Fundamental Molecular Mechanisms Of Moisture Transport In Epoxy
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Author | : Y. Jack Weitsman |
Publisher | : Springer Science & Business Media |
Total Pages | : 189 |
Release | : 2011-11-18 |
Genre | : Technology & Engineering |
ISBN | : 1461410592 |
Fluid Effects in Polymers and Polymeric Composites, written by the late Dr. Y. Jack Weitsman, addresses the wide range of parameters that affect the interaction of fluids with polymers and polymeric composites. The book aims at broadening the scope of available data, mostly limited up to this time to weight-gain recordings of fluid ingress into polymers and composites, to the practical circumstances of fluctuating exposure. Various forms of experimental data are given, in conjunction with theoretical models derived from basic scientific principles, and correlated with severity of exposure conditions and interpreted by means of rationally based theoretical models. The practical implications of the effects of fluids are discussed. The issue of fluid effects on polymers and polymeric composites is of concern to engineers and scientists active in aerospace and naval structures, as an increasing portion of these structures are made of polymeric composites and employ polymeric adhesives as a joining device. While the book is intended for this audience, it will also interest researchers and graduate students interested in the mechanics and materials aspects of this matter.
Author | : X.J. Fan |
Publisher | : Springer Science & Business Media |
Total Pages | : 573 |
Release | : 2010-07-23 |
Genre | : Technology & Engineering |
ISBN | : 1441957197 |
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Author | : Artur Wymyslowski |
Publisher | : Springer |
Total Pages | : 203 |
Release | : 2014-11-20 |
Genre | : Technology & Engineering |
ISBN | : 3319128620 |
This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.
Author | : Li-Rong Bao |
Publisher | : |
Total Pages | : 482 |
Release | : 2001 |
Genre | : |
ISBN | : |
Author | : Sabu Thomas |
Publisher | : John Wiley & Sons |
Total Pages | : 462 |
Release | : 2014-09-04 |
Genre | : Technology & Engineering |
ISBN | : 3527666893 |
Epoxy resins are polymers which are extensively used as coating materials due to their outstanding mechanical properties and good handling characteristics. A disadvantage results from their high cross-link density: they are brittle and have very low resistance to crack growth and propagation. This necessitates the toughening of the epoxy matrix without impairing its good thermomechanical properties. The final properties of the polymer depend on their structure. The book focuses on the microstructural aspects in the modification of epoxy resins with low molecular weight liquid rubbers, one of the prime toughening agents commonly employed. The book follows thoroughly the reactions of elastomer-modified epoxy resins from their liquid stage to the network formation. It gives an in-depth view into the cure reaction, phase separation and the simultaneous development of the morphology. Chapters on ageing, failure analysis and life cycle analysis round out the book.
Author | : |
Publisher | : |
Total Pages | : 410 |
Release | : 2002 |
Genre | : Electronic packaging |
ISBN | : |
Author | : Kishore V. Pochiraju |
Publisher | : Springer Science & Business Media |
Total Pages | : 681 |
Release | : 2011-09-25 |
Genre | : Technology & Engineering |
ISBN | : 1441993088 |
Long-Term Durability of Polymeric Matrix Composites presents a comprehensive knowledge-set of matrix, fiber and interphase behavior under long-term aging conditions, theoretical modeling and experimental methods. This book covers long-term constituent behavior, predictive methodologies, experimental validation and design practice. Readers will also find a discussion of various applications, including aging air craft structures, aging civil infrastructure, in addition to engines and high temperature applications.
Author | : Golam M. Newaz |
Publisher | : CRC Press |
Total Pages | : 1068 |
Release | : 2019-11-28 |
Genre | : Technology & Engineering |
ISBN | : 1000725502 |
First published in 1998. A collection of papers presented at the Proceedings of the Eighth Japan-U.S. Conference On Composite Materials, SEPTEMBER 24 to 25 , 1998. The conference is organized by Wayne State University and American Society for Composites in cooperation with U.S. Organizing Committee and the Japanese Organizing Committee. Since the Seventh Meeting in Kyoto in 1995, this meeting brings together accomplished composite researchers between the two countries to share latest developments and advances in the field. The scope of the current conference ranges over all aspects of composite materials with some emphasis on infrastructure applications of composites. Key areas in composites are covered by 110 papers with 35 presentations from Japan.
Author | : |
Publisher | : |
Total Pages | : 484 |
Release | : 2003 |
Genre | : Electronic packaging |
ISBN | : |
Author | : Brett A. Bolan |
Publisher | : |
Total Pages | : 526 |
Release | : 1998 |
Genre | : |
ISBN | : |