2006 8th International Conference On Solid State And Integrated Circuit Technology
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| Author | : Paul Chu |
| Publisher | : BoD – Books on Demand |
| Total Pages | : 458 |
| Release | : 2010-04-01 |
| Genre | : Technology & Engineering |
| ISBN | : 9533070862 |
This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields.
| Author | : Vinod Kumar Khanna |
| Publisher | : Springer |
| Total Pages | : 471 |
| Release | : 2016-09-16 |
| Genre | : Technology & Engineering |
| ISBN | : 8132236254 |
Keeping nanoelectronics in focus, this book looks at interrelated fields namely nanomagnetics, nanophotonics, nanomechanics and nanobiotechnology, that go hand-in-hand or are likely to be utilized in future in various ways for backing up or strengthening nanoelectronics. Complementary nanosciences refer to the alternative nanosciences that can be combined with nanoelectronics. The book brings students and researchers from multiple disciplines (and therefore with disparate levels of knowledge, and, more importantly, lacunae in this knowledge) together and to expose them to the essentials of integrative nanosciences. The central idea is that the five identified disciplines overlap significantly and arguably cohere into one fundamental nanotechnology discipline. The book caters to interdisciplinary readership in contrast to many of the existing nanotechnology related books that relate to a specific discipline. The book lays special emphasis on nanoelectronics since this field has advanced most rapidly amongst all the nanotechnology disciplines and with significant commercial pervasion. In view of the significant impact that nanotechnology is predicted to have on society, the topics and their interrelationship in this book are of considerable interest and immense value to students, professional engineers, and reserachers.
| Author | : Krzysztof Iniewski |
| Publisher | : CRC Press |
| Total Pages | : 669 |
| Release | : 2018-10-08 |
| Genre | : Technology & Engineering |
| ISBN | : 1351834657 |
Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.
| Author | : Rajiv Kohli |
| Publisher | : William Andrew |
| Total Pages | : 235 |
| Release | : 2014-11-19 |
| Genre | : Technology & Engineering |
| ISBN | : 0323312713 |
As device sizes in the semiconductor industries shrink, devices become more vulnerable to smaller contaminant particles, and most conventional cleaning techniques employed in the industry are not effective at smaller scales. The book series Developments in Surface Contamination and Cleaning as a whole provides an excellent source of information on these alternative cleaning techniques as well as methods for characterization and validation of surface contamination. Each volume has a particular topical focus, covering the key techniques and recent developments in the area.Several novel wet and dry surface cleaning methods are addressed in this Volume. Many of these methods have not been reviewed previously, or the previous reviews are dated. These methods are finding increasing commercial application and the information in this book will be of high value to the reader. Edited by the leading experts in small-scale particle surface contamination, cleaning and cleaning control these books will be an invaluable reference for researchers and engineers in R&D, manufacturing, quality control and procurement specification situated in a multitude of industries such as: aerospace, automotive, biomedical, defense, energy, manufacturing, microelectronics, optics and xerography. - Provides a state-of-the-art survey and best-practice guidance for scientists and engineers engaged in surface cleaning or handling the consequences of surface contamination - Addresses the continuing trends of shrinking device size and contamination vulnerability in a range of industries, spearheaded by the semiconductor industry and others - Covers novel wet and dry surface cleaning methods of increasing commercial importance
| Author | : V. Bindhu |
| Publisher | : Springer Nature |
| Total Pages | : 742 |
| Release | : 2020-03-04 |
| Genre | : Technology & Engineering |
| ISBN | : 9811526125 |
This book includes high impact papers presented at the International Conference on Communication, Computing and Electronics Systems 2019, held at the PPG Institute of Technology, Coimbatore, India, on 15-16 November, 2019. Discussing recent trends in cloud computing, mobile computing, and advancements of electronics systems, the book covers topics such as automation, VLSI, embedded systems, integrated device technology, satellite communication, optical communication, RF communication, microwave engineering, artificial intelligence, deep learning, pattern recognition, Internet of Things, precision models, bioinformatics, and healthcare informatics.
| Author | : Rachid Benlamri |
| Publisher | : Springer |
| Total Pages | : 662 |
| Release | : 2012-06-02 |
| Genre | : Computers |
| ISBN | : 3642305075 |
This two-volume-set (CCIS 293 and CCIS 294) constitutes the refereed proceedings of the International Conference on Networked Digital Technologies, NDT 2012, held in Dubai, UAE, in April 2012. The 96 papers presented in the two volumes were carefully reviewed and selected from 228 submissions. The papers are organized in topical sections on collaborative systems for e-sciences; context-aware processing and ubiquitous systems; data and network mining; grid and cloud computing; information and data management; intelligent agent-based systems; internet modeling and design; mobile, ad hoc and sensor network management; peer-to-peer social networks; quality of service for networked systems; semantic Web and ontologies; security and access control; signal processing and computer vision for networked systems; social networks; Web services.
| Author | : Alexandre Schmid |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 299 |
| Release | : 2009-10-06 |
| Genre | : Computers |
| ISBN | : 3642048498 |
This book constitutes the proceedings of the 4th International Conference on Nano-Networks, Nano-Net 2009, held in Lucerne, Switherland, in October 2009. The 36 invited and regular papers address the whole spectrum of Nano-Networks and spans topis like modeling, simulation, statdards, architectural aspects, novel information and graph theory aspects, device physics and interconnects, nanorobotics as well as nano-biological systems. The volume also contains the workshop on Nano-Bio-Sensing Paradigms as well as the workshop on Brain Inspired Interconnects and Circuits.
| Author | : Y. Kuo |
| Publisher | : The Electrochemical Society |
| Total Pages | : 443 |
| Release | : 2010-10 |
| Genre | : Science |
| ISBN | : 1566778247 |
This special issue of ECS Transactions is for the 20th anniversary of the Thin Film Transistor (TFT) symposium series. Renowned TFT experts in related materials, processes, devices, and applications from the world serve as invited speakers to review the technology and science progress in the past two decades. Selected contributed papers are also included in this issue.
| Author | : Paul D. Franzon |
| Publisher | : John Wiley & Sons |
| Total Pages | : 488 |
| Release | : 2019-05-06 |
| Genre | : Technology & Engineering |
| ISBN | : 3527338551 |
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
| Author | : Juin J. Liou |
| Publisher | : CRC Press |
| Total Pages | : 304 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1482255898 |
Electrostatic discharge (ESD) is one of the most prevalent threats to electronic components. In an ESD event, a finite amount of charge is transferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time. Thus, more than 35 percent of single-event chip damages can be attributed to ESD events, and designing ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry. Electrostatic Discharge Protection: Advances and Applications delivers timely coverage of component- and system-level ESD protection for semiconductor devices and integrated circuits. Bringing together contributions from internationally respected researchers and engineers with expertise in ESD design, optimization, modeling, simulation, and characterization, this book bridges the gap between theory and practice to offer valuable insight into the state of the art of ESD protection. Amply illustrated with tables, figures, and case studies, the text: Instills a deeper understanding of ESD events and ESD protection design principles Examines vital processes including Si CMOS, Si BCD, Si SOI, and GaN technologies Addresses important aspects pertinent to the modeling and simulation of ESD protection solutions Electrostatic Discharge Protection: Advances and Applications provides a single source for cutting-edge information vital to the research and development of effective, robust ESD protection solutions for semiconductor devices and integrated circuits.
