Materials Integration
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| Author | : Achim Menges |
| Publisher | : John Wiley & Sons |
| Total Pages | : 147 |
| Release | : 2012-04-02 |
| Genre | : Architecture |
| ISBN | : 0470973307 |
The production of architecture, both intellectually and physically, is on the brink of a fundamental change. Computational design enables architects to integrate ever more multifaceted and complex design information, while the industrial logics of conventional building construction are eroding rapidly in a context of increasingly ubiquitous computer-controlled manufacturing and fabrication. A novel convergence of computation and materialisation is about to emerge, bringing the virtual process of design and the physical realisation of architecture much closer together, more so than ever before. Computation provides a powerful agency for both informing the design process through specific material behaviour and characteristics, and in turn informing the organisation of matter and material across multiple scales based on feedback from the environment. Computational design and integrated materialisation processes allow for uncovering the inherent morphogenetic potential of materials and thus are opening up a largely uncharted field of possibilities for the way the built environment in the 21st century is conceived and produced. In order to effectively introduce and outline the enabling power of computational design along with its inherent relationship to a biological paradigm, this publication looks at formation and materialisation in nature, integrative computational design, and engineering and manufacturing integration. Architectural contributors include: Cristiano Cecatto, Neri Oxman, Skylar Tibbits and Michael Weinstock. A scientific perspective by Philip Ball and J Scott Turner. Features: Buro Happold's SMART group, DiniTech, Foster + Partners' Specialist Modelling Group, the Freeform Construction group and Stuttgart University's Institute for Computational Design.
| Author | : Christopher Jenkins |
| Publisher | : Academic Press |
| Total Pages | : 410 |
| Release | : 2005-03-15 |
| Genre | : Science |
| ISBN | : 0123838525 |
& Quot;The unifying treatment of structural design presented here should prove useful to any engineer involved in the design of structures. A crucial divide to be bridged is that between applied mechanics and materials science. The onset of specialization and the rapid rise of technology, however, have created separate disciplines concerned with the deformation of solid materials. Unfortunately, the result is in many cases that society loses out on having at their service efficient, high-performance material/structural systems. & quot. & quot;We follow in this text a very methodological process to introduce mechanics, materials, and design issues in a manner called total structural design. The idea is to seek a solution in & quot;total design space. & quot; & quot. & quot;The material presented in this text is suitable for a first course that encompasses both the traditional mechanics of materials and properties of materials courses. The text is also appropriate for a second course in mechanics of materials or a follow-on course in design of structures, taken after the typical introductory mechanics and properties courses. This text can be adapted to several different curriculum formats, whether traditional or modern. Instructors using the text for a traditional course may find that the text in fact facilitates transforming their course over time to a more modern, integrated approach. & quot;--BOOK JACKET.
| Author | : William D. Brown |
| Publisher | : The Electrochemical Society |
| Total Pages | : 384 |
| Release | : 1998 |
| Genre | : Technology & Engineering |
| ISBN | : 9781566771979 |
| Author | : Beno Benhabib |
| Publisher | : CRC Press |
| Total Pages | : 616 |
| Release | : 2003-07-03 |
| Genre | : Technology & Engineering |
| ISBN | : 9780203911204 |
From concept development to final production, this comprehensive text thoroughly examines the design, prototyping, and fabrication of engineering products and emphasizes modern developments in system modeling, analysis, and automatic control. This reference details various management strategies, design methodologies, traditional production techniqu
| Author | : Francis E. H. Tay |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 328 |
| Release | : 2002-08-31 |
| Genre | : Technology & Engineering |
| ISBN | : 9781402071751 |
The field of materials and process integration for MEMS research has an extensive past as well as a long and promising future. Researchers, academicians and engineers from around the world are increasingly devoting their efforts on the materials and process integration issues and opportunities in MEMS devices. These efforts are crucial to sustain the long-term growth of the MEMS field. The commercial MEMS community is heavily driven by the push for profitable and sustainable products. In the course of establishing high volume and low-cost production processes, the critical importance of materials properties, behaviors, reliability, reproducibility, and predictability, as well as process integration of compatible materials systems become apparent. Although standard IC fabrication steps, particularly lithographic techniques, are leveraged heavily in the creation of MEMS devices, additional customized and novel micromachining techniques are needed to develop sophisticated MEMS structures. One of the most common techniques is bulk micromachining, by which micromechanical structures are created by etching into the bulk of the substrates with either anisotropic etching with strong alk:ali solution or deep reactive-ion etching (DRIB). The second common technique is surface micromachining, by which planar microstructures are created by sequential deposition and etching of thin films on the surface of the substrate, followed by a fmal removal of sacrificial layers to release suspended structures. Other techniques include deep lithography and plating to create metal structures with high aspect ratios (LIGA), micro electrodischarge machining (J.
| Author | : Koji Yamada |
| Publisher | : Frontiers Media SA |
| Total Pages | : 111 |
| Release | : 2015-11-10 |
| Genre | : Engineering (General). Civil engineering (General) |
| ISBN | : 2889196933 |
Silicon photonics technology, which has the DNA of silicon electronics technology, promises to provide a compact photonic integration platform with high integration density, mass-producibility, and excellent cost performance. This technology has been used to develop and to integrate various photonic functions on silicon substrate. Moreover, photonics-electronics convergence based on silicon substrate is now being pursued. Thanks to these features, silicon photonics will have the potential to be a superior technology used in the construction of energy-efficient cost-effective apparatuses for various applications, such as communications, information processing, and sensing. Considering the material characteristics of silicon and difficulties in microfabrication technology, however, silicon by itself is not necessarily an ideal material. For example, silicon is not suitable for light emitting devices because it is an indirect transition material. The resolution and dynamic range of silicon-based interference devices, such as wavelength filters, are significantly limited by fabrication errors in microfabrication processes. For further performance improvement, therefore, various assisting materials, such as indium-phosphide, silicon-nitride, germanium-tin, are now being imported into silicon photonics by using various heterogeneous integration technologies, such as low-temperature film deposition and wafer/die bonding. These assisting materials and heterogeneous integration technologies would also expand the application field of silicon photonics technology. Fortunately, silicon photonics technology has superior flexibility and robustness for heterogeneous integration. Moreover, along with photonic functions, silicon photonics technology has an ability of integration of electronic functions. In other words, we are on the verge of obtaining an ultimate technology that can integrate all photonic and electronic functions on a single Si chip. This e-Book aims at covering recent developments of the silicon photonic platform and novel functionalities with heterogeneous material integrations on this platform.
| Author | : P.J. Lemstra |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 409 |
| Release | : 2012-12-06 |
| Genre | : Science |
| ISBN | : 9400911157 |
The Rolduc Polymer Meetings, of which the contents of this volume represent the third, are already on their way to occupying a unique place in the crowded calendar of symposia on every aspect of polymer science and engineering. They combine manageable meeting size with a theme, 'Integration of Fundamental Polymer Science and Technology', which is often discussed but seldom realized in practice. The technological, or applied, areas of polymers have perhaps received more emphasis historically than those of other allied disciplines. Indeed, various plastic and rubber materials were successful items of commerce long before the macromolecular concept itself was firmly established. The more fundamental aspects of the field were also largely developed in industrial laboratories. The early work of Mark and Meyer at IG Farben, and that of Carrothers and Flory at Du Pont, are good examples of this. The present situation, in which polymers are being applied to more and more demanding end uses, from high performance materials on the one hand to the biomedical and electronics fields on the other, caIls for an ever greater understanding of the basic scientific principles governing their behavior. It is evident, therefore, that interactions between those engaged in the 'pure' and 'applied' parts of the field must be promoted effectively. The Rolduc Polymer Meetings contribute significantly to such interactions, not only by interweaving technological and scientific presentations, but also by providing a forum for the participants to discuss problems of mutual interest in all their complexity.
| Author | : Waldemar Karwowski |
| Publisher | : Springer |
| Total Pages | : 791 |
| Release | : 2017-12-30 |
| Genre | : Technology & Engineering |
| ISBN | : 3319738887 |
This book reports on research on innovative human systems integration and human-machine interaction, with an emphasis on artificial intelligence and automation, as well as computational modeling and simulation. It covers a wide range of applications in the area of design, construction and operation of products, systems and services, including lifecycle development and human-technology interaction. The book describes advanced methodologies and tools for evaluating and improving interface usability, new models, as well as case studies and best practices in virtual, augmented and mixed reality systems, with a special focus on dynamic environments. It also discusses different factors concerning the human, hardware, and artificial intelligence software. Based on the proceedings of the 1st International Conference on Intelligent Human Systems Integration (IHSI 2018), held on January 7-9, 2018, in Dubai, United Arab Emirates, the book also examines the forces that are currently shaping the nature of computing and cognitive systems, such as the need for decreasing hardware costs; the importance of infusing intelligence and automation, and the related trend toward hardware miniaturization and power reduction; the necessity for a better assimilation of computation in the environment; and the social concerns regarding access to computers and systems for people with special needs. It offers a timely survey and a practice-oriented reference guide to policy- and decision-makers, human factors engineers, systems developers and users alike.
| Author | : Francesca Iacopi |
| Publisher | : Springer Nature |
| Total Pages | : 271 |
| Release | : 2023-02-17 |
| Genre | : Technology & Engineering |
| ISBN | : 3031216105 |
This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.
| Author | : Katsuyuki Sakuma |
| Publisher | : CRC Press |
| Total Pages | : 211 |
| Release | : 2018-04-17 |
| Genre | : Technology & Engineering |
| ISBN | : 1351779826 |
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
