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| Author | : Materials Research Society. Meeting |
| Publisher | : |
| Total Pages | : 312 |
| Release | : 2001-12-14 |
| Genre | : Science |
| ISBN | : |
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2001.
| Author | : Suryadevara V. Babu |
| Publisher | : Cambridge University Press |
| Total Pages | : 306 |
| Release | : 2014-06-05 |
| Genre | : Technology & Engineering |
| ISBN | : 9781107412187 |
With copper and barrier-layer integration firmly in place, several other exciting developments are occurring in the practice of chemical-mechanical polishing (CMP), and many advances are described in this book, first published in 2001. Discussions on CMP for shallow-trench isolation, abrasive-free slurries, improvements in pad and tool configurations including fixed abrasive pads, 'engineered' particles, effects of nanotopography, end-point studies, defect characterization and novel post-CMP cleaning methods are highlighted. Considerable progress has also been reported in modeling the complicated interactions that occur between the wafer surface and the pad and the slurry, whether containing abrasives or abrasive-free, and their influence on dishing and erosion and nonuniformity. These studies offer valuable insights for process improvements and yet many challenges remain and will provide a high level of interest for future books. Topics include: recent developments - pads and related issues; CMP abrasives; copper CMP/STI and planarization; STI and planarization - wear-rate models; low-k and integration issues - particle and process effects in CMP and issues in CMP cleaning.
| Author | : Materials Research Society. Meeting |
| Publisher | : |
| Total Pages | : 318 |
| Release | : 2004-09 |
| Genre | : Science |
| ISBN | : |
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).
| Author | : A. Kumar |
| Publisher | : |
| Total Pages | : 330 |
| Release | : 2005-07-19 |
| Genre | : Technology & Engineering |
| ISBN | : |
Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.
| Author | : John E. Northrup |
| Publisher | : |
| Total Pages | : 912 |
| Release | : 2002-07-23 |
| Genre | : Technology & Engineering |
| ISBN | : |
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
| Author | : Erin C. Jones |
| Publisher | : |
| Total Pages | : 362 |
| Release | : 2001-12-14 |
| Genre | : Science |
| ISBN | : |
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
| Author | : Wen Jin Meng |
| Publisher | : |
| Total Pages | : 480 |
| Release | : 2002-08-27 |
| Genre | : Technology & Engineering |
| ISBN | : |
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
| Author | : Duane S. Boning |
| Publisher | : |
| Total Pages | : 376 |
| Release | : 2003-08-27 |
| Genre | : Technology & Engineering |
| ISBN | : |
Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.
