Thin Films Stresses And Mechanical Properties X
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| Author | : Katayun Barmak |
| Publisher | : Woodhead Publishing |
| Total Pages | : 671 |
| Release | : 2014-02-13 |
| Genre | : Technology & Engineering |
| ISBN | : 085709629X |
Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties
| Author | : Sean G. Corcoran |
| Publisher | : |
| Total Pages | : 616 |
| Release | : 2004 |
| Genre | : Thin films |
| ISBN | : |
This work contains experimental, theoretical, and modeling research papers from a December 2003 symposium on the mechanical behavior of thin films, touching on topics in stress evolution, modeling stresses and film instability, deformation and adhesion, film fracture and fatigue, processing and structure, indentation testing, mechanical properties, properties and performance, and multilayers and nanolaminates. Some specific topics include fracture patterns in thin films and multilayers, thin film herringbone buckling patterns, the effect of oxygen on adhesion of thin copper films to silicon nitride, and the effects of stress amplitude on the fatigue of polysilicon. Annotation : 2004 Book News, Inc., Portland, OR (booknews.com)
| Author | : |
| Publisher | : |
| Total Pages | : 808 |
| Release | : 1993 |
| Genre | : Thin films |
| ISBN | : |
| Author | : William W. Gerberich |
| Publisher | : |
| Total Pages | : 576 |
| Release | : 1997 |
| Genre | : Technology & Engineering |
| ISBN | : |
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
| Author | : Devendra Gupta |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 552 |
| Release | : 2013-01-15 |
| Genre | : Science |
| ISBN | : 9780080947082 |
This new game book for understanding atoms at play aims to document diffusion processes and various other properties operative in advanced technological materials. Diffusion in functional organic chemicals, polymers, granular materials, complex oxides, metallic glasses, and quasi-crystals among other advanced materials is a highly interactive and synergic phenomenon. A large variety of atomic arrangements are possible. Each arrangement affects the performance of these advanced, polycrystalline multiphase materials used in photonics, MEMS, electronics, and other applications of current and developing interest. This book is written by pioneers in industry and academia for engineers, chemists, and physicists in industry and academia at the forefront of today's challenges in nanotechnology, surface science, materials science, and semiconductors.
| Author | : Richard Vinci |
| Publisher | : Mrs Proceedings |
| Total Pages | : 576 |
| Release | : 2000-09-25 |
| Genre | : Science |
| ISBN | : |
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
| Author | : Sean G. Corcoran |
| Publisher | : Cambridge University Press |
| Total Pages | : 606 |
| Release | : 2014-06-05 |
| Genre | : Technology & Engineering |
| ISBN | : 9781107409316 |
Understanding the mechanical behavior of thin films is crucial for a wide variety of technologies. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. However, the performance of these devices is often limited by the mechanical properties of both the films and the structures to which they are attached. The concepts, models and techniques developed for bulk materials often do not apply to small dimensions, and the mechanisms controlling behavior are not well defined. This book, first published in 2004, brings together an international group of researchers and students from industry, academia and national laboratories to address the mechanical behavior of thin films. Of particular interest are those studies that cut across length scales such as atomistic-to-nanometer or nanometer-to-submicron scale. Topics include: stress evolution; modeling stresses and film instability; deformation and adhesion; film fracture and fatigue; processing and structure; indentation testing; mechanical properties; properties and performance; and multilayers and nanolaminates.
| Author | : Stephen Timoshenko |
| Publisher | : |
| Total Pages | : 400 |
| Release | : 1962 |
| Genre | : Strength of materials |
| ISBN | : |
| Author | : L. B. Freund |
| Publisher | : Cambridge University Press |
| Total Pages | : 772 |
| Release | : 2004-01-08 |
| Genre | : Technology & Engineering |
| ISBN | : 9781139449823 |
Thin film mechanical behavior and stress presents a technological challenge for materials scientists, physicists and engineers. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation, surface evolution and allied effects in thin film materials. Physical phenomena are examined from the continuum down to the sub-microscopic length scales, with the connections between the structure of the material and its behavior described. Theoretical concepts are underpinned by discussions on experimental methodology and observations. Fundamental scientific concepts are embedded through sample calculations, a broad range of case studies with practical applications, thorough referencing, and end of chapter problems. With solutions to problems available on-line, this book will be essential for graduate courses on thin films and the classic reference for researchers in the field.
| Author | : Richard B. Hetnarski |
| Publisher | : Springer |
| Total Pages | : 0 |
| Release | : 2013-12-04 |
| Genre | : Science |
| ISBN | : 9789400727380 |
The Encyclopedia of Thermal Stresses is an important interdisciplinary reference work. In addition to topics on thermal stresses, it contains entries on related topics, such as the theory of elasticity, heat conduction, thermodynamics, appropriate topics on applied mathematics, and topics on numerical methods. The Encyclopedia is aimed at undergraduate and graduate students, researchers and engineers. It brings together well established knowledge and recently received results. All entries were prepared by leading experts from all over the world, and are presented in an easily accessible format. The work is lavishly illustrated, examples and applications are given where appropriate, ideas for further development abound, and the work will challenge many students and researchers to pursue new results of their own. This work can also serve as a one-stop resource for all who need succinct, concise, reliable and up to date information in short encyclopedic entries, while the extensive references will be of interest to those who need further information. For the coming decade, this is likely to remain the most extensive and authoritative work on Thermal Stresses.
