Wafer Level Vacuum Encapsulated Resonators With Low Motional Resistance
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| Author | : George Xereas |
| Publisher | : |
| Total Pages | : |
| Release | : 2017 |
| Genre | : |
| ISBN | : |
"Quartz crystal-based oscillators have been employed for timing and frequency references applications since the 1950s. However, the quartz fabrication process imposes limitations in terms of robustness, size, cost, and direct on-chip integration with Complementary Metal-Oxide Semiconductor (CMOS) circuits. An unmatched infrastructure investment in advanced semiconductor foundries has allowed for the introduction of a new silicon based timing references, the MicroElectroMechanical Systems (MEMS) resonator. These new devices are able to provide superior timing performance while at the same time setting new standards in terms of robustness, power consumption and miniaturization. This work describes the fabrication of wafer-level vacuum-encapsulated silicon resonators fabricated in MEMS Integrated Design for Inertial Sensors (MIDIS), a commercial pure-play MEMS process, provided by Teledyne DALSA Semiconductor Inc. (TDSI). MIDIS offers a 30 [mu]m thick silicon device layer that is wafer-level vacuum encapsulated at 10 mTorr. The total leak rate equivalent is noted to be as low as 6.5 x 10−17 atm cm3/s, which provides an ultra-clean environment for the operation of the devices. The Lamé mode resonators developed in this work achieved a quality factor of 3.24 million at a resonance frequency of 6.89 MHz, resulting in the highest recorded f-Q product of 2.23e13 Hz for wafer-level vacuum-encapsulated silicon resonators. The device was integrated in a PCB based oscillator in order to build a high performance frequency reference that meets most Global System for Mobile Communications (GSM) specifications.Furthermore, low polarization voltage breath-mode ring resonators are presented here. The ring resonators are designed to operate with a low DC polarization voltage, starting at 5V, while providing a high frequency-Quality factor (f-Q) product. The vacuum packaging quality is evaluated using an automated testing setup over an extended time period. The fabricated devices had a resonant frequency of 10 MHz with the quality factor exceeding 8.4e4. Finally, this works presents wafer-level vacuum-encapsulated silicon resonators with transduction gap of 200 nm. The devices are fabricated in MIDIS where the default minimum transduction gap in the MIDIS process is 1.5 [mu]m. A gap reduction technique that relies on arc-welding is introduced here. The prototype Lamé mode resonators are encapsulated in an ultra-clean 10 mTorr vacuum cavity that ensures long-term stability. The Quality factor was measured to be 1.37 million at a resonance frequency of 6.89 MHz. With the narrower gap, the motional resistance of the resonators is reduced by a factor of 10 times." --
| Author | : Junjun Huan |
| Publisher | : |
| Total Pages | : 51 |
| Release | : 2017 |
| Genre | : Microelectromechanical systems |
| ISBN | : |
In this thesis, a low-voltage 32 kHz silicon tuning fork MicroElectroMechanical Systems (MEMS)-based resonator design with a high Quality factor of over 73,000 is presented with a Complementary Metal-Oxide Semiconductor (CMOS) sustaining amplifier towards a low power oscillator. The resonator is designed using MEMS Integrated Design for Inertial Sensors (MIDIS) process developed by Teledyne DALSA Semiconductor Inc. (TDSI). MIDIS offers wafer-level vacuum encapsulation with ultra-low leak rate. Ultra-low polarization voltage, as low as 10mV, is needed to excite the resonator by using a transduction gap reduction technique based on electrostatic deflection of movable electrodes and subsequent localized melting of welding pads for permanent position locking. Further, the technique helps to minimize unexpected electrostatic stiffness induced by time-varying capacitance across transduction gaps to just -0.6 N/m. The motional resistance drops down to about 2kΩ as a result of a small gap size and the technique helps to improve the Quality Factor (Q). A sustaining amplifier using a transimpedance operational amplifier configuration is system-integrated with the tuning fork resonator to establish continuous oscillation with low damping losses. An average power consumption of around 600μW is measured on the oscillator, which is suitable for mobile electronic systems.
| Author | : Frederic Nabki |
| Publisher | : MDPI |
| Total Pages | : 164 |
| Release | : 2020-05-27 |
| Genre | : Technology & Engineering |
| ISBN | : 3039288652 |
Microelectromechanical systems (MEMS) have had a profound impact on a wide range of applications. The degree of miniaturization made possible by MEMS technology has significantly improved the functionalities of many systems, and the performance of MEMS has steadily improved as its uses augment. Notably, MEMS sensors have been prevalent in motion sensing applications for decades, and the sensing mechanisms leveraged by MEMS have been continuously extended to applications spanning the detection of gases, magnetic fields, electromagnetic radiation, and more. In parallel, MEMS resonators have become an emerging field of MEMS and affected subfields such as electronic timing and filtering, and energy harvesting. They have, in addition, enabled a wide range of resonant sensors. For many years now, MEMS have been the basis of various industrial successes, often building on novel academic research. Accordingly, this Special Issue explores many research innovations in MEMS sensors and resonators, from biomedical applications to energy harvesting, gas sensing, resonant sensing, and timing.
| Author | : Nguyen Van Toan |
| Publisher | : CRC Press |
| Total Pages | : 170 |
| Release | : 2019-07-10 |
| Genre | : Technology & Engineering |
| ISBN | : 0429560990 |
Microfabricated resonators play an essential role in a variety of applications, including mass sensing, timing reference applications, and filtering applications. Many transduction mechanisms including piezoelectric, piezoresistive, and capacitive mechanisms, have been studied to induce and detect the motion of resonators. This book is meant to introduce and suggest several technological approaches together with design considerations for performance enhancement of capacitive silicon resonators, and will be useful for those working in field of micro and nanotechnology. Features Introduces and suggests several technological approaches together with design considerations for performance enhancement of capacitive silicon resonators Provides information on the various fabrication technologies and design considerations that can be employed to improve the performance capacitive silicon resonator which is one of the promising options to replace the quartz crystal resonator. Discusses several technological approaches including hermetic packaging based on the LTCC substrate, deep reactive ion etching, neutral beam etching technology, and metal-assisted chemical etching, as well as design considerations for mechanically coupled, selective vibration of high-order mode, movable electrode structures, and piezoresistive heat engines were investigated to achieve small motional resistance, low insertion loss, and high quality factor. Focusses on a capacitive sensing method based on the measurement of the change in capacitance between a sensing electrode and the resonant body. Reviews recent progress in performance enhancement methods for capacitive silicon resonator, which are mainly based on the works of the authors.
| Author | : Henry Baltes |
| Publisher | : John Wiley & Sons |
| Total Pages | : 612 |
| Release | : 2008-07-11 |
| Genre | : Technology & Engineering |
| ISBN | : 3527616934 |
Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Sensor systems, microreactors, nanostructures, nanomachines, functional surfaces, integrated optics, displays, communications technology, biochips, human/machine interfaces, prosthetics, miniaturized medical and surgery equipment and many more opportunities are being explored. This new series, Advanced Micro and Nano Systems, provides cutting-edge reviews from top authors on technologies, devices and advanced systems from the micro and nano worlds.
| Author | : Harmeet Bhugra |
| Publisher | : Springer |
| Total Pages | : 423 |
| Release | : 2017-01-09 |
| Genre | : Technology & Engineering |
| ISBN | : 3319286889 |
This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling, testing and qualification of resonators, and fabrication and large scale manufacturing techniques to help inspire future research and entrepreneurial activities in pMEMS. The authors discuss the most exciting developments in the area of materials and devices for the making of piezoelectric MEMS resonators, and offer direct examples of the technical challenges that need to be overcome in order to commercialize these types of devices. Some of the topics covered include: Widely-used piezoelectric materials, as well as materials in which there is emerging interest Principle of operation and design approaches for the making of flexural, contour-mode, thickness-mode, and shear-mode piezoelectric resonators, and examples of practical implementation of these devices Large scale manufacturing approaches, with a focus on the practical aspects associated with testing and qualification Examples of commercialization paths for piezoelectric MEMS resonators in the timing and the filter markets ...and more! The authors present industry and academic perspectives, making this book ideal for engineers, graduate students, and researchers.
| Author | : Behzad Razavi |
| Publisher | : John Wiley & Sons |
| Total Pages | : 444 |
| Release | : 2012-09-14 |
| Genre | : Technology & Engineering |
| ISBN | : 1118439457 |
The only book on integrated circuits for optical communications that fully covers High-Speed IOs, PLLs, CDRs, and transceiver design including optical communication The increasing demand for high-speed transport of data has revitalized optical communications, leading to extensive work on high-speed device and circuit design. With the proliferation of the Internet and the rise in the speed of microprocessors and memories, the transport of data continues to be the bottleneck, motivating work on faster communication channels. Design of Integrated Circuits for Optical Communications, Second Edition deals with the design of high-speed integrated circuits for optical communication transceivers. Building upon a detailed understanding of optical devices, the book describes the analysis and design of critical building blocks, such as transimpedance and limiting amplifiers, laser drivers, phase-locked loops, oscillators, clock and data recovery circuits, and multiplexers. The Second Edition of this bestselling textbook has been fully updated with: A tutorial treatment of broadband circuits for both students and engineers New and unique information dealing with clock and data recovery circuits and multiplexers A chapter dedicated to burst-mode optical communications A detailed study of new circuit developments for optical transceivers An examination of recent implementations in CMOS technology This text is ideal for senior graduate students and engineers involved in high-speed circuit design for optical communications, as well as the more general field of wireline communications.
| Author | : Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems |
| Publisher | : National Academies Press |
| Total Pages | : 76 |
| Release | : 1997-12-15 |
| Genre | : Technology & Engineering |
| ISBN | : 0309591511 |
Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rival--perhaps surpass--the societal impact of integrated circuits.
| Author | : James K. Mitchell |
| Publisher | : |
| Total Pages | : 588 |
| Release | : 1993 |
| Genre | : Science |
| ISBN | : |
Explains the factors which determine and control the engineering properties of soils--particularly volume change, deformation, strength and permeability. New to this edition: expanded coverage of residual and tropical soils, environmental aspects of soil behavior, material on partly saturated soils, revised treatment of direct or coupled hydraulic, chemical, thermal and electrical flows through soil.
| Author | : Stephen D. Senturia |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 699 |
| Release | : 2005-12-20 |
| Genre | : Technology & Engineering |
| ISBN | : 0306476010 |
It is a real pleasure to write the Foreword for this book, both because I have known and respected its author for many years and because I expect this book’s publication will mark an important milestone in the continuing worldwide development of microsystems. By bringing together all aspects of microsystem design, it can be expected to facilitate the training of not only a new generation of engineers, but perhaps a whole new type of engineer – one capable of addressing the complex range of problems involved in reducing entire systems to the micro- and nano-domains. This book breaks down disciplinary barriers to set the stage for systems we do not even dream of today. Microsystems have a long history, dating back to the earliest days of mic- electronics. While integrated circuits developed in the early 1960s, a number of laboratories worked to use the same technology base to form integrated sensors. The idea was to reduce cost and perhaps put the sensors and circuits together on the same chip. By the late-60s, integrated MOS-photodiode arrays had been developed for visible imaging, and silicon etching was being used to create thin diaphragms that could convert pressure into an electrical signal. By 1970, selective anisotropic etching was being used for diaphragm formation, retaining a thick silicon rim to absorb package-induced stresses. Impurity- and electrochemically-based etch-stops soon emerged, and "bulk micromachining" came into its own.
