Chip On Board
Download Chip On Board full books in PDF, epub, and Kindle. Read online free Chip On Board ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author | : John H. Lau |
Publisher | : Springer Science & Business Media |
Total Pages | : 584 |
Release | : 1994-06-30 |
Genre | : Computers |
ISBN | : 9780442014414 |
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Author | : |
Publisher | : |
Total Pages | : 18 |
Release | : 1935 |
Genre | : Bookbinding |
ISBN | : |
Author | : Frank Riley |
Publisher | : Springer Science & Business Media |
Total Pages | : 576 |
Release | : 2013-06-29 |
Genre | : Technology & Engineering |
ISBN | : 3662131617 |
The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
Author | : William Greig |
Publisher | : Springer Science & Business Media |
Total Pages | : 312 |
Release | : 2007-04-24 |
Genre | : Technology & Engineering |
ISBN | : 0387339132 |
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Author | : Mark I. Montrose |
Publisher | : John Wiley & Sons |
Total Pages | : 344 |
Release | : 2004-04-05 |
Genre | : Science |
ISBN | : 0471660906 |
This accessible, new reference work shows how and why RF energy iscreated within a printed circuit board and the manner in whichpropagation occurs. With lucid explanations, this book enablesengineers to grasp both the fundamentals of EMC theory and signalintegrity and the mitigation process needed to prevent an EMCevent. Author Montrose also shows the relationship between time andfrequency domains to help you meet mandatory compliancerequirements placed on printed circuit boards. Using real-world examples the book features: Clear discussions, without complex mathematical analysis, offlux minimization concepts Extensive analysis of capacitor usage for variousapplications Detailed examination of components characteristics with variousgrounding methodologies, including implementation techniques An in-depth study of transmission line theory A careful look at signal integrity, crosstalk, andtermination
Author | : |
Publisher | : |
Total Pages | : 310 |
Release | : 1927 |
Genre | : |
ISBN | : |
Author | : |
Publisher | : ASM International |
Total Pages | : 1234 |
Release | : 1989-11-01 |
Genre | : Technology & Engineering |
ISBN | : 9780871702852 |
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author | : |
Publisher | : |
Total Pages | : 666 |
Release | : 1925 |
Genre | : |
ISBN | : |
Author | : AWARD PUBLICATIONS |
Publisher | : |
Total Pages | : 12 |
Release | : 2019-08-09 |
Genre | : Board books |
ISBN | : 9781782703624 |
These sturdy board books are ideal for first libraries, play boxes and pushchair adventures, and will captivate young readers with their fun, colourful illustrations.
Author | : Daniel Lu |
Publisher | : Springer |
Total Pages | : 974 |
Release | : 2016-11-18 |
Genre | : Technology & Engineering |
ISBN | : 3319450980 |
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.