Electronic Packaging and Interconnection Handbook 4/E

Electronic Packaging and Interconnection Handbook 4/E
Author: Charles A. Harper
Publisher: McGraw Hill Professional
Total Pages: 1002
Release: 2005
Genre: Technology & Engineering
ISBN: 9780071430487

Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?

Electronic Packaging and Interconnection Handbook

Electronic Packaging and Interconnection Handbook
Author: Charles A. Harper
Publisher: McGraw-Hill Companies
Total Pages: 1020
Release: 1997
Genre: Technology & Engineering
ISBN:

Charles A. Harper's 2nd edition on designing and manufacturing all the major types of electronic systems is now double the size of the 1st edition. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field

Microelectronics Packaging Handbook

Microelectronics Packaging Handbook
Author: R.R. Tummala
Publisher: Springer Science & Business Media
Total Pages: 1060
Release: 2013-11-27
Genre: Computers
ISBN: 1461560373

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Microelectronics Packaging Handbook

Microelectronics Packaging Handbook
Author: Rao Tummala
Publisher: Springer Science & Business Media
Total Pages: 662
Release: 1997-01-31
Genre: Computers
ISBN: 9780412084515

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Printed Circuit Board Materials Handbook

Printed Circuit Board Materials Handbook
Author: Martin W. Jawitz
Publisher: McGraw Hill Professional
Total Pages: 792
Release: 1997
Genre: Technology & Engineering
ISBN: 9780070324886

Select PCB materials for top performing boards. From weaving glass fiber mats to testing finished boards, this materials database offers close-up look at how to process and fabricate PCBs. It gives you hands-on working knowledge of the electrical, mechanical and physical properties of PCB raw materials.

Microelectronics Packaging Handbook

Microelectronics Packaging Handbook
Author: R.R. Tummala
Publisher: Springer Science & Business Media
Total Pages: 742
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1461540860

Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Area Array Packaging Handbook

Area Array Packaging Handbook
Author: Ken Gilleo
Publisher: McGraw Hill Professional
Total Pages: 832
Release: 2002
Genre: Business & Economics
ISBN:

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

Electronic Packaging

Electronic Packaging
Author: John H. Lau
Publisher: McGraw-Hill Professional Publishing
Total Pages: 0
Release: 1998
Genre: Electronic packaging
ISBN: 9780070371354

Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

Electronic Connector Handbook

Electronic Connector Handbook
Author: Robert S. Mroczkowski
Publisher: McGraw Hill Professional
Total Pages: 446
Release: 1998
Genre: Technology & Engineering
ISBN: 9780070414013

Includes data on connectors, this handbook covers the basic functions of connectors and details the range of electronic connectors. It discusses connector parameters in an application context to expedite implementation, and provides design and materials selection criteria for the range of connectors.

Thermal Management Handbook: For Electronic Assemblies

Thermal Management Handbook: For Electronic Assemblies
Author: Jerry E. Sergent
Publisher: McGraw Hill Professional
Total Pages: 370
Release: 1998
Genre: Science
ISBN: 9780070266995

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.