Thermal Management For Led Applications
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| Author | : Clemens J.M. Lasance |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 550 |
| Release | : 2013-09-17 |
| Genre | : Technology & Engineering |
| ISBN | : 1461450918 |
Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
| Author | : Xiaobing Luo |
| Publisher | : John Wiley & Sons |
| Total Pages | : 373 |
| Release | : 2024-05-29 |
| Genre | : Technology & Engineering |
| ISBN | : 1119179297 |
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
| Author | : Advanced Thermal Solutions |
| Publisher | : Advanced Thermal Solutions |
| Total Pages | : 206 |
| Release | : 2008 |
| Genre | : Science |
| ISBN | : 0984627901 |
The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
| Author | : |
| Publisher | : Advanced Thermal Solutions |
| Total Pages | : 186 |
| Release | : |
| Genre | : |
| ISBN | : 061523660X |
| Author | : Shen Liu |
| Publisher | : John Wiley & Sons |
| Total Pages | : 375 |
| Release | : 2011-07-05 |
| Genre | : Technology & Engineering |
| ISBN | : 0470828404 |
Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. One of the only books to cover LEDs from package design to manufacturing to testing Focuses on the design of LED packaging and its applications such as road lights Includes design methods and experiences necessary for LED engineers, especially optical and thermal design Introduces novel LED packaging structures and manufacturing processes, such as ASLP Covers reliability considerations, the most challenging problem for the LED industry Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures Codes and demonstrations available from the book’s Companion Website This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at www.wiley.com/go/liu/led
| Author | : Xingcun Colin Tong |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 633 |
| Release | : 2011-01-05 |
| Genre | : Technology & Engineering |
| ISBN | : 1441977597 |
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
| Author | : Márta Rencz |
| Publisher | : MDPI |
| Total Pages | : 310 |
| Release | : 2021-01-12 |
| Genre | : Technology & Engineering |
| ISBN | : 303943831X |
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
| Author | : Vinod Kumar Khanna |
| Publisher | : CRC Press |
| Total Pages | : 606 |
| Release | : 2014-06-03 |
| Genre | : Technology & Engineering |
| ISBN | : 1466561092 |
Compared to traditional electrical filaments, arc lamps, and fluorescent lamps, solid-state lighting offers higher efficiency, reliability, and environmentally friendly technology. LED / solid-state lighting is poised to take over conventional lighting due to cost savings—there is pretty much no debate about this. In response to the recent activity in this field, Fundamentals of Solid-State Lighting: LEDs, OLEDs, and Their Applications in Illumination and Displays covers a range of solid-state devices, technologies, and materials used for lighting and displays. It also examines auxiliary but critical requirements of efficient applications, such as modeling, thermal management, reliability, and smart lighting. The book discusses performance metrics of LEDs such as efficiency, efficacy, current–voltage characteristics, optical parameters like spectral distribution, color temperature, and beam angle before moving on to luminescence theory, injection luminescence, radiative and non-radiative recombination mechanisms, recombination rates, carrier lifetimes, and related topics. This lays down the groundwork for understanding LED operation. The book then discusses energy gaps, light emission, semiconductor material, special equipment, and laboratory facilities. It also covers production and applications of high-brightness LEDs (HBLEDs) and organic LEDs (OLEDs). LEDs represent the landmark development in lighting since the invention of electric lighting, allowing us to create unique, low-energy lighting solutions, not to talk about their minor maintenance expenses. The rapid strides of LED lighting technology over the last few years have changed the dynamics of the global lighting market, and LEDs are expected to be the mainstream light source in the near future. In a nutshell, the book traces the advances in LEDs, OLEDs, and their applications, and presents an up-to-date and analytical perspective of the scenario for audiences of different backgrounds and interests.
| Author | : Willem Dirk van Driel |
| Publisher | : Springer |
| Total Pages | : 603 |
| Release | : 2017-07-11 |
| Genre | : Technology & Engineering |
| ISBN | : 3319581759 |
In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.
| Author | : Luruthudass Annaniah |
| Publisher | : John Wiley & Sons |
| Total Pages | : 181 |
| Release | : 2023-07-04 |
| Genre | : Technology & Engineering |
| ISBN | : 3527831681 |
LED Packaging Technologies Up-to-date practitioner’s guide on LED packaging technologies, with application examples from relevant industries, historical insight, and outlook LED Packaging Technologies provides expert insight into current and future trends in LED packaging technologies, discussing the fundamentals of LED packaging technologies, from electrical contact design, thermal management and optical emission, and extraction, to manufacturing technologies, including the JEDEC testing standards, followed by accounts on the main applications of these LED packages in the automotive, consumer electronics, and lighting industries. LED Packaging Technologies includes information on: History of primitive lighting in human civilization to the invention of modern LEDs based lighting, and historic evolution of LED packaging technology Basic light emission and extraction technology in LED packages, covering package design impacting light emission and extraction Medical industry applications of LEDs, especially in healthcare treatments, such as in skin rejuvenation and wound healing and closures Quantum confinement phenomena and size-dependent optical properties of quantum dots, and the advancement of future quantum dot LEDs Covering the fundamentals, design, and manufacturing of LED packaging technology and assisting in removing some of the barriers in the development of LED packaging and new applications, LED Packaging Technologies is an essential source of information for engineers in the LED and lighting industries, as well as researchers in academia.
