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| Author | : Marek Danielewski |
| Publisher | : |
| Total Pages | : 620 |
| Release | : 2005 |
| Genre | : Science |
| ISBN | : |
These volumes contain the contributions presented at DIMAT 2004: the Sixth International Conference on Diffusion in Materials, held in Cracow, under the Patronage of the AGH University of Science and Technology, the Institute of Metallurgy and Materials Science of the Polish Academy of Sciences and the Cracow University of Technology.
| Author | : Helmut Mehrer |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 645 |
| Release | : 2007-07-24 |
| Genre | : Technology & Engineering |
| ISBN | : 354071488X |
This book describes the central aspects of diffusion in solids, and goes on to provide easy access to important information about diffusion in metals, alloys, semiconductors, ion-conducting materials, glasses and nanomaterials. Coverage includes diffusion-controlled phenomena including ionic conduction, grain-boundary and dislocation pipe diffusion. This book will benefit graduate students in such disciplines as solid-state physics, physical metallurgy, materials science, and geophysics, as well as scientists in academic and industrial research laboratories.
| Author | : Igor Bezverkhyy |
| Publisher | : Trans Tech Publications Ltd |
| Total Pages | : 573 |
| Release | : 2012-04-12 |
| Genre | : Technology & Engineering |
| ISBN | : 3038137030 |
Selected, peer reviewed papers from the International Conference on Diffusion in Materials (DIMAT 2011), July 3-8, 2011, Dijon, France
| Author | : Ralf Riedel |
| Publisher | : John Wiley & Sons |
| Total Pages | : 624 |
| Release | : 2008-03-31 |
| Genre | : Technology & Engineering |
| ISBN | : 9783527311552 |
Although ceramics have been known to mankind literally for millennia, research has never ceased. Apart from the classic uses as a bulk material in pottery, construction, and decoration, the latter half of the twentieth century saw an explosive growth of application fields, such as electrical and thermal insulators, wear-resistant bearings, surface coatings, lightweight armour, or aerospace materials. In addition to plain, hard solids, modern ceramics come in many new guises such as fabrics, ultrathin films, microstructures and hybrid composites. Built on the solid foundations laid down by the 20-volume series Materials Science and Technology, Ceramics Science and Technology picks out this exciting material class and illuminates it from all sides. Materials scientists, engineers, chemists, biochemists, physicists and medical researchers alike will find this work a treasure trove for a wide range of ceramics knowledge from theory and fundamentals to practical approaches and problem solutions.
| Author | : Aloke Paul |
| Publisher | : Elsevier |
| Total Pages | : 478 |
| Release | : 2017-04-13 |
| Genre | : Science |
| ISBN | : 0128045787 |
Handbook of Solid State Diffusion, Volume 2: Diffusion Analysis in Material Applications covers the basic fundamentals, techniques, applications, and latest developments in the area of solid-state diffusion, offering a pedagogical understanding for students, academicians, and development engineers. Both experimental techniques and computational methods find equal importance in the second of this two volume set. Volume 2 covers practical issues on diffusion phenomena in bulk, thin film, and in nanomaterials. Diffusion related problems and analysis of methods in industrial applications, such as electronic industry, high temperature materials, nuclear materials, and superconductor materials are discussed. - Presents a handbook with a short mathematical background and detailed examples of concrete applications of the sophisticated methods of analysis - Enables readers to learn the basic concepts of experimental approaches and the computational methods involved in solid-state diffusion - Covers bulk, thin film, and nanomaterials - Introduces the problems and analysis in important materials systems in various applications - Collates contributions from academic and industrial problems from leading scientists involved in developing key concepts across the globe
| Author | : Wolfgang Pfeiler |
| Publisher | : John Wiley & Sons |
| Total Pages | : 1003 |
| Release | : 2008-01-08 |
| Genre | : Technology & Engineering |
| ISBN | : 3527614206 |
Covering the latest research in alloy physics together with the underlying basic principles, this comprehensive book provides a sound understanding of the structural changes in metals and alloys -- ranging from plastic deformation, deformation dynamics and ordering kinetics right up to atom jump processes, first principle calculations and simulation techniques. Alongside fundamental topics, such as crystal defects, phase transformations and statistical thermodynamics, the team of international authors treats such hot areas as nano-size effects, interfaces, and spintronics, as well as technical applications of modern alloys, like data storage and recording, and the possibilities offered by materials design.
| Author | : Andreas Öchsner |
| Publisher | : Trans Tech Publications Ltd |
| Total Pages | : 625 |
| Release | : 2006-10-15 |
| Genre | : Technology & Engineering |
| ISBN | : 3038130885 |
Mass Diffusion 2nd International Conference on Diffusion in Solids and Liquids, Mass Transfer - Heat Transfer - Microstructure & Properties, DSL-2006, 26-28 July 2006, University of Aveiro, Portugal
| Author | : Marek Danielewski |
| Publisher | : Trans Tech Publications Ltd |
| Total Pages | : 1317 |
| Release | : 2005-04-30 |
| Genre | : Technology & Engineering |
| ISBN | : 3038130303 |
DIMAT2004 Proceedings of the 6th International Conference on Diffusion In Materials, DIMAT 2004, held in Cracow, Poland, July 18-23, 2004
| Author | : Tibor Grasser |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 472 |
| Release | : 2007-11-18 |
| Genre | : Technology & Engineering |
| ISBN | : 3211728619 |
This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Vienna, Austria. It provides a global forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance.
