Troubleshooting Electronic Assembly

Troubleshooting Electronic Assembly
Author: Phil Zarrow
Publisher: Pragma Media
Total Pages: 278
Release: 2020-02-27
Genre: Technology & Engineering
ISBN: 9781732283688

BoardTalk had its humble beginnings as a SMT expert Q&A session with Phil Zarrow and Jim Hall at an SMTAI conference. Ten years and over 200 episodes later, the "Assembly Brothers - Pick and Place" have transcribed their informative discussions from CircuitInsight.com, where BoardTalk is streamed all over the world.

Soldering in Electronics Assembly

Soldering in Electronics Assembly
Author: MIKE JUDD
Publisher: Elsevier
Total Pages: 385
Release: 1999-03-26
Genre: Technology & Engineering
ISBN: 008051734X

Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment

Optimizing Quality in Electronics Assembly: A Heretical Approach

Optimizing Quality in Electronics Assembly: A Heretical Approach
Author: James Allen Smith
Publisher: McGraw Hill Professional
Total Pages: 536
Release: 1997
Genre: Business & Economics
ISBN: 9780070592292

In a radical departure from the dozens of other quality books, this one makes the case that the traditional TQM procedures used in the electronics assembly field are not only ineffective-they contribute to many failures. The only book to focus exclusively on quality in electronics manufacturing-& to propose a measurable cost/benefit methodology-this provocative volume shows what's lacking in current quality programs, & how fresh approaches can yet avoid a quality "catastrophe" in the electronics industry. Along the way, numerous quality myths are exploded, hidden issues are confronted, & an array of electronics specific solutions are offered.

Information Control Problems in Manufacturing Technology 1989

Information Control Problems in Manufacturing Technology 1989
Author: E.A. Puente
Publisher: Elsevier
Total Pages: 711
Release: 2014-06-28
Genre: Technology & Engineering
ISBN: 1483298833

The Symposium presented and discussed the latest research on new theories and advanced applications of automatic systems, which are developed for manufacturing technology or are applicable to advanced manufacturing systems. The topics included computer integrated manufacturing, simulation and the increasingly important areas of artificial intelligence and expert systems, and applied them to the broad spectrum of problems that the modern manufacturing engineer is likely to encounter in the design and application of increasingly complex automatic systems.

Electronic Assembly Fabrication

Electronic Assembly Fabrication
Author: Charles A. Harper
Publisher: McGraw Hill Professional
Total Pages: 692
Release: 2002-04-10
Genre: Education
ISBN: 9780071378826

Printed circuit history and overview. Development and fabrication of IC chips. Packaging of IC chips. Printed circuit board fabrication.

ASSEMBLED PCB REPAIR & REWORK TECHNIQUES

ASSEMBLED PCB REPAIR & REWORK TECHNIQUES
Author: RATAN SENGUPTA
Publisher: Blue Rose Publishers
Total Pages: 70
Release: 2023-09-08
Genre: Education
ISBN:

Apart from physical damage, component failure is the most common reason why PCBs need repair and rework. Component failure may be the result of low-quality dislodging, or ageing of components. A bad PCB layout, however, is the most common cause. Power failure, overheated parts, and burned components may result from a poor design. PCB rework is the process of making changes to or fixing flaws on a printed circuit board after it has already been produced or assembled. This may require anything from changing components to cleaning up excess solder to fixing broken traces or pads. Circuit board rework is a crucial step in electronics production because it allows manufacturers to address any issues with their final products, before they reach the end user. In Electronics, defects leading to rework may include: Poor solder joints because of faulty assembly or thermal cycling. Solder bridges—unwanted drops of solder that connect points that should be isolated from each other. Faulty components. Engineering parts changes, upgrades, etc. Components broken due to natural wear, physical stress or excessive current. Components damaged due to liquid ingress, leading to corrosion, weak solder joints or physical damage. Surface mount technology (SMT) rework and through hole technology (THT) rework are the two most common forms of the printed circuit board (PCB) rework. Surface mount technology, or SMT, refers to small, flat components that are soldered directly onto the surface of a printer