1 F Noise And Electromigration In A1 Ti Thin Films
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Author | : Wade H. Shafer |
Publisher | : Springer Science & Business Media |
Total Pages | : 386 |
Release | : 2012-12-06 |
Genre | : Science |
ISBN | : 1461573912 |
Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thougtit that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all con cerned if the printing and distribution of the volumes were handled by an interna tional publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Cor poration of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 31 (thesis year 1986) a total of 11 ,480 theses titles trom 24 Canadian and 182 United States universities. We are sure that this broader base tor these titles reported will greatly enhance the value ot this important annual reterence work. While Volume 31 reports theses submitted in 1986, on occasion, certain univer sities do re port theses submitted in previousyears but not reported at the time.
Author | : Aris Christou |
Publisher | : RIAC |
Total Pages | : 487 |
Release | : 2006 |
Genre | : |
ISBN | : 1933904194 |
Author | : |
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Total Pages | : |
Release | : 1987 |
Genre | : Aeronautics |
ISBN | : |
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Author | : |
Publisher | : |
Total Pages | : 634 |
Release | : 1995-07 |
Genre | : Metallurgy |
ISBN | : |
Author | : |
Publisher | : |
Total Pages | : 1606 |
Release | : 1989 |
Genre | : Electrical engineering |
ISBN | : |
Author | : |
Publisher | : |
Total Pages | : 1058 |
Release | : 1993 |
Genre | : Physics |
ISBN | : |
Author | : Milton Ohring |
Publisher | : Academic Press |
Total Pages | : 744 |
Release | : 1992 |
Genre | : Science |
ISBN | : 9780125249904 |
Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.
Author | : M.L. Plumer |
Publisher | : Springer Science & Business Media |
Total Pages | : 364 |
Release | : 2012-12-06 |
Genre | : Science |
ISBN | : 364256657X |
Application-oriented book on magnetic recording, focussing on the underlying physical mechanisms that play crucial roles in medium and transducer development for high areal density disk drives.
Author | : Cher Ming Tan |
Publisher | : World Scientific |
Total Pages | : 312 |
Release | : 2010 |
Genre | : Technology & Engineering |
ISBN | : 9814273325 |
Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed.
Author | : T. Musha |
Publisher | : IOS Press |
Total Pages | : 784 |
Release | : 1992 |
Genre | : Computers |
ISBN | : 9789051990836 |
Presents and discusses fundamental aspects and key implications of noise and fluctuations in various fields of science, technology and sociology, with special emphasis in 1/f fluctuations in biology. There are contributions from leading international experts.