Integrated Circuit Quality and Reliability

Integrated Circuit Quality and Reliability
Author: Eugene R. Hnatek
Publisher:
Total Pages: 736
Release: 1987
Genre: Technology & Engineering
ISBN:

Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.

Integrated Circuit Quality and Reliability

Integrated Circuit Quality and Reliability
Author: Eugene R. Hnatek
Publisher: CRC Press
Total Pages: 809
Release: 2018-10-03
Genre: Technology & Engineering
ISBN: 1482277719

Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.

Techniques for the Control of Integrated Circuit Quality and Reliability Volume Ii - Appendices

Techniques for the Control of Integrated Circuit Quality and Reliability Volume Ii - Appendices
Author: Erwin A. Herr
Publisher:
Total Pages: 317
Release: 1967
Genre:
ISBN:

This is a program directed to establish techniques for the control of integrated circuit quality and reliability. The primary objective of this program was to investigate a method to monitor integrated circuit fabrication which would provide information about the quality and reliability of the device. The use of the test pattern concept, TEG, for in-process quality control and device reliability of integrated circuits was investigated during the fabrication and reliability testing phases of integrated circuit production. The Test Element Group (TEG), which was diffused on the wafer at the same time as the elements of the integrated circuit, proved to be a very successful vehicle for achieving the goals of this program. The TEG was made up of a number of selected elements in the integrated circuit diffusion pattern, metallized and connected for test evaluation as discrete components. The relationship was investigated between in-process variables of semiconductor fabrication, pre-stress characteristics of TEGS and integrated circuits and the post-stress characteristics of TEGS and integrated circuits.

Integrated Circuit Failure Analysis

Integrated Circuit Failure Analysis
Author: Friedrich Beck
Publisher: John Wiley & Sons
Total Pages: 198
Release: 1998-02-04
Genre: Technology & Engineering
ISBN: 9780471974017

Funktionstests an integrierten Schaltungen sind für deren Zuverlässigkeit von herausragender Bedeutung. Erstmals werden in diesem Werk die speziellen Präparationstechniken für die Fehleranalyse beschrieben. Ausgehend von den theoretischen Grundlagen erläutert der Autor in praxisnahem Stil die verschiedenen Techniken, die das Zurückverfolgen von Ausfällen ermöglichen.

Techniques for the Control of Integrated Circuit Quality and Reliability

Techniques for the Control of Integrated Circuit Quality and Reliability
Author: Erwin A. Herr
Publisher:
Total Pages: 332
Release: 1967
Genre:
ISBN:

The use of the test pattern concept, TEG, for in-process quality control and device reliability of integrated circuits was investigated during the fabrication and reliability testing phases of integrated circuit production. The Test Element Group (TEG), which was diffused on the wafer at the same time as the elements of the integrated circuit, proved to be a very successful vehicle for achieving the goals of this program. The TEG was made up of a number of selected elements in the integrated circuit diffusion pattern, metallized and connected for test evaluation as discrete components. The relationship was investigated between in-process variables of semi-conductor fabrication, pre-stress characteristics of TEGS and integrated circuits and the post-stress characteristics of TEGS and integrated circuits. The basic purpose of this program has been met.

Thermal and Power Management of Integrated Circuits

Thermal and Power Management of Integrated Circuits
Author: Arman Vassighi
Publisher: Springer Science & Business Media
Total Pages: 188
Release: 2006-06-01
Genre: Technology & Engineering
ISBN: 0387297499

In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Integrated Circuit Reliability and Manufacturing Science Program

Integrated Circuit Reliability and Manufacturing Science Program
Author: Joseph H. Scott
Publisher:
Total Pages: 97
Release: 1973
Genre:
ISBN:

The report describes results of a study aimed at lowering the cost of high-reliability integrated circuits. The circuit family chosen for the study was RCA's CMOS product line, and recommendations are developed specifying changes in the existing process line, aimed at improving the reliability of the finished products. The intention has been to provide reliability inspection and quality control procedures which can be distributed throughout the manufacturing process, replacing the present approach of performing all high-reliability screening at the end of the manufacturing process. The cost and trade-offs of implementing these changes have been analyzed where possible. Where such analysis was not possible, a research schedule was prepared to provide the data necessary for evaluation of the proposed change. The most important of the proposed changes form an integrated concept in which wafers move through an automated production line under computer control.

Guidebook for Managing Silicon Chip Reliability

Guidebook for Managing Silicon Chip Reliability
Author: Michael Pecht
Publisher: CRC Press
Total Pages: 228
Release: 2017-11-22
Genre: Technology & Engineering
ISBN: 1351443569

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

Integrated Circuit Report

Integrated Circuit Report
Author: Thomas A. Hollingworth
Publisher:
Total Pages: 58
Release: 1971
Genre:
ISBN:

An evaluation was accomplished of the design, fabrication, inspection and testing of integrated circuits (ICs) as practiced by the electronics industry. An analysis was made of failure modes and causes of failure. The purpose was to disseminate information on current IC technology to AFSC Quality Assurance personnel. A corollary purpose was to improve the quality and reliability of hardware using these devices. (Author).

Failure Analysis of Integrated Circuits

Failure Analysis of Integrated Circuits
Author: Lawrence C. Wagner
Publisher: Springer Science & Business Media
Total Pages: 256
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1461549191

This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.