IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings].
Author | : |
Publisher | : |
Total Pages | : 504 |
Release | : 1997 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
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Author | : |
Publisher | : |
Total Pages | : 504 |
Release | : 1997 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Author | : |
Publisher | : |
Total Pages | : 479 |
Release | : 1999 |
Genre | : Electronic apparatus and appliances |
ISBN | : 9780780355026 |
Author | : Chee Kai Chua |
Publisher | : World Scientific |
Total Pages | : 384 |
Release | : 2021-05-14 |
Genre | : Technology & Engineering |
ISBN | : 9811218374 |
3D printed electronics have captured much attention in recent years, owing to their success in allowing on-demand fabrication of highly-customisable electronics on a wide variety of substrates and conformal surfaces. This textbook helps readers understand and gain valuable insights into 3D printed electronics. It does not require readers to have any prior knowledge on the subject.3D Printing and Additive Manufacturing of Electronics: Principles and Applications provides a comprehensive overview of the recent progress and discusses the fundamentals of the 3D printed electronics technologies, their respective advantages, shortcomings and potential applications. The book covers conventional contact printing techniques for printed electronics, 3D electronics printing techniques, materials and inks inks for 3D-printed electronics, substrates and processing for 3D-printed electronics, sintering techniques for metallic nanoparticle inks, designs and simulations, applications of 3D-printed electronics, and future trends. The book includes several related problems for the reader to test his or her understanding of the topics.This book is a good guide for anyone who is interested in the 3D printing of electronics. The book is also an effective textbook for undergraduate and graduate courses that aim to arm their students with a thorough understanding of the fundamentals of 3D printed electronics.Related Link(s)
Author | : IEEE, Components, Packaging and Manufacturing Technology Society Staff |
Publisher | : Institute of Electrical & Electronics Engineers(IEEE) |
Total Pages | : 494 |
Release | : 1999-10 |
Genre | : Ball grid array technology |
ISBN | : 9780780355026 |
Author | : Florin Pop |
Publisher | : Springer Nature |
Total Pages | : 300 |
Release | : 2021-09-28 |
Genre | : Computers |
ISBN | : 3030388360 |
This book provides a review of advanced topics relating to the theory, research, analysis and implementation in the context of big data platforms and their applications, with a focus on methods, techniques, and performance evaluation. The explosive growth in the volume, speed, and variety of data being produced every day requires a continuous increase in the processing speeds of servers and of entire network infrastructures, as well as new resource management models. This poses significant challenges (and provides striking development opportunities) for data intensive and high-performance computing, i.e., how to efficiently turn extremely large datasets into valuable information and meaningful knowledge. The task of context data management is further complicated by the variety of sources such data derives from, resulting in different data formats, with varying storage, transformation, delivery, and archiving requirements. At the same time rapid responses are needed for real-time applications. With the emergence of cloud infrastructures, achieving highly scalable data management in such contexts is a critical problem, as the overall application performance is highly dependent on the properties of the data management service.
Author | : Don Millard |
Publisher | : Institute of Electrical & Electronics Engineers(IEEE) |
Total Pages | : 504 |
Release | : 1997 |
Genre | : Ball grid array technology |
ISBN | : |
The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
Author | : Oded Maler |
Publisher | : Springer Science & Business Media |
Total Pages | : 569 |
Release | : 2003-03-18 |
Genre | : Computers |
ISBN | : 3540009132 |
This book constitues the refereed proceedings of the 6th International Workshop on Hybrid Systems: Computation and Control, HSCC 2003, held in Prague, Czech Republic, in April 2003. The 36 revised full papers presented were carefully reviewed and selected from 75 submissions. All current issues in hybrid systems are addressed including formal methods for analysis and control, computational tools, as well as innovative applications in various fields such as automotive control, the immune system, electrical circuits, operating systems, and human brains.
Author | : |
Publisher | : |
Total Pages | : 370 |
Release | : 2004 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Author | : Dimitrios A. Lamprou |
Publisher | : MDPI |
Total Pages | : 436 |
Release | : 2020-07-01 |
Genre | : Medical |
ISBN | : 3039364235 |
The 3D printing (3DP) process was patented in 1986; however, only in the last decade has it begun to be used for medical applications, as well as in the fields of prosthetics, bio-fabrication, and pharmaceutical printing. 3DP or additive manufacturing (AM) is a family of technologies that implement layer-by-layer processes in order to fabricate physical models based on a computer aided design (CAD) model. 3D printing permits the fabrication of high degrees of complexity with great reproducibility in a fast and cost-effective fashion. 3DP technology offers a new paradigm for the direct manufacture of individual dosage forms and has the potential to allow for variations in size and geometry as well as control dose and release behavior. Furthermore, the low cost and ease of use of 3DP systems means that the possibility of manufacturing medicines and medical devices at the point of dispensing or at the point of use could become a reality. 3DP thus offers the perfect innovative manufacturing route to address the critical capability gap that hinders the widespread exploitation of personalized medicines for molecules that are currently not easy to deliver. This Special Issue will address new developments in the area of 3D printing and bioprinting for drug delivery applications, covering the recent advantages and future directions of additive manufacturing for pharmaceutical products.
Author | : Freek Wiedijk |
Publisher | : Springer |
Total Pages | : 569 |
Release | : 2003-07-01 |
Genre | : Computers |
ISBN | : 354036580X |
This volume contains the proceedings of the Sixth Workshop on Hybrid Systems: Computation and Control (HSCC 2003), which was held in Prague, during April 3–5, 2003. The Hybrid Systems workshops attract researchers interested in the modeling, analysis, control, and implementation of systems which involve the interaction of both discrete and continuous state dynamics. The newest results and latest developments in hybrid system models, formal methods for analysis and control, computational tools, as well as new applications and examples are presented at these annual meetings. The Sixth Workshop continued the series of workshops held in Grenoble, France (HART’97), Berkeley, California, USA (HSCC’98), Nijmegen, The Neth- lands (HSCC’99), Pittsburgh, Pennsylvania, USA (HSCC 2000), Rome, Italy (HSCC 2001), and Stanford, California, USA (HSCC 2002). Proceedings of these workshops have been published by Springer-Verlag in the Lecture Notes in C- puter Science (LNCS) series. This year we assembled a technical program committee with a broad expertise in formal methods in computer science, control theory, applied mathematics, and arti?cial intelligence. We received a set of 75 high-quality submitted papers. After detailed review and discussion of these papers by the program committee, 36 papers were accepted for presentation at the workshop, and the ?nal versions of these papers appear in this volume.