Wafer-Level Testing and Test During Burn-In for Integrated Circuits

Wafer-Level Testing and Test During Burn-In for Integrated Circuits
Author: Sudarshan Bahukudumbi
Publisher: Artech House
Total Pages: 198
Release: 2010
Genre: Technology & Engineering
ISBN: 1596939907

Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing. Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constraints. Moreover, this unique book helps practitioners address the issue of enabling next generation products with previous generation testers. Practitioners also find expert insights on current industry trends in WLTBI test solutions.

Handbook of Integrated Circuit Industry

Handbook of Integrated Circuit Industry
Author: Yangyuan Wang
Publisher: Springer Nature
Total Pages: 2006
Release: 2023-12-29
Genre: Technology & Engineering
ISBN: 9819928362

Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.

Wafer-Level Integrated Systems

Wafer-Level Integrated Systems
Author: Stuart K. Tewksbury
Publisher: Springer Science & Business Media
Total Pages: 456
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1461316251

From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie's) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit's area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term "wafer level" is perhaps more appropriate than "wafer-scale". A "wafer-level" monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.

Integrated Power Devices and TCAD Simulation

Integrated Power Devices and TCAD Simulation
Author: Yue Fu
Publisher: CRC Press
Total Pages: 366
Release: 2017-12-19
Genre: Technology & Engineering
ISBN: 1351831712

From power electronics to power integrated circuits (PICs), smart power technologies, devices, and beyond, Integrated Power Devices and TCAD Simulation provides a complete picture of the power management and semiconductor industry. An essential reference for power device engineering students and professionals, the book not only describes the physics inside integrated power semiconductor devices such lateral double-diffused metal oxide semiconductor field-effect transistors (LDMOSFETs), lateral insulated-gate bipolar transistors (LIGBTs), and super junction LDMOSFETs but also delivers a simple introduction to power management systems. Instead of abstract theoretical treatments and daunting equations, the text uses technology computer-aided design (TCAD) simulation examples to explain the design of integrated power semiconductor devices. It also explores next generation power devices such as gallium nitride power high electron mobility transistors (GaN power HEMTs). Including a virtual process flow for smart PIC technology as well as a hard-to-find technology development organization chart, Integrated Power Devices and TCAD Simulation gives students and junior engineers a head start in the field of power semiconductor devices while helping to fill the gap between power device engineering and power management systems.

Design of 3D Integrated Circuits and Systems

Design of 3D Integrated Circuits and Systems
Author: Rohit Sharma
Publisher: CRC Press
Total Pages: 328
Release: 2018-09-03
Genre: Technology & Engineering
ISBN: 1351831593

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Production Planning with Capacitated Resources and Congestion

Production Planning with Capacitated Resources and Congestion
Author: Hubert Missbauer
Publisher: Springer Nature
Total Pages: 289
Release: 2020-02-26
Genre: Business & Economics
ISBN: 107160354X

This book presents a comprehensive overview of recent developments in production planning. The monograph begins with an introductory chapter reviewing the need for these production planning models, that operate by determining time-phased releases of work into the facility or supply chain, relating these to the Manufacturing Planning and Control (MPC) and Advanced Planning and Scheduling (APS) frameworks, that form the basis of most academic research and industrial practice. The extensive body of work on Workload Control is also placed in this context, and proves the need for improved models with a discussion of the difficulties, these approaches encounter. The next two chapters present a detailed review of the state of the art in optimization models based on exogenous planned lead times, and examines the cases where these can take both integer and fractional values. The difficulties arising in estimating planned lead times are consistent with factory behavior which are highlighted, noting that many of these lead to non-convex optimization models. Attempts to address these difficulties by iterative multimodel approaches, that combine simulation and mathematical programming, are also discussed in detail. The next three chapters of the volume address the set of techniques developed using clearing functions, which represent the expected output of a resource in a planning period, as a function of the expected workload of the resource, during that period. The chapters on this subject propose a basic optimization model for multiple products, discuss the difficulties of this model and some possible solutions. It also reviews prior work, and discuss a number of alternative formulations of the clearing function concept with their respective advantages and disadvantages. Applications to lot sizing decisions and a number of other specific problems are also described. This volume concludes with an assessment of the state of the art described in the volume, and several directions for future work.

Proceedings

Proceedings
Author:
Publisher:
Total Pages: 136
Release: 1982
Genre: CAD/CAM systems
ISBN: