Thermally-Aware Design

Thermally-Aware Design
Author: Yong Zhan
Publisher: Now Publishers Inc
Total Pages: 131
Release: 2008
Genre: Integrated circuits
ISBN: 1601981708

Provides an overview of analysis and optimization techniques for thermally-aware chip design.

Processor and System-on-Chip Simulation

Processor and System-on-Chip Simulation
Author: Rainer Leupers
Publisher: Springer Science & Business Media
Total Pages: 343
Release: 2010-09-15
Genre: Technology & Engineering
ISBN: 1441961755

Simulation of computer architectures has made rapid progress recently. The primary application areas are hardware/software performance estimation and optimization as well as functional and timing verification. Recent, innovative technologies such as retargetable simulator generation, dynamic binary translation, or sampling simulation have enabled widespread use of processor and system-on-chip (SoC) simulation tools in the semiconductor and embedded system industries. Simultaneously, processor and SoC simulation is still a very active research area, e.g. what amounts to higher simulation speed, flexibility, and accuracy/speed trade-offs. This book presents and discusses the principle technologies and state-of-the-art in high-level hardware architecture simulation, both at the processor and the system-on-chip level.

Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set)

Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set)
Author:
Publisher: World Scientific
Total Pages: 1397
Release: 2014-10-23
Genre: Technology & Engineering
ISBN: 9814520241

remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Theory and Practice of Thermal Transient Testing of Electronic Components

Theory and Practice of Thermal Transient Testing of Electronic Components
Author: Marta Rencz
Publisher: Springer Nature
Total Pages: 389
Release: 2023-01-23
Genre: Technology & Engineering
ISBN: 3030861740

This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.

On-Chip Communication Architectures

On-Chip Communication Architectures
Author: Sudeep Pasricha
Publisher: Morgan Kaufmann
Total Pages: 541
Release: 2010-07-28
Genre: Technology & Engineering
ISBN: 0080558283

Over the past decade, system-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. Improvements in process technology have effectively shrunk board-level components so they can be integrated on a single chip. New on-chip communication architectures have been designed to support all inter-component communication in a SoC design. These communication architecture fabrics have a critical impact on the power consumption, performance, cost and design cycle time of modern SoC designs. As application complexity strains the communication backbone of SoC designs, academic and industrial R&D efforts and dollars are increasingly focused on communication architecture design. On-Chip Communication Architecures is a comprehensive reference on concepts, research and trends in on-chip communication architecture design. It will provide readers with a comprehensive survey, not available elsewhere, of all current standards for on-chip communication architectures. - A definitive guide to on-chip communication architectures, explaining key concepts, surveying research efforts and predicting future trends - Detailed analysis of all popular standards for on-chip communication architectures - Comprehensive survey of all research on communication architectures, covering a wide range of topics relevant to this area, spanning the past several years, and up to date with the most current research efforts - Future trends that with have a significant impact on research and design of communication architectures over the next several years

Three-dimensional Integrated Circuit Design

Three-dimensional Integrated Circuit Design
Author: Vasilis F. Pavlidis
Publisher: Morgan Kaufmann
Total Pages: 324
Release: 2010-07-28
Genre: Technology & Engineering
ISBN: 0080921868

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits. Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find Focuses on design issues key to the product development cycle...good design plays a major role in exploiting the implementation flexibilities offered in the 3-D Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits

VLSI 2010 Annual Symposium

VLSI 2010 Annual Symposium
Author: Nikolaos Voros
Publisher: Springer Science & Business Media
Total Pages: 341
Release: 2011-09-08
Genre: Technology & Engineering
ISBN: 9400714882

VLSI 2010 Annual Symposium will present extended versions of the best papers presented in ISVLSI 2010 conference. The areas covered by the papers will include among others: Emerging Trends in VLSI, Nanoelectronics, Molecular, Biological and Quantum Computing. MEMS, VLSI Circuits and Systems, Field-programmable and Reconfigurable Systems, System Level Design, System-on-a-Chip Design, Application-Specific Low Power, VLSI System Design, System Issues in Complexity, Low Power, Heat Dissipation, Power Awareness in VLSI Design, Test and Verification, Mixed-Signal Design and Analysis, Electrical/Packaging Co-Design, Physical Design, Intellectual property creating and sharing.

Thermal Issues in Testing of Advanced Systems on Chip

Thermal Issues in Testing of Advanced Systems on Chip
Author: Nima Aghaee Ghaleshahi
Publisher: Linköping University Electronic Press
Total Pages: 219
Release: 2015-09-23
Genre:
ISBN: 9176859495

Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. Such very large scale integration is enabled by a core-based design paradigm as well as deep-submicron and 3D-stacked-IC technologies. These technologies are susceptible to reliability and testing complications caused by thermal issues. Three crucial thermal issues related to temperature variations, temperature gradients, and temperature cycling are addressed in this thesis. Existing test scheduling techniques rely on temperature simulations to generate schedules that meet thermal constraints such as overheating prevention. The difference between the simulated temperatures and the actual temperatures is called temperature error. This error, for past technologies, is negligible. However, advanced SoCs experience large errors due to large process variations. Such large errors have costly consequences, such as overheating, and must be taken care of. This thesis presents an adaptive approach to generate test schedules that handle such temperature errors. Advanced SoCs manufactured as 3D stacked ICs experience large temperature gradients. Temperature gradients accelerate certain early-life defect mechanisms. These mechanisms can be artificially accelerated using gradient-based, burn-in like, operations so that the defects are detected before shipping. Moreover, temperature gradients exacerbate some delay-related defects. In order to detect such defects, testing must be performed when appropriate temperature-gradients are enforced. A schedule-based technique that enforces the temperature-gradients for burn-in like operations is proposed in this thesis. This technique is further developed to support testing for delay-related defects while appropriate gradients are enforced. The last thermal issue addressed by this thesis is related to temperature cycling. Temperature cycling test procedures are usually applied to safety-critical applications to detect cycling-related early-life failures. Such failures affect advanced SoCs, particularly through-silicon-via structures in 3D-stacked-ICs. An efficient schedule-based cycling-test technique that combines cycling acceleration with testing is proposed in this thesis. The proposed technique fits into existing 3D testing procedures and does not require temperature chambers. Therefore, the overall cycling acceleration and testing cost can be drastically reduced. All the proposed techniques have been implemented and evaluated with extensive experiments based on ITC’02 benchmarks as well as a number of 3D stacked ICs. Experiments show that the proposed techniques work effectively and reduce the costs, in particular the costs related to addressing thermal issues and early-life failures. We have also developed a fast temperature simulation technique based on a closed-form solution for the temperature equations. Experiments demonstrate that the proposed simulation technique reduces the schedule generation time by more than half.

Nano-Tera.ch

Nano-Tera.ch
Author: Anil Leblebici
Publisher: Springer
Total Pages: 232
Release: 2018-12-24
Genre: Technology & Engineering
ISBN: 3319991094

This book presents the overall vision and research outcomes of Nano-Tera.ch, which is a landmark Swiss federal program to advance engineering system and device technologies with applications to Health and the Environment, including smart Energy generation and consumption. The authors discuss this unprecedented nation-wide program, with a lifetime of almost 10 years and a public funding of more than 120 MCHF, which helped to position Switzerland at the forefront of the research on multi-scale engineering of complex systems and networks, and strongly impacted the Swiss landscape in Engineering Sciences.