Ipc T 50n Terms And Definitions For Interconnecting And Packaging Electronic Circuits
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IPC-T-50N Terms and Definitions for Interconnecting and Packaging Electronic Circuits
| Author | : IPC International |
| Publisher | : |
| Total Pages | : |
| Release | : 2021-10-31 |
| Genre | : |
| ISBN | : 9781638160380 |
Electric Drives and Electromechanical Systems
| Author | : Richard Crowder |
| Publisher | : Butterworth-Heinemann |
| Total Pages | : 324 |
| Release | : 2019-10-19 |
| Genre | : Technology & Engineering |
| ISBN | : 0081028857 |
Electric Drives and Electromechanical Devices: Applications and Control, Second Edition, presents a unified approach to the design and application of modern drive system. It explores problems involved in assembling complete, modern electric drive systems involving mechanical, electrical, and electronic elements. This book provides a global overview of design, specification applications, important design information, and methodologies.This new edition has been restructured to present a seamless, logical discussion on a wide range of topical problems relating to the design and specification of the complete motor-drive system. It is organised to establish immediate solutions to specific application problem. Subsidiary issues that have a considerable impact on the overall performance and reliability, including environmental protection and costs, energy efficiency, and cyber security, are also considered. - Presents a comprehensive consideration of electromechanical systems with insights into the complete drive system, including required sensors and mechanical components - Features in-depth discussion of control schemes, particularly focusing on practical operation - Includes extensive references to modern application domains and real-world case studies, such as electric vehicles - Considers the cyber aspects of drives, including networking and security
Semiconductor Advanced Packaging
| Author | : John H. Lau |
| Publisher | : Springer Nature |
| Total Pages | : 513 |
| Release | : 2021-05-17 |
| Genre | : Technology & Engineering |
| ISBN | : 9811613761 |
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Fundamentals of Machine Component Design
| Author | : Robert C. Juvinall |
| Publisher | : John Wiley & Sons |
| Total Pages | : 805 |
| Release | : 2020-06-23 |
| Genre | : Technology & Engineering |
| ISBN | : 1119723604 |
Fundamentals of Machine Component Design presents a thorough introduction to the concepts and methods essential to mechanical engineering design, analysis, and application. In-depth coverage of major topics, including free body diagrams, force flow concepts, failure theories, and fatigue design, are coupled with specific applications to bearings, springs, brakes, clutches, fasteners, and more for a real-world functional body of knowledge. Critical thinking and problem-solving skills are strengthened through a graphical procedural framework, enabling the effective identification of problems and clear presentation of solutions. Solidly focused on practical applications of fundamental theory, this text helps students develop the ability to conceptualize designs, interpret test results, and facilitate improvement. Clear presentation reinforces central ideas with multiple case studies, in-class exercises, homework problems, computer software data sets, and access to supplemental internet resources, while appendices provide extensive reference material on processing methods, joinability, failure modes, and material properties to aid student comprehension and encourage self-study.
Foldable Flex and Thinned Silicon Multichip Packaging Technology
| Author | : John W. Balde |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 382 |
| Release | : 2003-01-31 |
| Genre | : Computers |
| ISBN | : 9780792376767 |
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Much of the work in this field has not been widely disseminated other than by papers presented at conferences and workshops. This book is organized to report on the developments in this technology, but with special additional material and emphasis. The intent is to do more than report on present state of the art. It is intended as an advocacy book, pointing out the reasons for 3-D assemblies, the reasons for Silicon-in-a-Package multichip modules, and the commercial availability of the techniques. The contributing authors, all leaders in this technical field, explore the needs, reveal the state of development and production, and point to changes in technology that can bring this technology into wider use for more complex applications. It is an advocacy book in this respect - advocacy for the use of a technology that is already mature, and advocacy for exploring ways to make it even more capable for the future. It will also do more than discuss the present; it will point out the deficiencies of the constructions, the needed availability of good flex material, the use of newer flex materials, such as LCP, and the implications from the use of the Integrated Mesh Power Systems to enhance the capability for future designs. Lastly it will discuss the serious problem of heat removal if multiple microprocessors are included.
Analog Circuit Design
| Author | : Johan Huijsing |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 466 |
| Release | : 1992-12-31 |
| Genre | : Computers |
| ISBN | : 9780792392880 |
This volume of Analog Circuit Design concentrates on three topics: Operational Amplifiers. A-to-D converters and Analog CAD. The book comprises six papers on each topic written by internationally recognised experts. These papers have a tutorial nature aimed at improving the design of analog circuits. The book is divided into three parts. Part I, Operational Amplifiers, presents new technologies for the design of Op-Amps in both bipolar and CMOS technologies. Two papers demonstrate techniques for improving frequency and gain behavior at high voltage. Low voltage bipolar Op-Amp design is treated in another paper. The realization high-speed and high gain VLSI building blocks in CMOS is demonstrated in two papers. The final paper shows how to provide output power with CMOS buffer amplifiers. Part II, Analog-to-Digital Conversion, presents papers which address very high conversion speeds and very high resolution implementations using sigma-delta modulation architectures. Analog to Digital converters provide the link between the analog world of transducers and the digital world of signal processing and computing. High-performance bipolar and MOS technologies result in high-resolution or high-speed convertors which can be applied in digital audio or video systems. Furthermore, the advanced high-speed bipolar technologies show an increase in conversion speed into the gigahertz range. Part III, Analog Computer Aided Design, presents the latest research towards providing analog circuit designers with the tools needed to automate much of the design process. The techniques and methodologies described demonstrate the advances being made in developing analog design tools comparable with those already available for digital design. The papers in this volume are based on those presented at the Workshop on Advances in Analog Circuit Design held in Delft, The Netherlands in 1992. The main intention of the workshop was to brainstorm with a group of about 100 analog design experts on the new possibilities and future developments on the above topics. The result of this brainstorming is contained in Analog Circuit Design, which is thus an important reference for researchers and design engineers working in the forefront of analog circuit design and research.
Fundamentals of Power Electronics
| Author | : Robert W. Erickson |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 882 |
| Release | : 2007-05-08 |
| Genre | : Technology & Engineering |
| ISBN | : 0306480484 |
Fundamentals of Power Electronics, Second Edition, is an up-to-date and authoritative text and reference book on power electronics. This new edition retains the original objective and philosophy of focusing on the fundamental principles, models, and technical requirements needed for designing practical power electronic systems while adding a wealth of new material. Improved features of this new edition include: A new chapter on input filters, showing how to design single and multiple section filters; Major revisions of material on averaged switch modeling, low-harmonic rectifiers, and the chapter on AC modeling of the discontinuous conduction mode; New material on soft switching, active-clamp snubbers, zero-voltage transition full-bridge converter, and auxiliary resonant commutated pole. Also, new sections on design of multiple-winding magnetic and resonant inverter design; Additional appendices on Computer Simulation of Converters using averaged switch modeling, and Middlebrook's Extra Element Theorem, including four tutorial examples; and Expanded treatment of current programmed control with complete results for basic converters, and much more. This edition includes many new examples, illustrations, and exercises to guide students and professionals through the intricacies of power electronics design. Fundamentals of Power Electronics, Second Edition, is intended for use in introductory power electronics courses and related fields for both senior undergraduates and first-year graduate students interested in converter circuits and electronics, control systems, and magnetic and power systems. It will also be an invaluable reference for professionals working in power electronics, power conversion, and analogue and digital electronics.
Modeling and Simulation of Systems Using MATLAB and Simulink
| Author | : Devendra K. Chaturvedi |
| Publisher | : CRC Press |
| Total Pages | : 734 |
| Release | : 2017-12-19 |
| Genre | : Computers |
| ISBN | : 143980673X |
Not only do modeling and simulation help provide a better understanding of how real-world systems function, they also enable us to predict system behavior before a system is actually built and analyze systems accurately under varying operating conditions. Modeling and Simulation of Systems Using MATLAB® and Simulink® provides comprehensive, state-of-the-art coverage of all the important aspects of modeling and simulating both physical and conceptual systems. Various real-life examples show how simulation plays a key role in understanding real-world systems. The author also explains how to effectively use MATLAB and Simulink software to successfully apply the modeling and simulation techniques presented. After introducing the underlying philosophy of systems, the book offers step-by-step procedures for modeling different types of systems using modeling techniques, such as the graph-theoretic approach, interpretive structural modeling, and system dynamics modeling. It then explores how simulation evolved from pre-computer days into the current science of today. The text also presents modern soft computing techniques, including artificial neural networks, fuzzy systems, and genetic algorithms, for modeling and simulating complex and nonlinear systems. The final chapter addresses discrete systems modeling. Preparing both undergraduate and graduate students for advanced modeling and simulation courses, this text helps them carry out effective simulation studies. In addition, graduate students should be able to comprehend and conduct simulation research after completing this book.
