Design Methodologies For Improving The Trustworthiness And Quality Of Integrated Circuits
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Author | : Eugene R. Hnatek |
Publisher | : CRC Press |
Total Pages | : 809 |
Release | : 2018-10-03 |
Genre | : Technology & Engineering |
ISBN | : 1482277719 |
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
Author | : Friedrich Beck |
Publisher | : John Wiley & Sons |
Total Pages | : 198 |
Release | : 1998-02-04 |
Genre | : Technology & Engineering |
ISBN | : 9780471974017 |
Funktionstests an integrierten Schaltungen sind für deren Zuverlässigkeit von herausragender Bedeutung. Erstmals werden in diesem Werk die speziellen Präparationstechniken für die Fehleranalyse beschrieben. Ausgehend von den theoretischen Grundlagen erläutert der Autor in praxisnahem Stil die verschiedenen Techniken, die das Zurückverfolgen von Ausfällen ermöglichen.
Author | : Vasilis F. Pavlidis |
Publisher | : Newnes |
Total Pages | : 770 |
Release | : 2017-07-04 |
Genre | : Technology & Engineering |
ISBN | : 0124104843 |
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author | : Patrick O'Connor |
Publisher | : John Wiley & Sons |
Total Pages | : 491 |
Release | : 2011-11-22 |
Genre | : Technology & Engineering |
ISBN | : 1119964091 |
With emphasis on practical aspects of engineering, this bestseller has gained worldwide recognition through progressive editions as the essential reliability textbook. This fifth edition retains the unique balanced mixture of reliability theory and applications, thoroughly updated with the latest industry best practices. Practical Reliability Engineering fulfils the requirements of the Certified Reliability Engineer curriculum of the American Society for Quality (ASQ). Each chapter is supported by practice questions, and a solutions manual is available to course tutors via the companion website. Enhanced coverage of mathematics of reliability, physics of failure, graphical and software methods of failure data analysis, reliability prediction and modelling, design for reliability and safety as well as management and economics of reliability programmes ensures continued relevance to all quality assurance and reliability courses. Notable additions include: New chapters on applications of Monte Carlo simulation methods and reliability demonstration methods. Software applications of statistical methods, including probability plotting and a wider use of common software tools. More detailed descriptions of reliability prediction methods. Comprehensive treatment of accelerated test data analysis and warranty data analysis. Revised and expanded end-of-chapter tutorial sections to advance students’ practical knowledge. The fifth edition will appeal to a wide range of readers from college students to seasoned engineering professionals involved in the design, development, manufacture and maintenance of reliable engineering products and systems. www.wiley.com/go/oconnor_reliability5
Author | : |
Publisher | : |
Total Pages | : 704 |
Release | : 1995 |
Genre | : Aeronautics |
ISBN | : |
Author | : John Priest |
Publisher | : CRC Press |
Total Pages | : 457 |
Release | : 2012-04-16 |
Genre | : Business & Economics |
ISBN | : 1420026828 |
"Outlines best practices and demonstrates how to desgin in quality for successful development of hardware and software products. Offers systematic applications failored to particular market environments. Discusses Internet issues, electronic commerce, and supply chain."
Author | : Anatoly Belous |
Publisher | : Springer Nature |
Total Pages | : 445 |
Release | : 2022-02-10 |
Genre | : Technology & Engineering |
ISBN | : 3030898547 |
This book guides readers through the entire complex of interrelated theoretical and practical aspects of the end-to-end design and organization of production of silicon submicron integrated circuits. The discussion includes the theoretical foundations of the operation of field-effect- and bipolar transistors, the methods and peculiarities of the structural and schematic design, basic circuit-design and system-design engineering solutions for bipolar, CMOS, BiCMOS and TTL integrated circuits, standard design libraries, and typical design flows.
Author | : United States. National Aeronautics and Space Administration. Office of Reliability and Quality Assurance |
Publisher | : |
Total Pages | : 610 |
Release | : 1967 |
Genre | : Quality control |
ISBN | : |
Author | : Guang Yang |
Publisher | : John Wiley & Sons |
Total Pages | : 533 |
Release | : 2007-02-02 |
Genre | : Technology & Engineering |
ISBN | : 0471715298 |
As the Lead Reliability Engineer for Ford Motor Company, Guangbin Yang is involved with all aspects of the design and production of complex automotive systems. Focusing on real-world problems and solutions, Life Cycle Reliability Engineering covers the gamut of the techniques used for reliability assurance throughout a product's life cycle. Yang pulls real-world examples from his work and other industries to explain the methods of robust design (designing reliability into a product or system ahead of time), statistical and real product testing, software testing, and ultimately verification and warranting of the final product's reliability
Author | : Basel Halak |
Publisher | : Springer Nature |
Total Pages | : 231 |
Release | : 2019-09-30 |
Genre | : Technology & Engineering |
ISBN | : 3030237818 |
This book provides comprehensive coverage of the latest research into integrated circuits’ ageing, explaining the causes of this phenomenon, describing its effects on electronic systems, and providing mitigation techniques to build ageing-resilient circuits.