1997 IEEE 13th Annual Semiconductor Thermal Measurement & Management Symposium

1997 IEEE 13th Annual Semiconductor Thermal Measurement & Management Symposium
Author: Institute of Electrical and Electronics Engineers
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Total Pages: 312
Release: 1997
Genre: Technology & Engineering
ISBN:

This volume features coverage of new developments in and applications relating to generation and removal of heat within semiconductor devices, and measurement of junction temperatures under various application and environmental conditions.

Solder Joint Reliability Prediction for Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments
Author: Andrew E. Perkins
Publisher: Springer Science & Business Media
Total Pages: 202
Release: 2008-12-16
Genre: Technology & Engineering
ISBN: 0387793941

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Investigation of Synthetic Jets Heat Transfer and Flow Field

Investigation of Synthetic Jets Heat Transfer and Flow Field
Author: Carlo Salvatore Greco
Publisher: Youcanprint
Total Pages: 187
Release: 2015-04-30
Genre: Technology & Engineering
ISBN: 8891187844

Synthetic jets are devices able to “synthetize” a jet from the ambient in which they are embedded through a simple membrane oscillation inside a cavity with an orifice. Such features make them high reliable, silent and easy to be miniaturized. For these reasons, they are widely investigated as electronic cooling devices. The present research is focused on the design and analysis of a different type of synthetic jet device compared to its single classical configuration. Such a device his experimentally characterized through the study of its free and impinging flow field and the evaluation of its heat transfer performance.

Antenna-in-Package Technology and Applications

Antenna-in-Package Technology and Applications
Author: Duixian Liu
Publisher: John Wiley & Sons
Total Pages: 492
Release: 2020-03-03
Genre: Technology & Engineering
ISBN: 1119556651

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.