3d Networks On Chip Architecture Optimization For Low Power Design
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| Author | : Konstantinos Tatas |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 271 |
| Release | : 2013-10-08 |
| Genre | : Technology & Engineering |
| ISBN | : 1461442745 |
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
| Author | : Chrysostomos Nicopoulos |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 237 |
| Release | : 2009-09-18 |
| Genre | : Technology & Engineering |
| ISBN | : 904813031X |
[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel’s very recently announced 80-core TeraFLOP chip [5] exemplifies the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual displacement of the computati- centric design model by a more communication-centric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p- cessing elements working in tandem. This trend has led to a surge in the popularity of multi-core systems, which typically manifest themselves in two distinct incarnations: heterogeneous Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip Multi-Processors (CMP). The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced Time-To- Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of pre-existing IP components integrated on a single die.
| Author | : Umit Y. Ogras |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 182 |
| Release | : 2013-03-12 |
| Genre | : Technology & Engineering |
| ISBN | : 9400739583 |
Traditionally, design space exploration for Systems-on-Chip (SoCs) has focused on the computational aspects of the problem at hand. However, as the number of components on a single chip and their performance continue to increase, the communication architecture plays a major role in the area, performance and energy consumption of the overall system. As a result, a shift from computation-based to communication-based design becomes mandatory. Towards this end, network-on-chip (NoC) communication architectures have emerged recently as a promising alternative to classical bus and point-to-point communication architectures. In this dissertation, we study outstanding research problems related to modeling, analysis and optimization of NoC communication architectures. More precisely, we present novel design methodologies, software tools and FPGA prototypes to aid the design of application-specific NoCs.
| Author | : Giovanni De Micheli |
| Publisher | : Elsevier |
| Total Pages | : 408 |
| Release | : 2006-08-30 |
| Genre | : Technology & Engineering |
| ISBN | : 0080473563 |
The design of today's semiconductor chips for various applications, such as telecommunications, poses various challenges due to the complexity of these systems. These highly complex systems-on-chips demand new approaches to connect and manage the communication between on-chip processing and storage components and networks on chips (NoCs) provide a powerful solution. This book is the first to provide a unified overview of NoC technology. It includes in-depth analysis of all the on-chip communication challenges, from physical wiring implementation up to software architecture, and a complete classification of their various Network-on-Chip approaches and solutions.* Leading-edge research from world-renowned experts in academia and industry with state-of-the-art technology implementations/trends* An integrated presentation not currently available in any other book* A thorough introduction to current design methodologies and chips designed with NoCs
| Author | : Lennart Bamberg |
| Publisher | : Springer Nature |
| Total Pages | : 403 |
| Release | : 2022-06-27 |
| Genre | : Technology & Engineering |
| ISBN | : 3030982297 |
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
| Author | : Nikolaos Voros |
| Publisher | : Springer |
| Total Pages | : 761 |
| Release | : 2018-04-25 |
| Genre | : Computers |
| ISBN | : 3319788906 |
This book constitutes the proceedings of the 14th International Conference on Applied Reconfigurable Computing, ARC 2018, held in Santorini, Greece, in May 2018. The 29 full papers and 22 short presented in this volume were carefully reviewed and selected from 78 submissions. In addition, the volume contains 9 contributions from research projects. The papers were organized in topical sections named: machine learning and neural networks; FPGA-based design and CGRA optimizations; applications and surveys; fault-tolerance, security and communication architectures; reconfigurable and adaptive architectures; design methods and fast prototyping; FPGA-based design and applications; and special session: research projects.
| Author | : Cristina Silvano |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 301 |
| Release | : 2010-09-24 |
| Genre | : Technology & Engineering |
| ISBN | : 144196911X |
In recent years, both Networks-on-Chip, as an architectural solution for high-speed interconnect, and power consumption, as a key design constraint, have continued to gain interest in the design and research communities. This book offers a single-source reference to some of the most important design techniques proposed in the context of low-power design for networks-on-chip architectures.
| Author | : Jose L. Ayala |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 362 |
| Release | : 2011-09-15 |
| Genre | : Computers |
| ISBN | : 3642241530 |
This book constitutes the refereed proceedings of the 21st International Conference on Integrated Circuit and System Design, PATMOS 2011, held in Madrid, Spain, in September 2011. The 34 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems and focus especially on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.
| Author | : Aida Todri-Sanial |
| Publisher | : CRC Press |
| Total Pages | : 409 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1351830198 |
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
| Author | : Soonhoi Ha |
| Publisher | : Springer |
| Total Pages | : 0 |
| Release | : 2017-10-11 |
| Genre | : Technology & Engineering |
| ISBN | : 9789401772662 |
This handbook presents fundamental knowledge on the hardware/software (HW/SW) codesign methodology. Contributing expert authors look at key techniques in the design flow as well as selected codesign tools and design environments, building on basic knowledge to consider the latest techniques. The book enables readers to gain real benefits from the HW/SW codesign methodology through explanations and case studies which demonstrate its usefulness. Readers are invited to follow the progress of design techniques through this work, which assists readers in following current research directions and learning about state-of-the-art techniques. Students and researchers will appreciate the wide spectrum of subjects that belong to the design methodology from this handbook.
