Thermal Design Guideline For Electronic Equipment
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Author | : Ralph Remsburg |
Publisher | : CRC Press |
Total Pages | : 440 |
Release | : 2017-12-19 |
Genre | : Technology & Engineering |
ISBN | : 1351835912 |
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Author | : Xingcun Colin Tong |
Publisher | : Springer Science & Business Media |
Total Pages | : 633 |
Release | : 2011-01-05 |
Genre | : Technology & Engineering |
ISBN | : 1441977597 |
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author | : Ralph Remsburg |
Publisher | : Springer Science & Business Media |
Total Pages | : 618 |
Release | : 2011-06-27 |
Genre | : Technology & Engineering |
ISBN | : 1441985093 |
The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.
Author | : R. K. Shah |
Publisher | : CRC Press |
Total Pages | : 1104 |
Release | : 1988-07-01 |
Genre | : Science |
ISBN | : 9780891167297 |
Author | : Ralph Remsburg |
Publisher | : Springer Science & Business Media |
Total Pages | : 632 |
Release | : 1998-02-28 |
Genre | : Computers |
ISBN | : 9780412122712 |
With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.
Author | : |
Publisher | : |
Total Pages | : 480 |
Release | : 1984 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Author | : Eugene R. Hnatek |
Publisher | : CRC Press |
Total Pages | : 472 |
Release | : 2002-10-25 |
Genre | : Technology & Engineering |
ISBN | : 9780203909089 |
Examining numerous examples of highly sensitive products, this book reviews basic reliability mathematics, describes robust design practices, and discusses the process of selecting suppliers and components. He focuses on the specific issues of thermal management, electrostatic discharge, electromagnetic compatibility, printed wiring assembly, environmental stress testing, and failure analysis. The book presents methods for meeting the reliability goals established for the manufacture of electronic product hardware and addresses the development of reliable software. The appendix provides example guidelines for the derating of electrical and electromechanical components.
Author | : F. Patrick McCluskey |
Publisher | : CRC Press |
Total Pages | : 354 |
Release | : 1996-12-13 |
Genre | : Technology & Engineering |
ISBN | : 9780849396236 |
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Author | : Adrian Bejan |
Publisher | : John Wiley & Sons |
Total Pages | : 562 |
Release | : 1995-12-12 |
Genre | : Technology & Engineering |
ISBN | : 9780471584674 |
A comprehensive and rigorous introduction to thermal system designfrom a contemporary perspective Thermal Design and Optimization offers readers a lucid introductionto the latest methodologies for the design of thermal systems andemphasizes engineering economics, system simulation, andoptimization methods. The methods of exergy analysis, entropygeneration minimization, and thermoeconomics are incorporated in anevolutionary manner. This book is one of the few sources available that addresses therecommendations of the Accreditation Board for Engineering andTechnology for new courses in design engineering. Intended forclassroom use as well as self-study, the text provides a review offundamental concepts, extensive reference lists, end-of-chapterproblem sets, helpful appendices, and a comprehensive case studythat is followed throughout the text. Contents include: * Introduction to Thermal System Design * Thermodynamics, Modeling, and Design Analysis * Exergy Analysis * Heat Transfer, Modeling, and Design Analysis * Applications with Heat and Fluid Flow * Applications with Thermodynamics and Heat and Fluid Flow * Economic Analysis * Thermoeconomic Analysis and Evaluation * Thermoeconomic Optimization Thermal Design and Optimization offers engineering students,practicing engineers, and technical managers a comprehensive andrigorous introduction to thermal system design and optimizationfrom a distinctly contemporary perspective. Unlike traditionalbooks that are largely oriented toward design analysis andcomponents, this forward-thinking book aligns itself with anincreasing number of active designers who believe that moreeffective, system-oriented design methods are needed. Thermal Design and Optimization offers a lucid presentation ofthermodynamics, heat transfer, and fluid mechanics as they areapplied to the design of thermal systems. This book broadens thescope of engineering design by placing a strong emphasis onengineering economics, system simulation, and optimizationtechniques. Opening with a concise review of fundamentals, itdevelops design methods within a framework of industrialapplications that gradually increase in complexity. Theseapplications include, among others, power generation by large andsmall systems, and cryogenic systems for the manufacturing,chemical, and food processing industries. This unique book draws on the best contemporary thinking aboutdesign and design methodology, including discussions of concurrentdesign and quality function deployment. Recent developments basedon the second law of thermodynamics are also included, especiallythe use of exergy analysis, entropy generation minimization, andthermoeconomics. To demonstrate the application of important designprinciples introduced, a single case study involving the design ofa cogeneration system is followed throughout the book. In addition, Thermal Design and Optimization is one of the best newsources available for meeting the recommendations of theAccreditation Board for Engineering and Technology for more designemphasis in engineering curricula. Supported by extensive reference lists, end-of-chapter problemsets, and helpful appendices, this is a superb text for both theclassroom and self-study, and for use in industrial design,development, and research. A detailed solutions manual is availablefrom the publisher.
Author | : NAVSEC (Organization : U.S.). Technical Support Branch |
Publisher | : |
Total Pages | : 928 |
Release | : 1972 |
Genre | : Electronic apparatus and appliances |
ISBN | : |