Thin Film Transistors: Polycrystalline silicon thin film transistors

Thin Film Transistors: Polycrystalline silicon thin film transistors
Author: Yue Kuo
Publisher: Springer Science & Business Media
Total Pages: 528
Release: 2004
Genre: Thin film transistors
ISBN: 9781402075063

This is the first reference on amorphous silicon and polycrystalline silicon thin film transistors that gives a systematic global review of all major topics in the field. These volumes include sections on basic materials and substrates properties, fundamental device physics, critical fabrication processes (structures, a-Si: H, dielectric, metallization, catalytic CVD), and existing and new applications. The chapters are written by leading researchers who have extensive experience with reputed track records. Thin Film Transistors provides practical information on preparing individual functional a-Si: H TFTs and poly-Si TFTs as well as large-area TFT arrays. Also covered are basic theories on the a-Si: H TFT operations and unique material characteristics. Readers are also exposed to a wide range of existing and new applications in industries.

JJAP

JJAP
Author:
Publisher:
Total Pages: 1168
Release: 2005
Genre: Engineering
ISBN:

Thin-Film Transistors

Thin-Film Transistors
Author: Cherie R. Kagan
Publisher: CRC Press
Total Pages: 543
Release: 2003-02-25
Genre: Technology & Engineering
ISBN: 0203911776

This is a single-source treatment of developments in TFT production from international specialists. It interweaves overlapping areas in multiple disciplines pertinent to transistor fabrication and explores the killer application of amorphous silicon transistors in active matrix liquid crystal displays. It evaluates the preparation of polycrystallin

Metal Induced Crystallization and Polysilicon Thin Film Transistors

Metal Induced Crystallization and Polysilicon Thin Film Transistors
Author: Bo Zhang
Publisher:
Total Pages: 84
Release: 2009-05-01
Genre: Technology & Engineering
ISBN: 9783639158281

Nowadays,active-matrix addressing using a-Si TFTs is dominating in the flat panel display markets. However, low temperature polysilicon has been proposed and considered to be a promising alternative technology. Metal induced crystallization (MIe is one of the methods to obtain high quality polysilicon films at low temperatures. A few technologies are presented in this monograph, which improve the quality of MIC polysilicon film and hence the performance of TFTs built on. Amelioration of MIC processes has been made to produce high performance polysilicon TFTs using solution based MIC (SMIe and defined-grain MIC (DG-MIe methods. Novel post-annealing technologies are also introduced to reduce the micro-defects in MIC polysilicon film and hence to achieve better performance. These technologies include YAG laser post-annealing and flash lamp post-annealing. Particularly, it is the first time to report the application of flash lamp annealing technology in the fabrication of low temperature polysilicon and TFTs.

A Novel Device Structure for Low-Temperature Polysilicon TFTs With Controlled Gain Growth in Channel Regions

A Novel Device Structure for Low-Temperature Polysilicon TFTs With Controlled Gain Growth in Channel Regions
Author: Li-Jung Cheng
Publisher:
Total Pages: 4
Release: 2000
Genre:
ISBN:

In this paper we demonstrate a novel device structure of low-temperature polysilicon thin-film transistors (LTPS TFTs) for AMLCD applications with using excimer-laser crystallization (ELC). The device structure consists of a thin channel and a thick source/drain. This structure has its merit in the process of ELC and is capable of improving TFTs electrical characteristics. During excimer laser irradiation this kind of recessed structure is able to build up localized lateral thermal gradients in the regions near the steps and entice crystallization from the chiller/thick source/drain regions toward the hotter thin channels. Because of the development of crystallization process, the average field-effect mobility of the devices can be increased to about 350 cm(2)/V.s, and the on/off current ratios exceed eight orders. In addition to improvement of device performance, the process window of ELC is broadened with the recessed structure.