A Damage Integral Approach For Low Cycle Isothermal And Thermal Fatigue
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Author | : |
Publisher | : |
Total Pages | : 700 |
Release | : 1995 |
Genre | : Aeronautics |
ISBN | : |
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Author | : John Lau |
Publisher | : Springer Science & Business Media |
Total Pages | : 904 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 1468477676 |
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Author | : Abdelkhalak El Hami |
Publisher | : ISTE Press - Elsevier |
Total Pages | : 298 |
Release | : 2020-03-03 |
Genre | : Technology & Engineering |
ISBN | : 1785481908 |
Embedded Mechatronic Systems 2: Analysis of Failures, Modeling, Simulation and Optimization presents advances in research within the field of mechatronic systems, which integrates reliability into the design process. Providing many detailed examples, this book develops a characterization methodology for faults in mechatronic systems. It analyzes the multi-physical modeling of faults, revealing weaknesses in design and failure mechanisms. This development of meta-models enables us to simulate effects on the reliability of conditions of use and manufacture.
Author | : Gary R. Halford |
Publisher | : |
Total Pages | : 120 |
Release | : 1986 |
Genre | : Metals |
ISBN | : |
Author | : John H. Lau |
Publisher | : McGraw Hill Professional |
Total Pages | : 664 |
Release | : 1995 |
Genre | : Technology & Engineering |
ISBN | : 9780070366084 |
A summary of progress in ball grid array (BGA) packaging technology, for professionals in BGA research and development, and for manufacturers researching BGA for their interconnect systems. Discusses economic, design, material, process, and quality issues, and describes techniques for processing substrates, routing PCB, assembling CBGA, PBGA, and TBGA packages, and inspection of BGA PCB assemblies. Includes treatment of BGA industry infrastructure, and an electronic packaging glossary. Contains bandw photos and diagrams. Annotation copyright by Book News, Inc., Portland, OR
Author | : |
Publisher | : |
Total Pages | : 568 |
Release | : 1984 |
Genre | : Astronautics |
ISBN | : |
Author | : John H. Lau |
Publisher | : Springer Science & Business Media |
Total Pages | : 504 |
Release | : 1991-05-31 |
Genre | : Computers |
ISBN | : 9780442002602 |
Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR
Author | : Institution of Mechanical Engineers |
Publisher | : Elsevier |
Total Pages | : 456 |
Release | : 2012-05-11 |
Genre | : Technology & Engineering |
ISBN | : 0857096133 |
This book presents the papers from the latest international conference, following on from the highly successful previous conferences in this series held regularly since 1978. Papers cover all current and novel aspects of turbocharging systems design for boosting solutions for engine downsizing. The focus of the papers is on the application of turbocharger and other pressure charging devices to spark ignition (SI) and compression ignition (CI) engines in the passenger car and commercial vehicles. Novel boosting solutions for diesel engines operating in the industrial and marine market sectors are also included.The current emission legislations and environmental trends for reducing CO2 and fuel consumption are the major market forces in the transport (land and marine) and industry sectors. In these market sectors the internal combustion engine is the key product where downsizing is the driver for development for both SI and CI engines in the passenger car and commercial vehicle applications. The more stringent future market forces and environmental considerations mean more stringent engine downsizing, thus, novel systems are required to provide boosting solutions including hybrid, electric-motor and exhaust waste energy recovery systems for high efficiency, response, reliability, durability and compactness etc. For large engines the big challenge is to enhance the high specific power and efficiency whilst reducing emission levels (Nox and Sox) with variable quality fuels. This will require turbocharging systems for very high boost pressure, efficiency and a high degree of system flexibility. - Presents papers from all the latest international conference - Papers cover all aspects of the turbocharging systems design for boosting solutions for engine downsizing - The focus of the papers is on the application of turbocharger and other pressure charging devices to spark ignition (SI) and compression ignition (CI) engines in the passenger car and commercial vehicles
Author | : |
Publisher | : |
Total Pages | : 592 |
Release | : 1995 |
Genre | : Mechanical engineering |
ISBN | : |
Author | : David L. McDowell |
Publisher | : ASTM International |
Total Pages | : 455 |
Release | : 1993 |
Genre | : Alloys |
ISBN | : 0803118627 |
Papers presented at the ASTM Symposium on Multiaxial Fatigue, held in San Diego, November 1991, to communicate the most recent international advances in multiaxial cyclic deformation and fatigue research as well as applications to component analysis and design. The 24 papers are grouped into five ca