Analytical Methodology Of Tree Microstrip Interconnects Modelling For Signal Distribution
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Author | : Blaise Ravelo |
Publisher | : Springer Nature |
Total Pages | : 239 |
Release | : 2019-11-21 |
Genre | : Technology & Engineering |
ISBN | : 9811505527 |
This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
Author | : Chung-Kuan Cheng |
Publisher | : Wiley-Interscience |
Total Pages | : 288 |
Release | : 2000 |
Genre | : Computers |
ISBN | : |
State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features: Models for interconnect as well as devices and the impact of scaling trends Modern analysis techniques, from matrix reduction and moment matching to transmission-line analysis An overview of the effects of inductance on on-chip interconnect Flexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topology Emphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance
Author | : |
Publisher | : |
Total Pages | : 1948 |
Release | : 1997 |
Genre | : Electrical engineering |
ISBN | : |
Author | : |
Publisher | : |
Total Pages | : 1874 |
Release | : 1995 |
Genre | : Electrical engineering |
ISBN | : |
Author | : Institution of Electrical Engineers |
Publisher | : |
Total Pages | : 34 |
Release | : 1999 |
Genre | : Electric engineering |
ISBN | : |
Indexes IEE proceedings parts A through I
Author | : |
Publisher | : |
Total Pages | : 870 |
Release | : 1994 |
Genre | : Electric circuits |
ISBN | : |
Author | : |
Publisher | : |
Total Pages | : 652 |
Release | : 1998 |
Genre | : Dissertations, Academic |
ISBN | : |
Author | : |
Publisher | : |
Total Pages | : 1016 |
Release | : 1999 |
Genre | : Aeronautics |
ISBN | : |
Author | : Terry C. Edwards |
Publisher | : John Wiley & Sons |
Total Pages | : 688 |
Release | : 2016-02-01 |
Genre | : Technology & Engineering |
ISBN | : 1118936175 |
Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
Author | : |
Publisher | : |
Total Pages | : 968 |
Release | : 1989 |
Genre | : Aeronautics |
ISBN | : |