Thin Film Encapsulation Of High Frequency Mems Resonator For Rf Applications
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| Author | : Stepan Lucyszyn |
| Publisher | : Cambridge University Press |
| Total Pages | : 441 |
| Release | : 2010-08-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1139491660 |
An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation
| Author | : Joseph C. Doll |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 252 |
| Release | : 2013-10-30 |
| Genre | : Technology & Engineering |
| ISBN | : 1461485177 |
Piezoresistor Design and Applications provides an overview of these MEMS devices and related physics. The text demonstrates how MEMS allows miniaturization and integration of sensing as well as efficient packaging and signal conditioning. This text for engineers working in MEMS design describes the piezoresistive phenomenon and optimization in several applications. Includes detailed discussion of such topics as; coupled models of mechanics, materials and electronic behavior in a variety of common geometric implementations including strain gages, beam bending, and membrane loading. The text concludes with an up-to-date discussion of the need for integrated MEMS design and opportunities to leverage new materials, processes and MEMS technology. Piezoresistor Design and Applications is an ideal book for design engineers, process engineers and researchers.
| Author | : Nguyen Van Toan |
| Publisher | : CRC Press |
| Total Pages | : 159 |
| Release | : 2019-07-10 |
| Genre | : Technology & Engineering |
| ISBN | : 0429560990 |
Microfabricated resonators play an essential role in a variety of applications, including mass sensing, timing reference applications, and filtering applications. Many transduction mechanisms including piezoelectric, piezoresistive, and capacitive mechanisms, have been studied to induce and detect the motion of resonators. This book is meant to introduce and suggest several technological approaches together with design considerations for performance enhancement of capacitive silicon resonators, and will be useful for those working in field of micro and nanotechnology. Features Introduces and suggests several technological approaches together with design considerations for performance enhancement of capacitive silicon resonators Provides information on the various fabrication technologies and design considerations that can be employed to improve the performance capacitive silicon resonator which is one of the promising options to replace the quartz crystal resonator. Discusses several technological approaches including hermetic packaging based on the LTCC substrate, deep reactive ion etching, neutral beam etching technology, and metal-assisted chemical etching, as well as design considerations for mechanically coupled, selective vibration of high-order mode, movable electrode structures, and piezoresistive heat engines were investigated to achieve small motional resistance, low insertion loss, and high quality factor. Focusses on a capacitive sensing method based on the measurement of the change in capacitance between a sensing electrode and the resonant body. Reviews recent progress in performance enhancement methods for capacitive silicon resonator, which are mainly based on the works of the authors.
| Author | : Yufeng Jin |
| Publisher | : CRC Press |
| Total Pages | : 233 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1351832972 |
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
| Author | : |
| Publisher | : |
| Total Pages | : 256 |
| Release | : 2003 |
| Genre | : Electronic packaging |
| ISBN | : |
| Author | : Mahmood Aliofkhazraei |
| Publisher | : CRC Press |
| Total Pages | : 719 |
| Release | : 2016-04-27 |
| Genre | : Science |
| ISBN | : 1466591323 |
Discover the Unique Electron Transport Properties of GrapheneThe Graphene Science Handbook is a six-volume set that describes graphene's special structural, electrical, and chemical properties. The book considers how these properties can be used in different applications (including the development of batteries, fuel cells, photovoltaic cells, and s
| Author | : Mahmood Aliofkhazraei |
| Publisher | : CRC Press |
| Total Pages | : 3491 |
| Release | : 2016-04-26 |
| Genre | : Science |
| ISBN | : 1466591196 |
Graphene is the strongest material ever studied and can be an efficient substitute for silicon. This six-volume handbook focuses on fabrication methods, nanostructure and atomic arrangement, electrical and optical properties, mechanical and chemical properties, size-dependent properties, and applications and industrialization. There is no other major reference work of this scope on the topic of graphene, which is one of the most researched materials of the twenty-first century. The set includes contributions from top researchers in the field and a foreword written by two Nobel laureates in physics.
| Author | : Yung-cheng Lee |
| Publisher | : World Scientific |
| Total Pages | : 363 |
| Release | : 2018-01-03 |
| Genre | : Technology & Engineering |
| ISBN | : 9813229373 |
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
| Author | : Shekhar Bhansali |
| Publisher | : Elsevier |
| Total Pages | : 511 |
| Release | : 2012-07-18 |
| Genre | : Technology & Engineering |
| ISBN | : 0857096273 |
The application of Micro Electro Mechanical Systems (MEMS) in the biomedical field is leading to a new generation of medical devices. MEMS for biomedical applications reviews the wealth of recent research on fabrication technologies and applications of this exciting technology.The book is divided into four parts: Part one introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms. Part two describes applications of MEMS for biomedical sensing and diagnostic applications. MEMS for in vivo sensing and electrical impedance spectroscopy are investigated, along with ultrasonic transducers, and lab-on-chip devices. MEMS for tissue engineering and clinical applications are the focus of part three, which considers cell culture and tissue scaffolding devices, BioMEMS for drug delivery and minimally invasive medical procedures. Finally, part four reviews emerging biomedical applications of MEMS, from implantable neuroprobes and ocular implants to cellular microinjection and hybrid MEMS.With its distinguished editors and international team of expert contributors, MEMS for biomedical applications provides an authoritative review for scientists and manufacturers involved in the design and development of medical devices as well as clinicians using this important technology. - Reviews the wealth of recent research on fabrication technologies and applications of Micro Electro Mechanical Systems (MEMS) in the biomedical field - Introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms - Considers MEMS for biomedical sensing and diagnostic applications, along with MEMS for in vivo sensing and electrical impedance spectroscopy
| Author | : Indian Institute of Science, Bangalore |
| Publisher | : |
| Total Pages | : 472 |
| Release | : 2007 |
| Genre | : Science |
| ISBN | : |
