Interactions II: Volume 610

Si Front End Processing - Physics and Technology II of Dopant-Defect Interactions II: Volume 610
Author: Aditya Agarwal
Publisher:
Total Pages: 448
Release: 2001-04-09
Genre: Technology & Engineering
ISBN:

This proceedings of the April 2000 symposium deals with formation of electrical junctions in the front-end processing of devices for the approaching end-of-the-roadmap. The 60 papers address 2D dopant characterization, ion implantation and shallow junction technology, group III diffusion and activation, carbon diffusion and activation, group V diffusion and activation, vacancy-type defects, regrown amorphous layers, and structure and properties of point and extended defects. Topics include ultra-shallow junction formation and gate activation in deep-submicron CMOS, low energy implantation of boron with decaborane ions, modeling ramp rate effects on shallow junction formation, clustering equilibrium and deactivation kinetics in As doped silicon, and atomistic modeling of complex silicon processing scenarios. c. Book News Inc.

Semiconductor Wafer Bonding

Semiconductor Wafer Bonding
Author: H. Baumgart
Publisher: The Electrochemical Society
Total Pages: 310
Release: 2002
Genre: Technology & Engineering
ISBN: 9781566773607