40th Electronic Components & Technology Conference
Author | : |
Publisher | : |
Total Pages | : 268 |
Release | : 1990 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
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Author | : |
Publisher | : |
Total Pages | : 268 |
Release | : 1990 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Author | : Osamu Wada |
Publisher | : Springer Science & Business Media |
Total Pages | : 464 |
Release | : 2013-11-27 |
Genre | : Technology & Engineering |
ISBN | : 1461526868 |
As we approach the end of the present century, the elementary particles of light (photons) are seen to be competing increasingly with the elementary particles of charge (electrons/holes) in the task of transmitting and processing the insatiable amounts of infonnation needed by society. The massive enhancements in electronic signal processing that have taken place since the discovery of the transistor, elegantly demonstrate how we have learned to make use of the strong interactions that exist between assemblages of electrons and holes, disposed in suitably designed geometries, and replicated on an increasingly fine scale. On the other hand, photons interact extremely weakly amongst themselves and all-photonic active circuit elements, where photons control photons, are presently very difficult to realise, particularly in small volumes. Fortunately rapid developments in the design and understanding of semiconductor injection lasers coupled with newly recognized quantum phenomena, that arise when device dimensions become comparable with electronic wavelengths, have clearly demonstrated how efficient and fast the interaction between electrons and photons can be. This latter situation has therefore provided a strong incentive to devise and study monolithic integrated circuits which involve both electrons and photons in their operation. As chapter I notes, it is barely fifteen years ago since the first demonstration of simple optoelectronic integrated circuits were realised using m-V compound semiconductors; these combined either a laser/driver or photodetector/preamplifier combination.
Author | : Darrel R. Frear |
Publisher | : Springer Science & Business Media |
Total Pages | : 434 |
Release | : 1994-01-31 |
Genre | : Computers |
ISBN | : 9780442015053 |
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Author | : John H. Lau |
Publisher | : Springer Science & Business Media |
Total Pages | : 504 |
Release | : 1991-05-31 |
Genre | : Computers |
ISBN | : 9780442002602 |
Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR
Author | : K. Subramanian |
Publisher | : John Wiley & Sons |
Total Pages | : 510 |
Release | : 2012-03-06 |
Genre | : Technology & Engineering |
ISBN | : 1119966809 |
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.
Author | : National Research Council |
Publisher | : National Academies Press |
Total Pages | : 136 |
Release | : 1995-10-14 |
Genre | : Technology & Engineering |
ISBN | : 0309053358 |
Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.
Author | : John C Bischof |
Publisher | : World Scientific |
Total Pages | : 389 |
Release | : 2016-06-21 |
Genre | : Technology & Engineering |
ISBN | : 9814733202 |
The use of micro / nanotechnology in cell and tissue engineering, and especially for cell and tissue preservation, is at the peak of its activity now, with scientific output expected to continue growing in the coming years.Micro and nanotechnologies have induced paradigm shifts in many scientific fields, and as featured in this edited volume, they are having important impact in the field of cryomedicine. The book gives an overview of the recent progress in implementing multiscale (micro and nanoscale) technologies to improve the outcome of various cryomedical applications including cryosurgery, cryopreservation, lyopreservation and to understand the fundamental engineering and science underpinning the applications.This is the first book that will provide both an introductory and in-depth account of applying the multiscale technologies in cryomedicine.
Author | : James E. Morris |
Publisher | : Springer Science & Business Media |
Total Pages | : 459 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 9400904398 |
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
Author | : John H. Lau |
Publisher | : Springer Science & Business Media |
Total Pages | : 584 |
Release | : 1994-06-30 |
Genre | : Computers |
ISBN | : 9780442014414 |
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.