Advances In Abrasive Technology V
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| Author | : Liangchi Zhang |
| Publisher | : World Scientific |
| Total Pages | : 238 |
| Release | : 1997-06-16 |
| Genre | : Technology & Engineering |
| ISBN | : 981449738X |
This volume aims to promote the latest advances in abrasive technology. Emphasis is placed on both the development of practical methods and the understanding of the mechanisms of machining ceramics, semiconductors, steel alloys, and other advanced materials. About 50 technical papers are included in the volume, describing the recent advances in the mechanics of abrasive machining, mechanisms of grinding, difficult-to-machine materials, grinding wheel technology, machinery and measurement, polishing, lapping, and nano-machining. Theoretically, the book discusses the material removal and deformation mechanisms; from the practical point of view, it provides useful data for direct industrial applications.
| Author | : Yong Sheng Gao |
| Publisher | : Trans Tech Publications Ltd |
| Total Pages | : 426 |
| Release | : 2003-04-15 |
| Genre | : Technology & Engineering |
| ISBN | : 3035704090 |
The history of abrasive technology dates from the very dawn of mineral utilization and continues to this day with the development of precision-finishing technology.The current requirements of high precision and high quality surfaces for critical components and devices, such as silicon wafers in the semiconductor industry, lenses in the precision optics industry, and dies in the injection molding industry, make the technology of abrasives more important than ever, and essential, albeit indirectly, for the rapid development of information technology. This book therefore plays a valuable role in presenting recent advances in the field of abrasive technology.
| Author | : Dong Ming Guo |
| Publisher | : Trans Tech Publications Ltd |
| Total Pages | : 786 |
| Release | : 2007-01-15 |
| Genre | : Technology & Engineering |
| ISBN | : 3038131210 |
This book presents a wealth of valuable up-to-date information for active researchers and engineers, and will certainly form a solid basis for any future research, in the field of abrasive technology, which is aimed at creating new and practical machine tools, systems and processes, or at identifying new characteristics.
| Author | : |
| Publisher | : |
| Total Pages | : 836 |
| Release | : 2007 |
| Genre | : Abrasives |
| ISBN | : |
| Author | : Feng Zhu |
| Publisher | : Trans Tech Publications Ltd |
| Total Pages | : 552 |
| Release | : 2011-07-27 |
| Genre | : Technology & Engineering |
| ISBN | : 3038135070 |
Selected, peer reviewed papers from the 16th Conference of Abrasive Technology in China, 7-10 August, 2011, Urumqi China
| Author | : Guangqi Cai |
| Publisher | : |
| Total Pages | : 630 |
| Release | : 2006 |
| Genre | : House & Home |
| ISBN | : |
This work is the result of a careful selection made from more than 300 extensively peer-reviewed papers treating recent advances in the field of abrasive technology.
| Author | : William J Scott |
| Publisher | : World Scientific |
| Total Pages | : 558 |
| Release | : 1999-11-10 |
| Genre | : Technology & Engineering |
| ISBN | : 9814493899 |
Abrasive technology is becoming increasingly important in precision manufacturing. This volume contains more than 70 refereed technical papers contributed by worldwide academic researchers and industrial practitioners, on the latest development in abrasive technology. Specifically, it covers the mechanics and mechanisms of abrasive processes as well as the technologies and applications related to abrasive jet machining, nano-machining, grinding, polishing, horning and lapping. It also includes topics on high-speed machining, eco-machining and laser micro-machining technologies. The discussion on the practical applications of abrasive technology and the associated theories makes this book useful for academic researchers and industrial practitioners.
| Author | : Volodymyr Tonkonogyi |
| Publisher | : Springer Nature |
| Total Pages | : 868 |
| Release | : 2021-02-04 |
| Genre | : Technology & Engineering |
| ISBN | : 3030680142 |
This book offers a timely yet comprehensive snapshot of innovative research and developments at the interface between manufacturing, materials and mechanical engineering, and quality assurance. It covers a wide range of manufacturing processes, such as cutting, grinding, assembly, and coatings, including ultrasonic treatment, molding, radial-isostatic compression, ionic-plasma deposition, volumetric vibration treatment, and wear resistance. It also highlights the advantages of augmented reality, RFID technology, reverse engineering, optimization, heat and mass transfer, energy management, quality inspection, and environmental impact. Based on selected papers presented at the Grabchenko’s International Conference on Advanced Manufacturing Processes (InterPartner-2020), held in Odessa, Ukraine, on September 8–11, 2020, this book offers a timely overview and extensive information on trends and technologies in production planning, design engineering, advanced materials, machining processes, process engineering, and quality assurance. It is also intended to facilitate communication and collaboration between different groups working on similar topics and offer a bridge between academic and industrial researchers.
| Author | : Helmi Youssef |
| Publisher | : CRC Press |
| Total Pages | : 397 |
| Release | : 2020-08-11 |
| Genre | : Technology & Engineering |
| ISBN | : 1000097161 |
Non-Traditional and Advanced Machining Technologies covers the technologies, machine tools, and operations of non-traditional machining processes and assisted machining technologies. Two separate chapters deal with the machining techniques of difficult-to-cut materials, such as stainless, super alloys, ceramics, and composites. Design for machining, accuracy and surface integrity of machined parts, environment-friendly machine tools and operations, and hexapods are also presented. The topics covered throughout reflect the rapid and significant advances that have occurred in various areas in machining technologies and are organized and described in such a manner to draw the interest of the reader. The treatments are aimed at motiving and challenging the reader to explore viable solutions to a variety of questions regarding product design and optimum selection of machining operations for a given task. The book will be useful to professionals, students, and companies in the areas of industrial, manufacturing, mechanical, materials, and production engineering fields.
| Author | : Babu Suryadevara |
| Publisher | : Woodhead Publishing |
| Total Pages | : 538 |
| Release | : 2016-01-09 |
| Genre | : Technology & Engineering |
| ISBN | : 0081002181 |
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. - Considers techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for particular materials - Addresses consumables and process control for improved CMP
