Evaluation Findings of Bondade CU-31 Bonding Solution

Evaluation Findings of Bondade CU-31 Bonding Solution
Author: Highway Innovative Technology Evaluation Center (U.S.)
Publisher: ASCE Publications
Total Pages: 64
Release: 1998-01-01
Genre: Technology & Engineering
ISBN: 9780784474471

Prepared by the Highway Innovative Technology Evaluation Center (HITEC), a CERF Service Center. The report describes a HITEC evaluation of Bondade CU-31 Bonding Solution, manufactured by Transpo Industries. The reportØdescribes a three-year program of field testing and evaluation designed to determine the effectiveness of Bondade CU-31 in extending the service life of pothole repairs.